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Supplier: Saint-Gobain Surface Conditioning Group
Description: Saint-Gobain Ceramic Materials' Polycrystalline Alumina Polishing Slurry is an aqueous slurry of alumina in which the fundamental crystal size ranges from 50 to 100 Nano Slurries, 9240nanometers. The unique composition of extremely small crystals, primarily alpha alumina, results in an
- Materials / Substrates Finished: Aluminum, Ceramics / Glass
- Compound / Abrasive Type: Aluminum Oxide
- Grading System: Micron Graded
- Type: Polishing
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Supplier: Precision Surfacing Solutions
Description: between two rotating plates. The machine consists of a heavy-duty base which houses both the polishing plate and the swing arm drive systems. The Polishing plate has a polishing pad (type dependent on material to be processed) bonded directly to its upper surface.
- Power: 2.9484848467862 to 7.37121211696551 HP
- AC Voltage & Phase: 50 Hz / International Power
- Applications / Materials Abraded: Ceramics / Glass, Ophthalmic / Optical, Wet Finishing
- Power Source: Electric Motor / Vibrator
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Supplier: Beijing Grish Hitech Co., Ltd.
Description: GRISH CMP slurry is mainly based on colloids. The formula made through scientific proportioning can ensure the stability of pH value during the polishing process, thereby ensuring the stability of the polishing rate and saving time. CMP slurries are widely used in mechanical
- Materials / Substrates Finished: Ophthalmic / Optical Materials, Semiconductors / Electronics (Wafers)
- Features: Other
- Type: Polishing
- Form: Slurry
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Abrasive Compounds and Abrasive Slurries - Rough-surface Monocrystalline Diamond Slurry (RCD Slurry)Supplier: Beijing Grish Hitech Co., Ltd.
Description: GRISH Rough-surface Monocrystalline Diamond Slurry (RCD Slurry) is made by adding RCD powder into water/oily carrier liquid through scientific proportioning. It is mainly used for polishing of sapphire materials, optical lenses, crystals and other superhard materials because of its
- Grit Size: 3 to 17
- Compound / Abrasive Type: Diamond
- Grading System: Micron Graded
- Materials / Substrates Finished: Ophthalmic / Optical Materials
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Supplier: Beijing Grish Hitech Co., Ltd.
Description: GRISH Liquid wax is a temporary adhesive commonly used in the processing of third-generation semiconductors such as sapphire substrates. The wax liquid is stable and not easy to generate air bubbles. When polishing, the workpiece can quickly reach the ideal end surface.
- Materials / Substrates Finished: Ophthalmic / Optical Materials, Semiconductors / Electronics (Wafers)
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Supplier: Advanced Abrasives Corp.
Description: Premasol A Alumina Suspension Produced using our 99.99% purity de-agglomerated powder in a proprietary carrier to create a permanent suspension. Available in abrasive particle sizes 0.05 µm, 0.1 µm 0.3 µm, and 1.0 µm Applications: Lapping and polishing of Ceramics, glass, precision optics,
- Compound / Abrasive Type: Aluminum Oxide, Ceramic
- Materials / Substrates Finished: Ceramics / Glass, Ophthalmic / Optical Materials
- Type: Lapping, Polishing
- Form: Liquid / Dispersion
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Supplier: Advanced Abrasives Corp.
Description: work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride, quartz, ceramics, metallographic
- Type: CMP / Wafer Planarization
- Compound / Abrasive Type: Ceramic, Silica
- Materials / Substrates Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers)
- Form: Liquid / Dispersion
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ SCA23R Aqueous Ceramic Cleaner AmberClean™ SCA23R is a biodegradable, aqueous cleaner which does not contain volatile organic compounds (VOCs). It is specifically formulated to clean and disperse sapphire, SiC and other ceramic lapping and polishing fines as well as
- Temperature (As Used): 149 F
- Concentration (As Used, by Volume): 1 to 10 %
- Type: Acid Cleaner / Mild Acid (2 to 5.5 pH), Aerosol / Contact Cleaner, Aqueous / Water-based, Cleaner / Cleaning Agent
- Features: Biodegradable, Other, VOC Compliant
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Suitable for fields such as cadmium zinc telluride, zinc sulfide, zinc selenide crystals, metallography, optical crystals, seals, sealing rings, metal hard alloys, sapphire, silicon carbide, and superhard ceramics. (read more)
Browse Abrasive Compounds and Abrasive Slurries Datasheets for Beijing Grish Hitech Co., Ltd. -
, INSACO has perfected the ability to produce sapphire wafer carriers with or without multiple holes for GaAs, Indium Phosphide, and other compound semiconductors. Why Sapphire? Superior chip resistance (read more)
Browse Glass Fabrication Services Datasheets for Insaco, Inc.
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Final polishing of metals to obtain nanoroughened surface
V. V. Rogov, N. D. Rublev, T. L. Krotenko, and A. V. Troyan, “A Study of Intensity of Tribochemical Contact Interaction between a Polishing Compound and Sapphire in Machining,” Sverkhtverd.
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A study of surface condition of sapphire (α-Al2 O3 ) workpieces upon their finishing operation
…fine grinding operations to elastic and soft polishing tools made of polyurethane or chamois in finishing operations, which means passing from a diamond abrasive cutting mechanism to a tribochemical interaction between a NALCO 2354 polishing compound and sapphire during the stock removal.
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Dynamic Behavior of Materials Complete Document
This polycrystalline diamond has found applications as a polishing compound for specialized applications, such as sapphire , ceramics, and ferrites.
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The influence of environment on the drop size — contact angle relationship
Fox et al. [7] measured the contact angle of 97 ali- phatic carboxylic esters and ethers, cyclic carboxylic esters and ethers, saturated hydrocarbons, and aro- matic chloro and phosphate compounds on various metals, polished quartz and synthetic sapphire (a- alumina) at 20…
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Ultrasmooth Sapphire Produced by Noncontact Polishing
that a hard substrate such as sapphire could not be scraped or chipped away by a soft polishing compound such as is used in the process described.
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Augmented CMP Techniques for Silicon Carbide
Chemical-mechanical polishing (CMP) has proven a powerful tool for the final polishing of semiconductor and compound semiconductor substrates such as silicon, sapphire , gallium arsenide, and indium phosphide.
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Critical parameters for grinding large sapphire window panels
…been previously employed to study sub-surface flaws in polished sapphire.3 In these experiments, two 1.5” x 0.22” x 0.24” bars of sapphire were glued together at polished m-plane or c … faces to make a compound sample.
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Ultrafine Finishing of Ceramics and Metals by Float Polishing
Examination of single-crystal sap- phire showed high densities of dislocations are produced within the nearsurface regions by mechanical polishing with a fine diamond compound .
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Beginning-to-end wafer bonding for advanced optical systems
For example, the back thinning of compound semiconductor devices is often accomplished by attaching the front side of the device to a carrier substrate such as sapphire for support during the backside grinding and polishing operations.
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Precision Engineering > PRECISION ENGINEERING
An LP600 precision Lapping and Polishing Machine (Figure 1.20 (b)) is found to be ideal for compound semiconductor wafer backthinning, ceramic substrate lapping, silicon wafer back thinning and sapphire wafer back thinning.