Liquid Electrical and Electronic Resins

Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Addition Cure
Fluorinated Conformal Coating Agent -- SURECO™ CC Series
from AGC Chemicals Americas, Inc.

SURECO ™ CC series are surface treatment agents containing a fluorinated polymer compound. By forming a thin layer on a variety of surfaces, it provides excellent water & oil repellency, anti-corrosion, moisture protection and waterproofing. It can be used as a conformal coating for PCB... [See More]

  • Form / Shape: Liquid
  • Chemical System: Fluorinated Polymer
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Cyanoacrylate Instant Adhesive -- KB014
from Chemence Inc.

Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]

  • Form / Shape: Liquid
  • Chemical System: Cyanoacrylate
  • Use: Die Bonding Adhesives
  • Cure / Technology: Reactive or Moisture Cured (optional feature)
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® MED-301 is a Certified ISO 10993, biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are self-leveling, short pot-life, and ease of application, either by dispensing or manual operation. EPO-TEK ® MED-301 is used... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Liquid Metal Thermal Interface Material
from Indium Corporation

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Features: Thermally Conductive
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Form / Shape: Liquid
  • Chemical System: Cyanoacrylate
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Cure / Technology: Anaerobic; Reactive or Moisture Cured; UV or Radiation Cured
UV Epoxy -- EPO-TEK® OG198-54
from Epoxy Technology

EPO-TEK ® OG198-54 is a low viscosity, high Tg, UV curable epoxy. Active alignment of optics, securing fibers into V-grooves and fiber pigtails are a few of its common applications. It can also be used for hybrid and semiconductor device assembly. It is a "dual" cure chemistry, performance will... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; UV or Radiation Cured
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Form / Shape: Liquid; Powder
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Form / Shape: Liquid
  • Chemical System: UV Curing
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Cure / Technology: UV or Radiation Cured; Dual Curing
Elastomer Based, One Component Adhesive and Primer -- X21
from Master Bond, Inc.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]

  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Cure / Technology: Thermoset
  • Composition: Single Component; Unfilled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F -- Supreme 34CA
from Master Bond, Inc.

Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]

  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Chemical System: Epoxy
  • Composition: Two Component  ; Unfilled
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
High Performance, Elastomer-Based, One Component Adhesive -- X-5
from Master Bond, Inc.

Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]

  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Cure / Technology: Thermoset
  • Composition: Single Component; Unfilled
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Form / Shape: Liquid
  • Industry: Electronics
  • Chemical System: Epoxy
  • Composition: Two Component  ; Unfilled
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Cure / Technology: UV or Radiation Cured
Electronic Protective Coating Silicone Compound -- Bluesil™ V-205
from Bluestar Silicones USA Corp.

One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use: Encapsulant or Conformal Coating
  • Industry: Electronics
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Form / Shape: Liquid
  • Industry: Electronics
  • Use: Encapsulant or Conformal Coating
  • Composition: Single Component
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Cyanoacrylates -- Vibra-Tite®
from ND Industries, Inc.

Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
  • Chemical System: Acrylic
  • Industry: Electronics
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics; Electric Power
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Form / Shape: Liquid
  • Industry: Electronics
  • Use: Encapsulant or Conformal Coating
  • Features: Thermally Conductive
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electric Power
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Form / Shape: Liquid
  • Chemical System: Polyurethane
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
LOCTITE 3563 -- 8799552634881
from Henkel Corporation - Electronics

LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's [See More]

  • Form / Shape: Liquid
  • Industry: Electronics
  • Use: Gap Filler, Foam in Place Gasket
  • CTE: 19
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Use: Die Bonding Adhesives
  • Industry: Electronics; Electric Power
Chemical Resistant Epoxy System -- 20-3004 LV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Industry: Electronics
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Use: Die Bonding Adhesives
  • Industry: Semiconductors, IC's; Electronics; Electric Power
734 Flowable Sealant -- 734CL90ML TUBE [734CL90ML TUBE from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

3 oz Tube; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Electrically Conductive Flexible Ink -- 40-3920
from Epoxies Etc...

40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Ceramacast -- 668
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Form / Shape: Liquid
  • Industry: Electronics
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Composition: Two Component  
Electro-Conductive Epoxy Adhesive -- ACE-24511
from Protavic America, Inc.

PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line snap cure system and its excellent electrical conductivity and flexibility are considered as... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Form / Shape: Liquid
  • Chemical System: Polyurethane
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: UV or Radiation Cured
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
High Performance Epoxies -- 2330
from Aremco Products, Inc.

Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Encapsulant or Conformal Coating
  • Industry: Electronics
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Option of one or two component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Form / Shape: Liquid
  • Chemical System: Polyurethane
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
  • Use: Encapsulant, Potting Compound
  • Industry: Electronics
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Industry: Electronics
Hapflex™ 700 Series High Performance Hybrid Elastomeric Polymer Alloy -- 765
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]

  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Industry: Electronics