Polysulfide Electrical and Electronic Resins

Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide; Polyurethane
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Oil And Fuel Resistant Polysulfide Based Adhesive -- EP21TP-2NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO psi at room... [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid; Optional Premixed and Frozen
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30LV
from Master Bond, Inc.

Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO
from Master Bond, Inc.

Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU •in/ft2 •hr • °F [1.30-1.44 W/(m •K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic... [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Tough Epoxy Polysulfide Adhesive Resists High Temperatures -- EP21TPHT
from Master Bond, Inc.

Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Two Component, Room Temperature Curing Polysulfide -- EP21TPLV-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It... [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Very Fast Curing Two Component Epoxy Adhesive -- EP21FLV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21FLV is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, weight or volume. It quickly develops a high bonding strength of more than 3000 psi at room... [See More]

  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset