Electrically Conductive Compound Resins and Compounds
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Features: Anti-static or ESD Control; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy; Polyurethane
- Type: Thermally cured
- Form / Shape: Liquid
from AGC Chemicals Americas, Inc.
Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon ® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and... [See More]
- Features: Flame Retardant; UL; Electrically Conductive Compound
- Chemical System: Fluoropolymer
- Type: Thermoplastic
- Form / Shape: Pellets
from Cri-Tech, Inc.
Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]
- Features: Anti-static or ESD Control; Electrically Conductive Compound
- Chemical System: Fluoropolymer
- Type: Thermoplastic
- Industry: OEM or Industrial
from Duvelco Limited
Ducoya® G202 C is a high-purity-filled polyimide for semiconductor applications requiring electrically conductive material. This material is intended for use in the latest semiconductor manufacturing operations, especially where process conditions could generate static electricity. Connecting such... [See More]
- Features: Electrically Conductive Compound
- Chemical System: Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Form / Shape: Pellets
from Master Bond, Inc.
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]
- Features: Anti-static or ESD Control; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy
- Type: Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]
- Features: Anti-static or ESD Control; Thermally Conductive; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy
- Type: Thermally cured
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured... [See More]
- Features: Anti-static or ESD Control; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy; Polyurethane
- Type: Thermally cured
- Form / Shape: Liquid
from Rieke Metals, Inc.
Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Features: Electrically Conductive Compound
- Form / Shape: Liquid
- Type: Thermoplastic
- Industry: Electronics; Semiconductors or IC Packaging
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: Thermally Conductive; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy
- Type: Thermally cured
- Form / Shape: Liquid
from 3M Advanced Materials Division
Through 3M's Thermoplastic Compounding facility in Hebron, KY, customers have the ability to create formulations geared to providing specific properties or funtions which are not inherent in the base resin. Enhancements can range from making the base polymer easy to extrude, to adding properties... [See More]
- Features: Anti-static or ESD Control; Electrically Conductive Compound
- Chemical System: Polypropylene; Polyamide; PEEK; Polyphenylene Oxide; Polyurethane; Polyetherimide; Polyetheretherketone
- Type: Thermoplastic
- Form / Shape: Pellets
from Port Plastics, Inc.
TECAFLON PVDF ELS is a filled PVDF fluoropolymer with conductive carbon black offering an electrical conductive PVDF. It combines high thermal loading resistance, high density and high chemical resistance with very low moisture absorption. It also exhibits resistance to UV radiation. TECAFLON ®... [See More]
- Features: Electrically Conductive Compound
- Chemical System: Fluoropolymer
- Type: Thermoplastic
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Features: Electrically Conductive Compound
- Form / Shape: Liquid
- Type: Thermoplastic
- Industry: Electronics; Semiconductors or IC Packaging
from 3M Advanced Materials Division
In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]
- Features: Anti-static or ESD Control; Flame Retardant; Electrically Conductive Compound
- Chemical System: Polypropylene; Polyamide; Fluoropolymer; Tertrafluoroethylene, Hexafluoropropylene
- Type: Elastomer; Thermoplastic; Thermally cured; Optical
- Form / Shape: Liquid; Pellets
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Features: Electrically Conductive Compound
- Form / Shape: Liquid
- Type: Thermoplastic
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Features: Electrically Conductive Compound
- Form / Shape: Liquid
- Type: Thermoplastic
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Features: Electrically Conductive Compound
- Form / Shape: Liquid
- Type: Thermoplastic
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Features: Electrically Conductive Compound
- Form / Shape: Liquid
- Type: Thermoplastic
- Industry: Electronics; Semiconductors or IC Packaging