Liquid Electrical and Electronic Resins
from RS Components, Ltd.
Structutal acrylic adhesive DP8405 45ml [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: Electronics
- Chemical System: Acrylic
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Form / Shape: Sheet or Film; Liquid; Foam
- Industry: Semiconductors, IC's; Electronics
- Use: Gap Filler, Foam in Place Gasket
- Features: EMI/RFI Shielding; Thermally Conductive
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Form / Shape: Liquid
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Form / Shape: Liquid
- Chemical System: Acrylated Urethane
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
from RS Components, Ltd.
Protective conformal coating 400ml [See More]
- Form / Shape: Liquid; Aerosol
- Chemical System: Acrylic; Acrylic Resin
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from ELANTAS North America LLC
ELAN-Guard ® UPM 23 is a breakthrough polyester emulsion engineered to meet the demands of today ’s electrical insulation manufacturers. With ultra-low VOCs, exceptional dielectric strength, and easy handling properties, it delivers high-performance coil protection while helping operations... [See More]
- Form / Shape: Liquid
- Chemical System: Alkyd
- Use: Impregnating Resin
- Cure / Technology: Thermoset
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Form / Shape: Liquid
- Chemical System: Acrylated Urethane
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Reactive or Moisture Cured; UV or Radiation Cured
from RS Components, Ltd.
Ambersil Acrylic Conformal Coating 400ml [See More]
- Form / Shape: Liquid; Aerosol
- Chemical System: Acrylic; Acrylic Resin
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Form / Shape: Liquid
- Chemical System: UV Curing
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Cure / Technology: UV or Radiation Cured; Dual Curing
from RS Components, Ltd.
MG Super Shield Nickel conduct coating [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Nickel
- Use Temperature: -40 to 248
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Cure / Technology: Thermoset
- Composition: Single Component; Unfilled
from RS Components, Ltd.
MG Super Shield Silver coated copper [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Acrylic; Acrylic
- Use Temperature: -40 to 248
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from RS Components, Ltd.
Graphit 33, 200ml [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Graphite
- Use Temperature: 482 to 572
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy; Polyphenylene Sulfide
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from RS Components, Ltd.
Urethan 71, 200ml [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Polyurethane; Urethane
- Use Temperature: 248
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from RS Components, Ltd.
TROPICOAT V1 520ML [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Acrylic; Acrylic
- Use Temperature: 284
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 650 ML [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Silicone; Silicone
- Dielectric Strength: 2032
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from RS Components, Ltd.
Varnish E200 400ml [See More]
- Form / Shape: Liquid; Aerosol
- Dielectric Strength: 2032
- Industry: Electronics
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Form / Shape: Liquid
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from RS Components, Ltd.
VARNISH KF 1282 [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Acrylic; Acrylic
- Use Temperature: -40 to 257
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from RS Components, Ltd.
TROPICOAT V1 520ML [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Acrylic; Acrylic
- Use Temperature: 284
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Chemical System: Epoxy
- Composition: Two Component ; Unfilled
from RS Components, Ltd.
PLASTIK 70, 400ml [See More]
- Form / Shape: Liquid; Aerosol
- Industry: Electronics
- Chemical System: Acrylic; Acrylic Resin
- Use Temperature: 140
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Cure / Technology: Thermoset
- Composition: Single Component; Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Form / Shape: Liquid
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Chemence Inc.
Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]
- Form / Shape: Liquid
- Chemical System: Cyanoacrylate
- Use: Die Bonding Adhesives
- Cure / Technology: Reactive or Moisture Cured (optional feature)
from Indium Corporation
Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]
- Form / Shape: Liquid
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Form / Shape: Liquid
- Industry: Electronics
- Cure / Technology: Anaerobic
- Composition: Filled
from Bluestar Silicones USA Corp.
One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]
- Form / Shape: Liquid
- Chemical System: Silicone
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Form / Shape: Grease, Paste; Liquid
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Form / Shape: Liquid
- Chemical System: Silicone
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Form / Shape: Liquid
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
- Composition: Single Component
from ND Industries, Inc.
Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]
- Form / Shape: Liquid
- Cure / Technology: Air Setting / Film Drying
- Chemical System: Acrylic
- Industry: Electronics
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Chemical System: Epoxy
- Industry: Electronics; Electric Power
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Form / Shape: Liquid
- Chemical System: Silicone
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electric Power
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Form / Shape: Liquid
- Industry: Electronics
- Use: Encapsulant or Conformal Coating
- Features: Thermally Conductive
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Form / Shape: Liquid
- Chemical System: Cyanoacrylate
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
from Indium Corporation
Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]
- Form / Shape: Liquid
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Features: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Form / Shape: Gel; Liquid; Syringe/Cartridge/Pale
- Chemical System: Silicone Free
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics; Electric Power
from Henkel Corporation - Electronics
LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's [See More]
- Form / Shape: Liquid
- Industry: Electronics
- Use: Gap Filler, Foam in Place Gasket
- CTE: 19
from ND Industries, Inc.
Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]
- Form / Shape: Liquid
- Cure / Technology: UV or Radiation Cured
- Use: Die Bonding Adhesives
- Industry: Electronics; Electric Power
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Form / Shape: Liquid
- Chemical System: Polyurethane
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured
- Use: Die Bonding Adhesives
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Form / Shape: Liquid
- Industry: Electronics
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Composition: Two Component
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Form / Shape: Liquid
- Chemical System: Polyurethane
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: UV or Radiation Cured
from Protavic America, Inc.
PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and flexibility are considered as... [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Form / Shape: Liquid
- Chemical System: Epoxy
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Option of one or two component
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Form / Shape: Liquid
- Chemical System: Polyurethane
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Form / Shape: Liquid
- Cure / Technology: Thermoset
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Industry: Electronics
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Industry: Electronics