Single Component System Electrical and Electronic Resins

Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

EPO-TEK ® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy... [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Composition: Single Component; Unfilled; Solvent Based
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Composition: Single Component
  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Epoxy
  • CTE: 16 to 111
Cyanoacrylate Instant Adhesive -- KB014
from Chemence Inc.

Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]

  • Composition: Single Component; Two Component   (optional feature)
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Cyanoacrylate
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Composition: Single Component
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Cyanoacrylate
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Polyurethane Hot Melt -- KHB8636
from Chemence Inc.

Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]

  • Composition: Single Component
  • Form / Shape: Pellets
  • Use: Die Bonding Adhesives
  • Chemical System: Polyurethane
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: UV Curing
Two Component Thermally Conductive Silicone - High Viscosity -- KSC1202
from Chemence Inc.

KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]

  • Composition: Single Component
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Silicone
Elastomer Based, One Component Adhesive and Primer -- X21
from Master Bond, Inc.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]

  • Composition: Single Component; Unfilled
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyphenylene Sulfide
High Performance, Elastomer-Based, One Component Adhesive -- X-5
from Master Bond, Inc.

Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]

  • Composition: Single Component; Unfilled
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset
High Tensile Strength, One Component Epoxy -- EP15
from Master Bond, Inc.

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
One Component Elastomeric System Features Excellent Thermal Conductivity -- X5TC
from Master Bond, Inc.

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]

  • Composition: Single Component; Unfilled
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Polyolefin
  • Form / Shape: Liquid; Primer
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
One Component Thermally Conductive Epoxy Film -- FL901AO
from Master Bond, Inc.

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]

  • Composition: Single Component; Unfilled
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's; Electronics; Electric Power
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE
from Master Bond, Inc.

Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: UV curable
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
  • Cure / Technology: Thermoset; UV or Radiation Cured
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM
from Master Bond, Inc.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Toughened, One Component, Thermally Resistant Epoxy -- EP17
from Master Bond, Inc.

Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at a minimum temperature of 300 °F to 350 °F for 60-90 minutes. Post curing for 1... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Synthetic Based
  • Form / Shape: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Composition: Single Component; Unfilled
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Flexible Heat Transfer Compound -- EFS-1
from Thermon, Inc

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Composition: Single Component
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Pad
  • Industry: Electric Power
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics -- ELASTOSIL® N199
from Wacker Chemical Corp.

ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. Excellent adhesion. Application. general-purpose adhesive for the... [See More]

  • Composition: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Cyanoacrylates -- Vibra-Tite®
from ND Industries, Inc.

Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]

  • Composition: Single Component
  • Chemical System: Acrylic
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Composition: Single Component
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
Electronic Protective Coating Silicone Compound -- Bluesil™ V-205
from Bluestar Silicones USA Corp.

One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Electrically Conductive Flexible Ink -- 40-3920
from Epoxies Etc...

40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Ablestik ABLELUX A4502 -- 8799473565697
from Henkel Corporation - Electronics

Photocurable adhesive is designed for high throughput assembly operations. [See More]

  • Composition: Single Component
  • Industry: Electronics
  • Cure / Technology: UV or Radiation Cured
  • CTE: 29
734 Flowable Sealant -- 734CL90ML TUBE [734CL90ML TUBE from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

3 oz Tube; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
Heat Transfer Compound -- NH Nonhardening
from Thermon, Inc

NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon ’s heat transfer compounds provide an efficient thermal connection between the external heating source and the process equipment. Thermon ’s NH... [See More]

  • Composition: Single Component
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Electric Power
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured
Firestop Putty Tube -- SSP100
from Acoustical Solutions, Inc.

SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]

  • Composition: Single Component
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Polyurethane
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Composition: Single Component
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Industry: Electronics
Heat Transfer Compound -- TFK-4 SS
from Thermon, Inc

T-99 is a specialty heat transfer compound formulated to provide exceptional thermal stability and superior bonding strength up to 1832 °F (1000 °C). Maximum exposure temperature 1832 °F (1000 °C) [See More]

  • Composition: Single Component
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Electric Power
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
One Component Epoxy Adhesive -- 10-3782
from Epoxies Etc...

These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Composition: Single Component
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
SnapTrace® Heat Transfer Compound -- ST-1
from Thermon, Inc

SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation on straight piping runs 1-1/2 inches (38 mm) and larger. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating... [See More]

  • Composition: Single Component
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Electric Power
Filled Epoxy Cast -- PNE-20262
from Protavic America, Inc.

Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. [See More]

  • Composition: Single Component; Filled
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
One Component Flame Retardant Epoxy -- 20-3067
from Epoxies Etc...

Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries. [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Composition: Single Component
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyolefin
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
TECHNOMELT PA 6208 -- 8807692926977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Composition: Single Component
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Composition: Single Component
  • Form / Shape: Pellets
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyamide