Flame Retardant (e.g. UL 94 Rated) Electrical and Electronic Resins

ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Flame Retardant; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus standards
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals Flame Retardant Potting Epoxy 375ml -- MGEP00013
from Techsil Limited

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Airbus Standards
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
MG Chemicals FR Low Viscosity Potting Epoxy 375ml -- MGEP00016
from Techsil Limited

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit -- MOSI17211
from Techsil Limited

Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]

  • Features: Flame Retardant; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR
from Master Bond, Inc.

Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; FAR Standard 14 CFR 25.853(a)
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Momentive TSE3941 Flame Retardant Silicone 150ml -- MOSI01253
from Techsil Limited

TSE3941 is a flame retardant silicone adhesive sealant from Momentive Performance Materials, designed for electrical and electronic applications. This non-flowable, one-component RTV forms a soft elastic silicone rubber which is non-corrosive to metallic substrates. Product Benefits. High thermal... [See More]

  • Features: Flame Retardant
  • Industry: Electronics; Electric Power
  • Chemical System: Silicone
  • Use Temperature: -55 to 200
Toughened, One Component, Thermally Resistant Epoxy -- EP17
from Master Bond, Inc.

Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at a minimum temperature of 300 °F to 350 °F for 60-90 minutes. Post curing for 1... [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Features: Flame Retardant; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Two Component Flame Retardant FAR Approved Epoxy Adhesive -- EP90FR-V
from Master Bond, Inc.

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it... [See More]

  • Features: High Dielectric; Flame Retardant; Thermal Insulation
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Two Component Toughened Epoxy Adhesive -- EP126
from Master Bond, Inc.

Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500 °F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand temperatures as... [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Features: High Dielectric; Flame Retardant
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Features: Flame Retardant; Optical
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Silicone
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Features: High Dielectric; Flame Retardant; Thermal Insulation; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
TECHNOMELT PA 638 -- 8802586492929
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Features: Flame Retardant; UL Rating
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
Epoxy Potting Compound -- 20-3205
from Epoxies Etc...

20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties. [See More]

  • Features: High Dielectric; Flame Retardant
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Features: High Dielectric; Flame Retardant
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Electrically Conductive; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Gel
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
TECHNOMELT PA 652 -- 8799377391617
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Firestop Putty Tube -- SSP100
from Acoustical Solutions, Inc.

SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]

  • Features: Flame Retardant; UL Rating
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Features: Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Gel
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
TECHNOMELT PA 668 -- 8805825445889
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating; UV resistant
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Features: Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4242/4243
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Features: High Dielectric; Flame Retardant
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset