Single Component System Electrical and Electronic Resins
from CHT USA Inc.
CHT's AS1821 is is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Acetone cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature when in... [See More]
- Composition: Single Component
- Cure / Technology: Acetone
- Chemical System: Silicone
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
Suitable for stress-sensitive materials, PC/PVC strong bonding. This product shows excellent adhesion to most substrates including glass, many plastics and most metals. [See More]
- Composition: Single Component
- Industry: Electronics
- Cure / Technology: UV or Radiation Cured
- Use Temperature: -67 to 302
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Composition: Single Component
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Composition: Single Component
- Form / Shape: Gel; Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Silicone
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Composition: Single Component; Unfilled; Solvent Based
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Air Setting / Film Drying
from CHT USA Inc.
AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]
- Composition: Single Component
- Cure / Technology: Alkoxy
- Chemical System: Silicone
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. [See More]
- Composition: Single Component
- Chemical System: Epoxy
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Heat Curing
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from CHT USA Inc.
CHT ’s AS1802 is a 1-part, gray, non-corrosive, neutral cure, thermally conductive, RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 is designed with excellent primerless... [See More]
- Composition: Single Component
- Cure / Technology: Acetone
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Composition: Single Component; Filled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
from CHT USA Inc.
CHT ’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast... [See More]
- Composition: Single Component
- Cure / Technology: Acetone
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Composition: Single Component; Unfilled
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Composition: Single Component
- Cure / Technology: Alkoxy
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Composition: Single Component; Filled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyphenylene Sulfide
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Composition: Single Component; Unfilled
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Master Bond, Inc.
Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]
- Composition: Single Component; Unfilled
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Form / Shape: Grease, Paste
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Polyolefin
- Form / Shape: Liquid; Primer
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Composition: Single Component; Unfilled
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Master Bond, Inc.
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: UV curable
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket; Impregnating Resin
- Cure / Technology: Thermoset
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Composition: Single Component; Filled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Composition: Single Component; Filled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Synthetic Based
- Form / Shape: Grease, Paste
- Cure / Technology: Air Setting / Film Drying
from Wacker Chemical Corp.
ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. Excellent adhesion. Application. general-purpose adhesive for the... [See More]
- Composition: Single Component
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
from Henkel Corporation - Electronics
Photocurable adhesive is designed for high throughput assembly operations. [See More]
- Composition: Single Component
- Industry: Electronics
- Cure / Technology: UV or Radiation Cured
- CTE: 29
from Acoustical Solutions, Inc.
FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]
- Composition: Single Component
- Form / Shape: Grease, Paste
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from ND Industries, Inc.
Cyanoacrylates (also known as superglues) are single-part clear instant adhesives that rapidly polymerize at room temperature and develop strength extremely fast (fixture 0 to 60 seconds). They are initiated by moisture on the parts surface or by accelerators. Uses: Circuit board wires. Ceramic,... [See More]
- Composition: Single Component
- Chemical System: Acrylic
- Form / Shape: Liquid
- Cure / Technology: Air Setting / Film Drying
from Chemence Inc.
Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]
- Composition: Single Component; Two Component (optional feature)
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Cyanoacrylate
from Bluestar Silicones USA Corp.
One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]
- Composition: Single Component
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Silicone
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Epoxies Etc...
40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]
- Composition: Single Component; Filled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Composition: Single Component
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Composition: Single Component
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Industry: Electronics
from Acoustical Solutions, Inc.
SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]
- Composition: Single Component
- Form / Shape: Grease, Paste
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
from ND Industries, Inc.
Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]
- Composition: Single Component
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: UV or Radiation Cured
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Composition: Single Component
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound
- Chemical System: Cyanoacrylate
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Polyurethane
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Composition: Single Component; Filled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Composition: Single Component
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Chemence Inc.
Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]
- Composition: Single Component
- Form / Shape: Pellets
- Use: Die Bonding Adhesives
- Chemical System: Polyurethane
from Epoxies Etc...
These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. [See More]
- Composition: Single Component; Filled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Composition: Single Component
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyolefin
from Chemence Inc.
KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]
- Composition: Single Component
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Silicone
from Epoxies Etc...
Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries. [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Composition: Single Component
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Composition: Single Component
- Form / Shape: Pellets
- Use: Encapsulant, Potting Compound
- Chemical System: Polyamide