Products & Services
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech's "clean" mixing operation provides overall contamination
- Chemicals / Chemical Products: Pigments / Dyes, Polymers
- Form: Bulk Solids / Granules, Other
- Location: North America, United States Only, Northeast US Only
- Materials / Material Products: Elastomers / Rubber, Plastics
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech’s “clean” mixing operation provides overall
- Chemicals / Chemical Products: Polymers
- Form: Bulk Solids / Granules
- Materials / Material Products: Specialty / Exotic Alloy
- Process Technology: Compounding, Formulation, Other
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech’s “clean” mixing operation provides overall
- Dispersion (Coating / Concentrate): Yes
- Material Type: Polymer
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Supplier: Cri-Tech, Inc.
Description: Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin-screw mixing capacity. Cri-Tech’s “clean” mixing operation provides overall
- Location: North America, United States Only, Northeast US Only
- Materials / Material Products: Elastomers / Rubber, Plastics
- Run / Batch Size: Laboratory / Benchtop Scale
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Supplier: Advanced Abrasives Corp.
Description: Compounds Advanced Abrasives diamond compounds are formulated using our tightly graded diamond powders and proprietary carriers for fast cutting action, excellent surface finish and easy cleanup. Available as natural diamond (NDP) or synthetic monocrystalline (MDP and RDP)
- Abrasive Grain Type: Diamond
- Form: Paste / Cream, Other
- Grading / Grit System: Micron Graded
- Products / Materials Finished: Specialty / Other
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride:
- Compound Type: Thermally Conductive
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Supplier: Watts
Description: Drinking water systems provide filtration from basic to highlyadvanced levels depending on the application and requirements. Basic systems can provide filtration for sediment and taste/odor reduction while advanced systems provide basic filtration and reduce lead, cyst, and volatile organic
- Trigger: System
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Supplier: Advanced Abrasives Corp.
Description: cBN (Cubic Boron Nitride) Our high quality cBN cubic boron nitride powder is combined with our proprietary water, oil and universal carrier types to provide slurries, suspensions and compounds in abrasive sizes ranging from 0.125 µm to 60 µm.
- Abrasive Grain Type: Ceramic, Other
- Form: Paste / Cream, Other
- Grading / Grit System: Micron Graded
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Supplier: Advanced Abrasives Corp.
Description: Compounds Advanced Abrasives diamond compounds are formulated using our tightly graded diamond powders and proprietary carriers for fast cutting action, excellent surface finish and easy cleanup. Available as natural diamond (NDP) or synthetic monocrystalline (MDP and RDP)
- Abrasive Grain Type: Diamond
- Form: Paste / Cream, Other
- Grading / Grit System: Micron Graded
- Products / Materials Finished: Specialty / Other
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Supplier: Advanced Abrasives Corp.
Description: Compounds Advanced Abrasives diamond compounds are formulated using our tightly graded diamond powders and proprietary carriers for fast cutting action, excellent surface finish and easy cleanup. Available as natural diamond (NDP) or synthetic monocrystalline (MDP and RDP)
- Abrasive Grain Type: Diamond
- Form: Paste / Cream, Other
- Grading / Grit System: Micron Graded
- Products / Materials Finished: Specialty / Other
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Supplier: Xoxide
Description: . Ceramique does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability. During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride:
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: % thermally Conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability. Controlled
- Compound Type: Thermally Conductive
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Supplier: Envirco
Description: Introduction A Second Generation FFU While Envirco® has introduced a variety of proprietary products, one of its most successful continues to be the MAC 10® family of fan filter units (FFUs). We add to this industry’s leading line of products a second generation FFU
- Applications: Air Handling Units / HVAC
- System: Packaged (Complete System)
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® FR coverlay (bondply) composites are constructed of DuPont™ Kapton® polyimide film, coated on one side (both sides) with a proprietary B-staged acrylic adhesive. They are used to encapsulate etched details in flexible and rigid-flex multilayer constructions
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: DuPont Electronics & Imaging
Description: Pyralux® LF Coverlay and Pyralux® LF Bondply DuPont™ Pyralux® LF coverlay (bondply) composites are constructed of DuPont™ Kapton® polyimide film, coated on one side (both sides) with a proprietary B-staged acrylic adhesive. They are used to encapsulate
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: Daemar Inc.
Description: low compression set (12% pellets/15% O-rings per ASTM D 395B) and improved seal force retention. It is a carbon black filled compound utilizing new and proprietary cure chemistry technology with mechanical properties designed for improving sealing performance in both high temperature
- Cross-section: 0.1390 inch
- Inside Diameter (ID): 1.61 inch
- Outside Diameter (OD): 1.88 inch
- Synthetic Rubber Materials (Thermosets): Fluoroelastomer (FKM)
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Supplier: DuPont Electronics & Imaging
Description: side with a proprietary B-staged modified epoxy adhesive. The Pyralux® HXI coverlay is used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental and electrical insulation. Features Uniform matte black appearance
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with a proprietary B-staged modified epoxy adhesive. The Pyralux® HXC coverlay is used to
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Dielectric Constant (Relative Permittivity): 3.6 to 3.7
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxies Etc...
Description: 20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP or MCM die attach applications. Excellent bleed performance
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high adhesion to a variety of substrates
- Coeff. of Thermal Expansion (CTE): 26.67 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK FS 849-T, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a wide variety of die sizes where thermal and electrical conductivity are needed in a high
- Coeff. of Thermal Expansion (CTE): 24.44 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Nylok Corporation
Description: Nycote® Plus, our next generation thread protection and masking solution, utilizes Nylok’s enhanced white proprietary fluoropolymer powder thread to provide an affordable and efficient way of protecting fastener threads from weld spatter and electro-deposited paints, primers and
- Industry: Automotive, Electronics, Marine, OEM / Industrial, Process Equipment, Other
- Substrate / Surface: Metal
- Type: Masking Compounds, Stop Offs
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and
- Coeff. of Thermal Expansion (CTE): 23.33 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: MS4525 The MS4525 is a small, ceramic based, PCB mountedpressure transducer from TE Connectivity. The transducer isbuilt using our proprietary UltraStable process and the latestCMOS sensor conditioning circuitry to create a low cost, highperformance transducer designed to meet the
- Pressure Reading: Absolute, Differential, Gauge, Compound
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Supplier: Port Plastics, Inc.
Description: a proprietary formulation of flame retardant polypropylene is designed for wet process tools, furniture, and cabinetry construction for the semiconductor industry.
- Chemical / Polymer System Type: Polypropylene (PP)
- Features: Flame Retardant (e.g. UL 94 Rated)
- Industry: Semiconductor / IC's, Other
- Material Type / Grade: Thermoplastic
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and impact
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Port Plastics, Inc.
Description: Reinforced with a proprietary synthetic mica, Semitron® ESd 500HR offers an excellent combination of low frictional properties and dimensional stability. Semitron® ESd 500HR should be considered wherever PTFE is used. It is ideal for applications where controlled bleed off of static charges
- Features: Anti-static
- Industry: Other
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Supplier: Port Plastics, Inc.
Description: Semitron® MDS 100 was developed specifically to provide a highly rigid, stable, moisture-resistant platform for precision structural applications. Its unique, proprietary polymer matrix makes it ideal for use in parts where fine machining and precise tolerances are critical. With flexural
- Industry: Other
- Material Type / Grade: Thermoplastic
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Supplier: Epoxies Etc...
Description: 10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Strength: 560 kV/in
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Supplier: Nylatech, Inc.
Description: NYLATECH® SL contains a proprietary solid lubricant, which offers a lower Dynamic Coefficient of Friction, and Superior Wear Resistance to all other grades of Type 6 Monomer Cast Nylon. NYLATECH® SL is used for Dynamic applications where external lubrication is difficult or impossible
- Chemical / Polymer System Type: Polyamide / Nylon
- Coeff. of Thermal Expansion (CTE): 5.50E7 µin/in-F
- Elongation: 20 to 45 %
- Industry: Industrial
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Supplier: Esprix Technologies
Description: source your raw material needs today. Toner Technology: Waxes The Esprix Specialty Wax line offers features product of various petroleum grades that include paraffin, microcrystalline and proprietary converted products designated as specialty products. Features
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Supplier: Unique Technologies Associates
Description: This product utilizes the proprietary UTA Nano Technology to achieve the highest speeds, quietest and smoothest performance of the CSL products. It is unprecedented in its ability to increase service life by reducing wear caused by high speed, high loads, and high temperatures. The superior
- Chemistry / Constituents: Specialty / Other, Synthetic / Semi-synthetic
- Operating / Use Temperature: 250 F
- Type: Solid Lubricant / Dry Film
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Supplier: Unique Technologies Associates
Description: This product utilizes the proprietary UTA Nano Technology to achieve the highest speeds, quietest and smoothest performance of the CSL products. It is unprecedented in its ability to increase service life by reducing wear caused by high speed, high loads, and high temperatures. The superior
- Chemistry / Constituents: Specialty / Other, Synthetic / Semi-synthetic
- Operating / Use Temperature: 450 to 660 F
- Type: Solid Lubricant / Dry Film
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Supplier: Unique Technologies Associates
Description: This product utilizes the proprietary UTA Nano Technology to achieve the highest speeds, quietest and smoothest performance of the CSL products. It is unprecedented in its ability to increase service life by reducing wear caused by high speed, high loads, and high temperatures. The superior
- Chemistry / Constituents: Specialty / Other, Synthetic / Semi-synthetic
- Operating / Use Temperature: 250 to 450 F
- Type: Solid Lubricant / Dry Film
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Supplier: Metalor Technologies USA Corporation
Description: Based on our proprietary and leading technology in precious metal powders and flakes, we develop and produce screen-printing pastes for rear-side and front-side metallization of crystalline silicon photovoltaic cells. In collaboration with leading photovoltaic (PV) producers and research
- Compound Type: Electrically Conductive
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Supplier: LG Chemical of America Inc.
Description: EPC Engineering Plastic Compound Highly-functional engineering plastic whose properties have been enhanced with compounding Engineering plastic is lighter yet stronger than general plastics. Thus, it is used as an industrial material for automobiles and electronic parts
- Chemical / Polymer System Type: Specialty / Other
- Material Type / Grade: Thermoplastic
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Supplier: Nylatech, Inc.
Description: considerations include environments with: Shock Abrasion Vibration Impact Moisture absorption Nylatech Nythane Oil: Using the same proprietary process as our Nylatech® Oil, our liquid lubrication impregnated within the
- Chemical / Polymer System Type: Polyamide / Nylon
- Coeff. of Thermal Expansion (CTE): 5.50E7 µin/in-F
- Elongation: 40 to 50 %
- Industry: Industrial
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Supplier: Graphene Laboratories, Inc.
Description: is formulated with proprietary nanomaterials and fillers. G6E-HTSG™ epoxy has good electrical conductivity. G6E-HTSG™ epoxy incorporates a proprietary graphene additive to enhance crack resistance. A heating oven is required for curing. Uses for G6E-HTSG™ epoxy include electronics
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: RS Components, Ltd.
Description: T-flex 600 Seriesâ?¢ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boron nitride filler in the composition. While extremely soft, T-flex 600 recovers to more than 90% of its
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Thermal Conductivity: 3 W/m-K
- Use Temperature: -49 to 392 F
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Supplier: RS Components, Ltd.
Description: T-flex 600 Seriesâ?¢ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boron nitride filler in the composition. While extremely soft, T-flex 600 recovers to more than 90% of its
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Thermal Conductivity: 3 W/m-K
- Use Temperature: -49 to 392 F
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Supplier: RS Components, Ltd.
Description: T-flex 600 Seriesâ?¢ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boron nitride filler in the composition. While extremely soft, T-flex 600 recovers to more than 90% of its
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Thermal Conductivity: 3 W/m-K
- Use Temperature: -49 to 392 F
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Supplier: RS Components, Ltd.
Description: T-flex 600 Seriesâ?¢ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boron nitride filler in the composition. While extremely soft, T-flex 600 recovers to more than 90% of its
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Thermal Conductivity: 3 W/m-K
- Use Temperature: -49 to 392 F
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Supplier: Graphene Laboratories, Inc.
Description: based on advanced proprietary technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A heating oven is
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: . G6E-RTSG™ epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity. G6E-RTSG™ epoxy also incorporates a proprietary graphene additive to enhance the crack resistance of the epoxy adhesive. G6E-RTSG™ epoxy has outstanding electrical
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: LG Chemical of America Inc.
Description: POE Polyolefin Elastomer Differentiated products based on LG Chem's proprietary metallocene catalyst LG Chem's POE is a copolymer of ethylene and octene or ethylene and butene produced using its proprietary metallocene catalyst. LUCENE is LG Chem's representative POE product
- Chemical / Polymer System Type: Specialty / Other
- Material Type / Grade: Elastomer / Rubber
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Supplier: Graphene Laboratories, Inc.
Description: bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSAL™ Epoxy is formulated with a blend of proprietary nanomaterials,
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Description: ENVIROLASTIC AR530 BRUSH GRADE is a 100% solids, fluid applied polyurea elastomer repair material that is based on proprietary polyurea formulation and a modified amine curing mechanism. It can be applied at thicknesses of 30 - 250 mils in consecutive multiple applications. Fast
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Elongation: 530 %
- Features: Caulk / Grout
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Supplier: Mitsui Chemicals America, Inc.
Description: FTR™ is a high-grade hydrocarbon resin that is a colorless and transparent material created by a proprietary oligomer manufacturing technology. The hydrocarbon resin possesses excellent heat resistance and low odor, and is compatible with various plastics and elastomers. Multiple grades are
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Supplier: Fujipoly® America Corp.
Description: different properties such as conductive and non-conductive segments, or color coding. Specifically custom designed to eliminate multiple extruded components by combining different elements into one unitized design. Quick turnaround and cost-effective tooling preparation for your proprietary
- Features: EMI / RFI Shielding
- Material Type / Grade: Elastomer / Rubber
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Supplier: Ensinger North America
Description: TECAGLIDE green is an internally lubricated cast nylon that utilizes a proprietary solid lubricant package. This state of the art technology allows the modified PA6 cast to show extremely good sliding and wear characteristics with very low friction and reduced abrasion, even in dry running
- Chemical / Polymer System Type: Polyamide / Nylon
- Elongation: 10 to 17 %
- Industry: Industrial, Building / Construction
- Material Type / Grade: Thermoplastic
Find Suppliers by Category Top
Featured Products Top
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capabilities. The most extensive line of proven FKM products of any Custom Formulator or Compounder. Proprietary Recycling Technology and Product Line. (read more)
Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc. -
compounds (ETFE, EFEP, PVDF, FEP, PFA, PEEK Blends) & TPEs, Masterbatches (pelletized rubber and proprietary additives), Cri-Spersions (activators in rubber), as well as Hydrogenated Nitrile (HNBR), & other polymer materials. Quality systems with 100% traceability. All systems are interconnected to allow real time root cause analysis. (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
-effective tooling preparation for your proprietary needs. For engineering assistance and more detailed information, please contact customer service. APPLICATIONS: RFI/EMI gaskets and shielding Electrostatic discharge (ESD) Electrical and Electronic parts (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
Formulation Development, Custom Rubber and Plastic Compounding, Specialty Toll Manufacturing & Color development. Cri-Tech's state of the art facility includes both internal and twin-screw mixing capabilities. Cri-Tech’s “clean” mixing operation provides overall (read more)
Browse Elastomers and Rubber Compounds Datasheets for Cri-Tech, Inc. -
), Fluoroplastic compounds (ETFE, EFEP, PVDF, FEP, PFA, PEEK Blends) & TPEs, Masterbatches (pelletized rubber and proprietary additives), Cri-Spersions (activators in rubber), as well as Hydrogenated Nitrile (HNBR), & other polymer materials. Quality systems with 100% traceability. All systems are interconnected to allow real time root cause analysis. (read more)
Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc. -
any size or proprietary shape for the perfect component fit. Once installed, the uniquely formulated silicone rubber material efficiently transfers heat from a heat-generating electronic component to a nearby heat sink. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
Fluon+™ mPLASTICS Fluon+™ mPLASTICS are new compounds modified with fluoropolymer resins. These fluoropolymers can be tailored to achieve specific performance requirements. The proprietary fluoropolymer (read more)
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Dexmet® Corporation, a part of PPG’s engineered materials division
Expanded metal foils for Zone 1 -3 applications
commitment to quality control and process improvement, including SPC implementation. Ongoing innovations include our unique strand annealing furnace as well as a host of other highly specialized proprietary equipment. Dexmet’s solid customer base is predicated upon its reputation as the premier (read more)
Browse Conductive Compounds Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
structure and backing options with an environmentally friendly, proprietary stearate coating called No-Fil. This technology repels debris from the grain and is especially effective in diverse finishing tasks where material tends to stick to the abrasive (like paint (read more)
Browse Abrasive Compounds and Abrasive Slurries Datasheets for Norton Abrasives -
- Molded triggers that preserve tactile response - Hermetic sealing ribs to block moisture, dust, and contaminants - Proprietary silicone compounds built to perform in extreme environments Connect with our experts to see how the right sealing design can extend equipment life. (read more)
Browse Switch Sealing Boots Datasheets for APM Hexseal Corp.
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Ultrahigh Flow Liquid Crystal Polymer
A new ow improvement technology (FIT) including. reactive extrusion and Celanese proprietary compounding technology enables a high ow liquid crystal polymer (LCP) with lower warpage. LCP polymer chain and its molecular weight distribution were tailored via reactive extrusion, while ller structure
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Case History: New Plant Incorporates Tried-and-True Feeders
to toll-process for various companies. The company produces polycarbonate resins (PCs), acrylonitrile-butadiene-styrenes (ABSs), polybutylene terephthalate (PBTs), and various polycarbonate alloys. These products, most of them proprietary compounds, are used in various applications in the automotive, consumer
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Speeding Smart Discovery in High Point
. Dr. Mjalli spent the first two years at TransTech exploring and developing TTP, or Translational Technology Platform, a proprietary automated process that evaluates and screens drug molecules and compounds in order to produce high quality candidates for development. TransTech also has a set
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A Miracle Whip? Kraft Looks to Pharma for Inspiration
of growth in the food industry and for Kraft, " says Todd Abraham, Kraft 's senior vice president of nutrition and research. Medisyn describes itself as bioactive compound design and discovery company for pharmaceuticals, nutraceuticals and animal health products. Through its proprietary Forward
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Drug Development Through the Looking Glass
compounds. When something promising shows up, the team proposes possible chiral synthons and intermediates to serve the needs of development, scale-up, and manufacturing. We talk with chemists and in some cases provide very small quantities of new building blocks, says Stein. With its 2001
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Coping with Phase III Testing
, accessing proprietary formulation and dosage technology, and easier entry into global regulatory jurisdictions where the contractor may be experienced. Contracting (or in-licensing) to access proprietary chemical technology, such as a patented asymmetric hydrogenation, probably would have occurred before
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Progressive Cavity Pumps Solve Magnesium Hydroxide Problems
At a power plant site in the U.S., Fuel Tech was cost-effectively. and safely reducing slag buildup in multiple coalfired. power plant boilers through the use of a proprietary. chemical injection process. One chemical used in this process. is magnesium hydroxide. Magnesium hydroxide
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
pullout likely related to patent dispute A legal dispute with Nano-Proprietary has placed an obstacle in the path of Toshiba and Canon's promotion of SED displays at next month's Consumer Electronics Show, an important event for a technology scheduled to be in commercial production next year. Qualcomm
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Compounding of Engineering Thermoplastics
These are ETP resin producers with internal compounding facilities that are used principally to produce proprietary compounds from captively produced resins.
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Evaluation of the GADD45α‐GFP GreenScreen HC assay for rapid and reliable in vitro early genotoxicity screening
ABSTRACT Twenty‐two of Galderma's proprietary compounds were tested in the GADD45α‐GFP ‘GreenScreen HC’ assay (GS), the SOS‐ChromoTest and the Mini‐Ames to evaluate GSs performance for early genotoxicity screening purposes.
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Characterisation of sulphoxides by atmospheric pressure ionisation mass spectrometry
Abstract An observation that a series of proprietary compounds containing a methyl thiophenyl group all underwent metabolic S‐oxidation, and that the product ion spectra of the resulting S‐oxides showed methyl radical loss under low‐energy atmospheric pressure ionisation tandem mass spectrometry (API‐MS/MS) conditions …
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Measurement and control of the mark relationship quality
Parking tea factor structure Weitere mark compound (Brand Attachment) mark attractiveness Nostalgic compound zurMarke, mark confidence partner quality (6) X X X X X X X .
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Corporate fire management
Such mark compounds belong in the meantime to the standard-repertoire of the direction of mark portfolios (Uggla and ace mountain 2010, S. 92) - and they can explicitly relate also to alliances between manufacturer and trader marks (Arnett et al. 2010).
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Mark policy
The conceptualization of the mark relationship quality bases Fournier's on factors love / passion, interdependence, bond, intimacy, partner quality and mark compound .
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Validation of a high‐throughput absorption, distribution, metabolism, and excretion (ADME) system and results for 60 literature compounds
We sought to quickly build and validate this system for microsomal clearance assessment using 60 commercially available non‐ proprietary compounds that are non‐DEA‐restricted in addition to 36 proprietary Millennium compounds that had already been assessed using a low‐throughput infrastructure.
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Internetworking
As, involved routers forgive no own connecting identifications how in the verbindungsorientierten case can be managed also no dedicated compounds of routers.