Underfill Adhesive

Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical

• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical

• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and

• Viscosity: 10,000 to 40,000 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 1.3 to 1.44 W/m-K
• Tensile Strength (Break): 5,000 to 7,000 psi

Description: Underfills

• Viscosity: 10,000 cP
• Coeff. of Thermal Expansion (CTE): 15.555555555555555 µin/in-F

Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high

• Use: Die Bonding Adhesive / Compound
• Features: Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, OEM / Industrial, Specialty / Other, Thermal Insulation / Heat Insulating
• Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging
• Form / Shape: Liquid

Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.

• Industry: Electronics
• Chemical System: Epoxy (EP)
• Features: Specialty / Other

Description: 3517 EPOXY UNDERFILL, 30CC SYRINGE

Description: 3549 - REWORKABLE UNDERFILL - 30ML - IDH# 910487

Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.

• Viscosity: 5,000 to 15,000 cP
• Use Temperature: -60 to 250 F
• Tensile Strength (Break): 5,000 to 7,000 psi
• Dielectric Strength: 450.00000000000006 kV/in

Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173

• Chemical System: Epoxy (EP)
• Features: Leveling / Filling Compound
• Industry: OEM / Industrial
• Cure / Technology: Thermosetting / Crosslinking

Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional

Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.

• Applied Thickness / Gap Fill: 0.005 to 0.015 inch
• Use Temperature: -60 to 350 F
• Thermal Conductivity: 1.3 to 1.44 W/m-K
• Coeff. of Thermal Expansion (CTE): 12,222,222.222222222 to 13,333,333.333333332 µin/in-F

Description: 3593 NON REWORKABLE UNDERFILL

• Chemical System: Epoxy (EP)

Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.

• Use Temperature: -55 to 120 F
• Thermal Conductivity: 0.5 to 1 W/m-K
• Tensile Strength (Break): 2,000 psi
• Dielectric Constant (Relative Permittivity): 4 to 5

Description: FAST FLOW,LOW TEMPERATURE CURE,REWORKABLE EPOXY UNDERFILL FOR BGA AND CSP DEVICES. HIGH ADHES AND RIGID CIRCUIT SUBSTRATES - 10 CC ML

Description: Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.

• Viscosity: 25,000 cP
• Use Temperature: -55 to 200 F
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 to 55.55555555555556 µin/in-F
• Tensile Strength (Break): 3,000 psi

Description: Product Overview A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT)

• Industry: Electronics, Semiconductors / IC Packaging
• Form / Shape: Grease / Paste
• Composition: Single Component System

Description: High purity, flip-chip underfill, high Pb and no-Pb applications

• Viscosity: 40,000 cP
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
• Industry: Electronics

Description: LOCTITE 3517M one component reworkable underfill is designed for use as a solder joint protection against mechanical stress in handheld electronic device applications. It the low halogen content version of 3517 adhesive.

• Features: Electronics (PCB / SMT Assembly)
• Use: Gap Filling Compound

Description: Heavy duty grade hot melt packaging tape for manual or automated industrial sealing of heavy, bulky cartons, including overstuffed or under-filled cartons, in high stress and extreme handling conditions. Designed to be tough with an aggressive adhesive and exclusive release-coat technology

• Width: 5.669291338582677 to 11.338582677165354 inches
• Thickness: 0.003 inches
• Peel Strength / Adhesion: 3.625 lbs/in
• Temperature Resistance: -28.88888888888889 to 65.55555555555556 C

Description: Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.

• Viscosity: 4,000 cP
• Thermal Conductivity: 0.42 W/m-K
• Dielectric Strength: 1,066.8000000000022 kV/in
• Features: Encapsulating / Potting

Description: Heavy duty grade hot melt packaging tape for manual or automated industrial sealing of heavy, bulky cartons, including overstuffed or under-filled cartons, in high stress and extreme handling conditions. HP 500® is constructed to be tough with excellent grip and Hold Strong® technology, ensuring it

• Width: 1.889763779527559 to 2.8346456692913384 inches
• Thickness: 0.003 inches
• Peel Strength / Adhesion: 3.625 lbs/in
• Temperature Resistance: -28.88888888888889 to 65.55555555555556 C

Description: product is ideal for reinforcement of fine-pitch leads or leadless components on printed circuit boards as well as an alternative to underfill. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. 9309-SC

• Viscosity: 45,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Rubber / Elastomer
• Features: Other
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: Dymax 9310 cures upon exposure to light and is designed for rapid ruggedization of circuit board components. This adhesive is specially formulated to cure with heat in applications where shadowed areas exist. Ideal applications for this material include reinforcement of fine-pitch or leadless

• Viscosity: 60,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates
• Features: Other
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or

• Applied Thickness / Gap Fill: 0.002 to 0.006 inch
• Viscosity: 150 to 300 cP
• Use Temperature: -452.47 to 400 F
• Coeff. of Thermal Expansion (CTE): 22,222,222.22222222 to 25,000,000 µin/in-F

Description: Dymax 9773 is a low outgassing, low-ionic content, high-performance light-cure staking/ruggedizing adhesive especially formulated to stabilize critical components on printed circuit boards in missiles, satellites, and spacecraft. This material is designed for rapid on-demand broad-spectrum

• Viscosity: 54,000 cP
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Rubber / Elastomer
• Features: Other
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: The FCM100 is ideal for any low viscosity underfill, encapsulant, conformal coating, and micro dot or bead dispensing project. The FCM100 "propels" precise shots of fluid onto a substrate resulting in accurate patterns at a high robot speed as no in process z-axis adjustments are required.

• Shot Size: 0.0008300876587648733 cc
• Media Viscosity: 1 to 20,000 cps
• Application: Adhesive / Silicone
• Dispensing Application: Bead, Dot, Fill ("Potting")

Description: Nordson EFD’s automated desktop dispensing robots and their in-line dispensing systems offer reliable operation with excellent repeatability for precise adhesive application and sealant application and lubricant application in many assembly and manufacturing processes. With specialized PC

• Application: Adhesive / Silicone, Lubricants
• Dispensed From: Barrel / Syringe
• Dispensing Type: Bead, Dot, Fill ("Potting")
• Dispensing Equipment Type: Dispense Only

Description: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both.

Description: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both.

Description: die bonding processes Jetting silicone phosphor in the LED assembly process Jetting under-fill in micro-electronic package applications on PCBA Jetting micro dots of UV adhesive in medical device applications

• Shot Size: 0.000002000211225939454 cc
• Media Viscosity: 7,000 to 2,000,000 cps
• Application: Adhesive / Silicone
• Material Feed: Batch (Syringe)

Description: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both.