UL Approved Electrical and Electronic Resins

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

• Features: High Dielectric; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Impregnating Resin (optional feature)
• Chemical System: Alkyd

Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]

• Features: Flame Retardant; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating
• Chemical System: Acrylated Urethane

CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Alkoxy

• Chemical System: Silicone
• Industry: Electronics

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60 °F to 200... [See More]

• Features: High Dielectric; Flame Retardant; Thermal Insulation; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Epoxy

High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]

• Features: Flame Retardant; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating
• Chemical System: Acrylated Urethane

CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The chemical... [See More]

• Features: High Dielectric; Flame Retardant; Optical; UL Rating
• Cure / Technology: Addition

• Use: Encapsulant, Potting Compound
• Industry: Electronics

Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be labeled as explosion proof and or dust ignition proof. [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating; UL 1203
• Form / Shape: Liquid

• Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
• Chemical System: Epoxy

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Addition

• Use: Encapsulant, Potting Compound
• Industry: Electronics

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Industry: Electronics

• Cure / Technology: Addition
• Composition: Two Component  

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Cure / Technology: Addition

• Use: Encapsulant, Potting Compound
• Industry: Electronics

CHT's ACC15 is a low viscosity, 1-part, condensation curing silicone coating. The uncured product can be applied by pouring or brushing and is readily cured to a tough, transparent rubber. ACC15 can be used to coat printed circuit boards to prevent ingress of water an environmental contaminants. It... [See More]

• Features: UL Rating
• Cure / Technology: Alkoxy

• Use: Encapsulant or Conformal Coating
• Industry: Electronics

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

• Features: Flame Retardant; UL Rating
• Form / Shape: Grease, Paste

• Use: Gap Filler, Foam in Place Gasket
• Industry: Electronics

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

• Features: High Dielectric; Flame Retardant; Thermal Insulation; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Polyurethane

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Gel

• Use: Encapsulant, Potting Compound
• Chemical System: Polyurethane

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: UL Rating; Masking applications
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyolefin

SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]

• Features: Flame Retardant; UL Rating
• Form / Shape: Grease, Paste

• Use: Gap Filler, Foam in Place Gasket
• Industry: Electronics

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

• Features: Electrically Conductive; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Gel

• Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound
• Chemical System: Silicone

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

• Features: Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Chemical System: Epoxy

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

• Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound
• Cure / Technology: Thermoset

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating; Solvent resistant
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]

• Features: High Dielectric; Flame Retardant; UL Rating
• Form / Shape: Liquid

• Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Chemical System: Polyurethane

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

• Features: Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating; Hydrophobic
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyolefin

LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

• Features: High Dielectric; Optical; Thermally Conductive; UL Rating; UV resistant
• Form / Shape: Pellets

• Use: Encapsulant, Potting Compound
• Chemical System: Polyamide

LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]

• Features: High Dielectric; Thermally Conductive; UL Rating
• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts

• Use: Gap Filler, Foam in Place Gasket
• Chemical System: Silicone

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Pad; Sheet Form, Die-cut Parts
• Industry: Electronics

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]

• Features: Thermally Conductive; UL Rating
• Chemical System: Silicone

• Form / Shape: Sheet or Film; Sheet Form, Die-cut Parts
• Industry: Electronics