Film / Sheet Electrical and Electronic Resins

4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36
from Master Bond, Inc.

Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]

  • Form / Shape: Sheet or Film; Pellets
  • Cure / Technology: Thermoset
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Bundle Kit 40 Microns x .5 Inch Squares -- NanoFoil®
from Indium Corporation

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing, Coating and Casting -- UV25
from Master Bond, Inc.

With a glass transition temperature exceeding 180 °C, UV25 offers impressive thermal stability over the broad service temperature range of -60 °F to +500 °F. This one part, fast curing, moderate viscosity UV curable system bonds well to glass, surface treated metals, plastics such as... [See More]

  • Form / Shape: Sheet or Film; Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Impregnating Resin
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Indium Thermal Interface Materials (TIM)
from Indium Corporation

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Solder Thermal Interface Materials
from Indium Corporation

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: .5 Inch Squares - Qty 100 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1 Inch Squares: Qty 50 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1.5 Inch Squares - Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 2 Inch Squares: Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Form / Shape: Sheet or Film
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Form / Shape: Sheet or Film; Ribbon
  • Industry: Semiconductors, IC's
  • Cure / Technology: Solder
  • Features: Thermally Conductive
ABLESTIK ABLEFILM ECF563 -- 8799581700097
from Henkel Corporation - Electronics

ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot " devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages. [See More]

  • Form / Shape: Sheet or Film
  • Features: Electrically Conductive
  • Industry: Electronics
  • Thermal Conductivity: 1