Two Component System Electrical and Electronic Resins
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Composition: Two Component ; Filled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
Fusionbond ® 370 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 370 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Composition: Two Component
- Industry: Electronics; Electric Power
- Form / Shape: 50 ml (two component)
from MacDermid Alpha Electronics Solutions
High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview. Electrolube ® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced... [See More]
- Composition: Two Component
- Industry: Semiconductors, IC's; Electronics
- Use: Encapsulant or Conformal Coating
- Features: Thermally Conductive
from CHT USA Inc.
CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]
- Composition: Two Component
- Cure / Technology: Condensation
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Composition: Two Component ; Filled
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Fusionbond ® 371 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 371 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Composition: Two Component
- Industry: Electronics; Electric Power
- Form / Shape: 400 ml (two component)
from CHT USA Inc.
CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by... [See More]
- Composition: Two Component
- Cure / Technology: Condensation
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Composition: Two Component ; Filled
- Form / Shape: Grease, Paste
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
Hernon ® has taken the excellent bond strength of Fusionbond adhesive family and merged it with the simplicity of a two-component, no-mix curing system to create Fusionbond ® 374. Fusionbond ® 374 is a 100% solid, room temperature cure, versatile structural adhesive which is used in... [See More]
- Composition: Two Component
- Industry: Electronics; Electric Power
- Form / Shape: 25 ml
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Composition: Two Component
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Addition
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Epoxy
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Fusionbond ® 375 is a highly thixotropic, two component, room temperature curing, 1:1 ratio, methacrylate adhesive system. Fusionbond ® 375 is formulated to provide fixturing strength within 7 to 10 minutes. This adhesive product forms resilient bonds and maintains its strength over a wide... [See More]
- Composition: Two Component
- Chemical System: Acrylic; Vinyl
- Form / Shape: 50 ml (two component)
- Industry: Electronics; Electric Power
from CHT USA Inc.
CHT's TufGel 330 is a 2-part, clear, tough, moderately cross-linked silicone gel. It has good room temperature cure adhesion to many substrates. TufGel 330 is used to provide protection from vibration and thermal or mechanical shock and will also provide excellent moisture protection. [See More]
- Composition: Two Component
- Cure / Technology: Addition
- Form / Shape: Gel
- Industry: Electronics
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Composition: Two Component
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Composition: Two Component
- Cure / Technology: Addition
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Composition: Two Component
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV tracer for easy QC... [See More]
- Composition: Two Component
- Cure / Technology: Addition
- Form / Shape: Gel
- Industry: Electronics
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Composition: Two Component
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Composition: Two Component
- Cure / Technology: Addition
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Composition: Single Component; Two Component
- Chemical System: Epoxy
- Form / Shape: 10 ml
- Cure / Technology: Thermoset
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Composition: Two Component
- Industry: Electronics
- Cure / Technology: Addition
- Features: Flame Retardant; Thermally Conductive; UL Rating
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Composition: Single Component; Two Component
- Chemical System: Epoxy
- Form / Shape: TUFFBOND 395, LT AMBER, 300 ML CARTRIDGE
- Cure / Technology: Thermoset
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Composition: Two Component
- Cure / Technology: Addition
- Use: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system. [See More]
- Composition: Two Component
- Chemical System: Epoxy
- Form / Shape: 50 ml (two component)
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Composition: Two Component
- Form / Shape: 50 ml (two component)
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Hernon Manufacturing, Inc.
Hernon ® Fusionbond ® 3751-10 is two-component methacrylate adhesive designed for room-temperature curing with a 1:1 mix ratio. This next-generation formula offers enhanced stability when stored at room temperature. Fusionbond ® 3751-10 achieves fixture strength within 10 minutes and... [See More]
- Composition: Two Component
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Acrylic; Vinyl
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Composition: Two Component
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Hernon ® Fusionbond ® 3770-15 is a high-performance, two-component methacrylate adhesive that cures at room temperature with a 1:1 mix ratio. Engineered with advanced technology, this next-generation formula delivers strong, durable bonds while significantly reducing odor. Fusionbond... [See More]
- Composition: Two Component
- Industry: Electronics; Electric Power
- Chemical System: Acrylic
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Fusionbond ® 3780-05 is a high-performance, two-component methacrylate adhesive that cures at room temperature with a 1:1 mix ratio. Engineered with advanced technology, this next-generation formula delivers strong, durable bonds while significantly reducing odor for improved user experience. [See More]
- Composition: Two Component
- Industry: Electronics; Electric Power
- Chemical System: Acrylic
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Grease, Paste; Powder
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 326 is a two-component epoxy known for its low-viscosity, toughness, and long working life at ambient temperatures with shortened cure times at elevated temperatures. The resin offers a combination of high shear strength and hardness. Often used for potting, this epoxy creates a... [See More]
- Composition: Two Component
- Chemical System: Epoxy
- Form / Shape: 5 gal
- Industry: Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Composition: Two Component ; Filled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Composition: Two Component ; Unfilled; Solvent Based
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Chemical System: Epoxy
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Composition: Two Component
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Industry: Electronics
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is... [See More]
- Composition: Two Component
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Industry: Electronics
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Silicone
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Composition: Two Component
- Features: Electrically Conductive
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Bluestar Silicones USA Corp.
A White, Two-Component, Electronic protevtive coating, Heat Cure Silicone. Properties. Viscosity 35000. Hardness Sha 42. Description. Bluesil V-204 is a white, two component, addition cure, heat curing silicone compound. It is designed as a protective coating for light sensitive electronic circuits... [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Silicone
from Henkel Corporation - Electronics
HYSOL ® ES1000 ™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules. [See More]
- Composition: Two Component
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Composition: Two Component ; Filled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Composition: Two Component ; Filled
- Form / Shape: Gel
- Use: Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Protavic America, Inc.
Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio. [See More]
- Composition: Two Component ; Filled
- Form / Shape: Gel
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Chemical System: Polyurethane
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Composition: Two Component
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Composition: Two Component ; Filled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing