Thermally Conductive Resins and Compounds
from Master Bond, Inc.
Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]
- Features: Anti-static or ESD Control; Thermally Conductive; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy
- Type: Thermally cured
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Features: Thermally Conductive
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Form / Shape: Liquid
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: Thermally Conductive; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy
- Type: Thermally cured
- Form / Shape: Liquid
from Wacker Chemical Corp.
Pourable, addition-curing, two-component silicone rubber that vulcanizes at room temperature. Special features. very good flowability and self-deaeration. fast and non-shrink cure at room temperature which can be accelerated considerably by the application of heat. high hardness (Shore A approx. [See More]
- Features: Thermally Conductive
- Chemical System: Silicone
- Type: Elastomer
- Industry: Tooling
from Bluestar Silicones USA Corp.
Elastomer - RTV 2 - polyaddition heat curing - Black. Solventless, Very low viscosity, Quick curing, Long potlife, Excellent dielectric performances, High thermal and Fire resistance (UL 94 V0). Properties. Viscosity 3200. Hardness Sha 48. Description. Potting and encapsulation of electronic and... [See More]
- Features: Flame Retardant; Thermally Conductive
- Chemical System: Silicone
- Type: Elastomer
- Form / Shape: Liquid
from Epoxies Etc...
70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]
- Features: Thermally Conductive
- Chemical System: Epoxy
- Type: Thermally cured
- Form / Shape: Liquid
from Henkel Corporation - Electronics
Hysol ® GR750 ™ are high thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys. [See More]
- Features: Thermally Conductive
- Thermal Conductivity: 2.1
- Industry: Electronics
- CTE: 13
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Features: Flame Retardant; UL; Thermally Conductive
- Form / Shape: Liquid
- Type: Thermally cured
- Industry: Electronics
from Epoxies Etc...
50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability. [See More]
- Features: Thermally Conductive
- Chemical System: Silicone
- Type: Elastomer
- Industry: Electronics; Electrical Power or High Voltage; OEM or Industrial
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyolefin
- Type: Thermoplastic
- Form / Shape: Pellets
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Features: Flame Retardant; UL; Thermally Conductive
- Form / Shape: Liquid
- Type: Thermally cured
- Industry: Electronics
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyolefin
- Type: Thermoplastic
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Form / Shape: Pellets