Pellets / Solid Form Electrical and Electronic Resins

Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Form / Shape: Pellets
  • Industry: Electronics
  • Chemical System: PFA
  • Tensile (Break): 5221
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36
from Master Bond, Inc.

Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]

  • Form / Shape: Sheet or Film; Pellets
  • Cure / Technology: Thermoset
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Polyurethane Hot Melt -- KHB8636
from Chemence Inc.

Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyurethane
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyolefin
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt
Silicone Resin Powder -- SILRES® H 44
from Wacker Chemical Corp.

SILRES ® H44 is a powdered silicone resin with excellent solubility in various organic solvents and good compatibility with organic resins. Special features. solvent-free, solid phenylmethyl polysiloxane resin. high solubility in organic solvents. fast curing in the presence of catalysts. [See More]

  • Form / Shape: Pellets
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Industry: Photonics; Electronics
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyamide
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyamide
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyamide
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyolefin
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Shape: Pellets
  • Chemical System: Polyamide
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoplastic / Hot Melt