Film / Sheet Electrical and Electronic Resins
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Form / Shape: Sheet or Film; Liquid; Foam
- Industry: Semiconductors, IC's; Electronics
- Use: Gap Filler, Foam in Place Gasket
- Features: EMI/RFI Shielding; Thermally Conductive
from MacDermid Alpha Electronics Solutions
Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper. Product Overview. The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask, dry film, and liquid photoresist adhesion on copper. By eliminating pumice and brush... [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's; Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
Designed as battery pack thermal runaway protection(thermal propagation) material, SF-C is a fiberglass or PET carrier ceramifiable (ceramifying) silicone rubber composite sheet. Like ordinary rubber, silicone rubber and thermoplastic elastomer, it has not only good insulation and elasticity, but... [See More]
- Form / Shape: Sheet or Film
- Industry: Electronics
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]
- Form / Shape: Sheet or Film; Pellets
- Cure / Technology: Thermoset
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
With a glass transition temperature exceeding 180 °C, UV25 offers impressive thermal stability over the broad service temperature range of -60 °F to +500 °F. This one part, fast curing, moderate viscosity UV curable system bonds well to glass, surface treated metals, plastics such as... [See More]
- Form / Shape: Sheet or Film; Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Impregnating Resin
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Henkel Corporation - Electronics
ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot " devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages. [See More]
- Form / Shape: Sheet or Film
- Features: Electrically Conductive
- Industry: Electronics
- Thermal Conductivity: 1
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Form / Shape: Sheet or Film
- Industry: Electronics; Electric Power
- Chemical System: Flexible Graphite Material
- Features: Thermally Conductive
from Indium Corporation
NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Indium Corporation
Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Graphite
- Features: Thermally Conductive
from Indium Corporation
Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Graphite, Copper, Acrylic
- Features: Thermally Conductive
from Indium Corporation
Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Form / Shape: Sheet or Film
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Use: Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Form / Shape: Sheet or Film; Ribbon
- Industry: Semiconductors, IC's
- Cure / Technology: Solder
- Features: Thermally Conductive