Underfill Adhesive

Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical

• Cure Type / Technology: Thermosetting / Crosslinking

Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical

• Cure Type / Technology: Thermosetting / Crosslinking

Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Specialty / Other
• Industry: Electronics

Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high

• Chemical / Polymer System Type: Specialty / Other
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Features: Electrically Insulating / Dielectric, Thermal / Heat Insulating
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and

• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): Over 4.5
• Dielectric Strength: Over 450 kV/in
• Dissimilar Substrates: Yes

Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.

• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): Over 4.5
• Dielectric Strength: 450 kV/in
• Dissimilar Substrates: Yes

Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173

• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Leveling / Filling Compound
• Industry: OEM / Industrial

Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional

Description: 3593 NON REWORKABLE UNDERFILL

Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.

• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4 to 5
• Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.

• Applied Thickness / Gap Fill: 0.0050 to 0.0150 inch
• Coeff. of Thermal Expansion (CTE): 1.22E7 to 1.33E7 µin/in-F
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 4.4

Description: Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.

• Coeff. of Thermal Expansion (CTE): 13.89 to 55.56 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Features: Electrical Insulating / Dielectric
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: High purity, flip-chip underfill, high Pb and no-Pb applications

• Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
• Industry: Electronics
• Viscosity: 40000 cP

Description: Heavy duty grade hot melt packaging tape for manual or automated industrial sealing of heavy, bulky cartons, including overstuffed or under-filled cartons, in high stress and extreme handling conditions. Designed to be tough with an aggressive adhesive and exclusive release-coat

• Adhesive: Hot Melt / Heat Activated, Pressure Sensitive (PSA), Rubber
• Backing: Plastic / Polymer, Rubber
• Features: Permanent
• Peel Strength / Adhesion: 3.62 lbs/in

Description: Heavy duty grade hot melt packaging tape for manual or automated industrial sealing of heavy, bulky cartons, including overstuffed or under-filled cartons, in high stress and extreme handling conditions. HP 500® is constructed to be tough with excellent grip and Hold Strong® technology,

• Adhesive: Hot Melt / Heat Activated, Pressure Sensitive (PSA), Rubber
• Backing: Plastic / Polymer, Rubber
• Features: Permanent
• Peel Strength / Adhesion: 3.62 lbs/in

Description: Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.

• Cure Type / Technology: Single Component System
• Dielectric Strength: 1067 kV/in
• Features: Encapsulating / Potting
• Thermal Conductivity: 0.4200 W/m-K

Description: Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or

• Applied Thickness / Gap Fill: 0.0020 to 0.0060 inch
• Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Dissimilar Substrates: Yes

Description: A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing. Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component

• Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
• Industry: Electronics, Semiconductors / IC Packaging

Description: Dymax 9310 cures upon exposure to light and is designed for rapid ruggedization of circuit board components. This adhesive is specially formulated to cure with heat in applications where shadowed areas exist. Ideal applications for this material include reinforcement of fine-pitch or leadless

• Cure Type / Technology: UV / Radiation Cured (EB, Light)
• Dissimilar Substrates: Yes
• Industry: Other
• Substrate / Material Compatibility: Ceramic / Glass, Other

Description: Nordson EFD’s automated desktop dispensing robots and their in-line dispensing systems offer reliable operation with excellent repeatability for precise adhesive application and sealant application and lubricant application in many assembly and manufacturing processes. With

• Dispensed From: Barrel / Syringe
• Dispensing Application Type: Bead, Dot, Fill ("Potting")
• Mounting: Robotic
• Type: Dispense Only

Description: The FCM100 is ideal for any low viscosity underfill, encapsulant, conformal coating, and micro dot or bead dispensing project. The FCM100 "propels" precise shots of fluid onto a substrate resulting in accurate patterns at a high robot speed as no in process z-axis adjustments are required.

• Applications: Adhesive / Silicone
• Dispensing Application Type: Bead, Dot, Fill ("Potting")
• Media Viscosity: 1 to 20000 cps
• Number of Components: Single Component Dispensing

Description: processes and applications are: Jetting silver epoxies for die bonding processes Jetting silicone phosphor in the LED assembly process Jetting under-fill in micro-electronic package applications on PCBA Jetting micro dots of UV adhesive in medical device applications

• Application: Adhesive / Silicone, Other
• Batch (Syringe): Yes
• Dispensing Application Type: Dot, Fill ("Potting")
• Media Viscosity: 7000 to 2.00E6 cps

Description: LOCTITE 3517M one component reworkable underfill is designed for use as a solder joint protection against mechanical stress in handheld electronic device applications. It the low halogen content version of 3517 adhesive.

• Industry: Electronics
• Use: Gap Filling Compound

Description: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or

Description: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both.

Description: product is ideal for reinforcement of fine-pitch leads or leadless components on printed circuit boards as well as an alternative to underfill. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. 9309-SC

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form / Function: Encapsulant / Potting Compound
• Industry Applications: Other
• Viscosity: 45000 cP

Description: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or