Epoxy (EP) Electrical and Electronic Resins
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Chemical System: Epoxy
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Dongguan Sheen Electronic Technology Co., Ltd.
3611B-09 Patch SMT red glue is a one-component,high-temperature, fast-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards.Safe to use and meet environmental requirements. [See More]
- Chemical System: Epoxy
- Industry: Electronics
from MacDermid Alpha Electronics Solutions
Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview. ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry. It offers a cost-effective... [See More]
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Electronics
- Use: Encapsulant, Potting Compound
- Composition: Two Component
from RS Components, Ltd.
MG Chemicals thinner 2 4352 - 1L [See More]
- Chemical System: Acrylic; Epoxy; Thermoplastic Polyester (PET, PBT, etc.); Acrylic, alkyd, cellulose acetate butyrate, epoxy, nitrocellulose, polyester resin
- Form / Shape: Liquid; Tin
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Chemical System: Epoxy
- Form / Shape: 20 gm
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Chemical System: Epoxy
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Chemical System: Epoxy
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: 10 ml
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Chemical System: Epoxy; Polyphenylene Sulfide
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: TUFFBOND 395, LT AMBER, 300 ML CARTRIDGE
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Use: Encapsulant or Conformal Coating
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Chemical System: Epoxy
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Tuffbond ® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system. [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: 50 ml (two component)
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics; Electric Power
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Hernon Manufacturing, Inc.
Tuffbond ® 326 is a two-component epoxy known for its low-viscosity, toughness, and long working life at ambient temperatures with shortened cure times at elevated temperatures. The resin offers a combination of high shear strength and hardness. Often used for potting, this epoxy creates a... [See More]
- Chemical System: Epoxy
- Industry: Electronics; Electric Power
- Form / Shape: 5 gal
- Composition: Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Liquid
- Composition: Two Component ; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Powder
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling performance, with... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Heat Curing
- Viscosity: 3500 to 7000
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Use: Die Bonding Adhesives
- Industry: Electronics
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Henkel Corporation - Electronics
HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching leads to coils. [See More]
- Chemical System: Epoxy
- Composition: Single Component
- Industry: Electronics
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Liquid
- Industry: Electronics; Electric Power
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Electric Power
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Anaerobic
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]
- Chemical System: Epoxy
- Form / Shape: Syringe/Cartridge
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Chemical System: Epoxy; Silicone
- Industry: Semiconductors, IC's
- Cure / Technology: Heat curing
- Features: Electrically Conductive
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Chemical System: Epoxy
- Form / Shape: Paste
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Chemical System: Epoxy
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Option of one or two component
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Composition: Two Component
from Techsil Limited
MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Use: Encapsulant, Potting Compound
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Use: Die Bonding Adhesives
- Industry: Electronics
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It protects against static... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Chemical System: Epoxy
- Form / Shape: Gel
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Techsil Limited
MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Use: Encapsulant, Potting Compound
- Features: Flame Retardant
from Epoxies Etc...
UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Use: Encapsulant, Potting Compound
- Features: Flame Retardant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and impact... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Use: Encapsulant, Potting Compound
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Industry: Electronics; Electric Power
from Techsil Limited
MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Use: Encapsulant, Potting Compound
from Techsil Limited
MG 832WC is a general purpose, water clear potting and encapsulation compound which offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where high clarity is required; it will not yellow when... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from Techsil Limited
Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Techsil Limited
Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Techsil Limited
Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive