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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 1271075-TMS320C6413G TS500 Series: TMS320C6410/12/13/18 Packaging: Tray Type: Fixed Point Operating Temperature Range: 0°C ~ 90°C (TC) Voltage - I/O: 3.30V Package: 288-BBGA, FCBGA
- Clock Speed: 500 MHz
- Interfaces: I²C, Other
- Operating Temperature: 0.0 to 90 C
- Supply Voltage: Other
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Supplier: Win Source Electronics
Description: Manufacturer: Texas Instruments Win Source Part Number: 797323-TMS320C6418GT S600 Series: TMS320C6410/12/13/18 Packaging: Tray Type: Fixed Point Operating Temperature Range: 0°C ~ 90°C (TC) Voltage - I/O: 3.30V Package: 288-BBGA, FCBGA
- Clock Speed: 600 MHz
- Data Bus: 32-Bit
- Interfaces: I²C, Other
- Operating Temperature: 0.0 to 90 C
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Supplier: Broadcom Inc.
Description: The ExpressLane™ PEX 8614 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 12 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The PEX 8614 architecture supports packet cut-thru with the industry's
- Device Type: Packet Switching Fabric Chip
- IC Package Type: PBGA
- Interface: PCI Express
- Pin Count: 12 #
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Supplier: Broadcom Inc.
Description: The ExpressLane™ PEX 8612 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 3 ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 12-lane switch enables users to add scalable, high bandwidth, non-blocking
- Device Type: Packet Switching Fabric Chip
- IC Package Type: FCBGA
- Interface: PCI Express
- Pin Count: 3 #
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Supplier: Broadcom Inc.
Description: The ExpressLane™ PEX 8613 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, with support for 3 ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 12-lane switch enables users to add scalable, high bandwidth, non-blocking
- Device Type: Packet Switching Fabric Chip
- IC Package Type: PBGA
- Interface: PCI Express
- Pin Count: 3 #
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Supplier: Broadcom Inc.
Description: The ExpressLane™ PEX 8632 device offers 32 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 12 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 32-lane switch enables users to add scalable, high bandwidth,
- Device Type: Packet Switching Fabric Chip
- IC Package Type: FCBGA
- Interface: PCI Express
- Pin Count: 12 #
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Supplier: PEI-Genesis
Description: GT 5C 3#12, 2#0 SKT RECP
- Gender: Female / Jack
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Supplier: PEI-Genesis
Description: GT 5C 3#12, 2#0 PIN RECP
- Gender: Female / Jack
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Supplier: PEI-Genesis
Description: GT 8C 6#12, 2#0 SKT PLUG
- Gender: Male / Plug
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Supplier: PEI-Genesis
Description: GT 5C 3#12, 2#0 SKT PLUG
- Gender: Male / Plug
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Supplier: Acme Chip Technology Co., Limited
Description: SWITCH TOGGLE DPDT 12A 250V
- Maximum AC Voltage Rating: 250 volts
- Maximum Current Rating: 12 amps
- Momentary Contact: Yes
- Momentary Contact Switch Function: Three Position Momentary (Center OFF), Other
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Supplier: Microchip Technology, Inc.
Description: the 12 Gbps SmartRAID 3100 Series RAID Adapters. Additional Features 24 12Gbps SAS/SATA ports with RAID 0, 1, 10, 5, 50, 6 and 60 with hardware acceleration Two additional 6G SAS/SATA boot ports with RAID 1 support Native HBA modes Flexible
- RAID Level Supported: RAID 0, RAID 1, RAID 5, RAID 50, Other
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Supplier: VAST STOCK CO., LIMITED
Description: Single Board Computers aTCA-9700/D2680v2/M1 6Gx4 /IntelR XeonR Processor E5-2658 v2 (25M, 2.40 GHz, 8.0 GT/s IntelR QPI) FC-LGA12A, Tray/DDR3-1866 VLP RDIMM 16GB x4
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Supplier: Advantech
Description: Controller supports PCI Express Base Specification 3.0 (8 GTs) PCI Express x8 lanes Intel® QuickAssist Technology for Crypto and Compression: Compression/Decompre ssion(Deflate) RSA Decrypt IPSec/SSL, up to 40Gbps Wireless: KASUMI, ZUC, SNOW 3G Bulk: AES, 3DES, RC4 Hash: MD5,
- Processor / CPU Type: Other
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Supplier: VAST STOCK CO., LIMITED
Description: PCI Interface IC PCIe Gen2 5.0GT/s 48-Lane 12 Port
- IC Package Type: Other
- RoHS Compliant: Yes
- TJ: -40 to 85 C
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Supplier: Rochester Electronics
Description: QorIQ, 64b Power Arch, 8x 1.2GHz threads, 1.6GT/s DDR3/3L, 4x10GE, crypto enabled, 0-105C, Rev 1.1
- IC Package Type: BGA, Other
- Life Cycle Stage: Other
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Supplier: Microchip Technology, Inc.
Description: applications, including optional entry-level hardware RAID 0/1/10/5 modes without any external DRAM and supports Smart Storage Solutions Drivers for all major operating systems and a comprehensive set of management tools, including a GUI and CLI. The 12 Gbps SmartIOC 2100 controllers
- IC Package Type: Other
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Supplier: Advantech
Description: -core processor-based, high-end network communications appliance is optimized for computing power and high speed, high density I/O with best-in-class energy efficiency. Two Intel® Xeon E5-2600 v3 processors (Socket R3) provide the latest architectural enhancements, larger on chip cache
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Supplier: VAST STOCK CO., LIMITED
Description: Microprocessors - MPU QorIQ,64b Power Arch,8x 1.2GHz threads,1.6GT/s DDR3/3L,4x10GE,crypt o disabled,0C-105C,Rev 1.1,LoPwr
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Supplier: Teledyne e2v Semiconductors
Description: > 60.88 MeV.cm²/mg • SEU evaluated from LET 2.6 MeV.cm²/mg & Upset cross-section @ 60.88 MeV.cm²/mg = 8.73E-12 cm²/bit • SEFI evaluated from LET 2.6 MeV.cm²/mg & SEFI cross-section @ 60.88 MeV.cm²/mg = 4.17E-4 cm²/device • TID
- Memory Category: DRAM
- Operating Temperature: -55 to 125 C
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Supplier: Win Source Electronics
Description: ) @ If: 950 mV @ 12.5 A Current - Reverse Leakage @ Vr: 10 µA @ 800 V Voltage - Peak Reverse (Max): 800 V Mounting Type: Through Hole Package / Case: 4-SIP, TS-6P Supplier Device Package: TS-6P Temperature Range - Operating: -55°C ~ 150°C (TJ) ECCN: EAR99
- Diode Type: Other
- IR: 0.0100 mA
- Tj: -55 to 150 C
- VF: 0.9500 volts
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Supplier: Supermicro Computer, Inc.
Description: Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Intel® Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s 2. 12 DIMM, up to 192GB DDR3 1333/ 1066/800 MHz ECC Reg. memory 3. 2
- Form Factor: Rack Mounted
- Server Type: Network Server
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Supplier: ASA Computers, Inc.
Description: Intel® Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s Intel® 5520 (Tylersburg) Chipset Up to 192GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM 12X3.5 Hot Swap SATA drive bay Intel® 82576 Dual-Port Gigabit Ethernet Controller
- Hard Drives Supported: Other
- I/O Ports: Serial, USB
- Network: 10Base-T Ethernet, Fast Ethernet, Gigabit Ethernet
- Operating Temperature: 10 to 35 C
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Supplier: Supermicro Computer, Inc.
Description: . Intel® Dual 82574L Gigabit Ethernet Controller 5. 6x SATA (3.0Gbps) Ports RAID 0, 1, 5, 10 6. 2 (x16) PCI-Express 2.0, 1 (x4) PCI-Express (using X8 slot), 2x 64-bit 133/100MHz PCI-X, 1x 32-bit PCI Slots 7. Realtek ALC883 7.1 HD Audio 8. 12x USB 2.0 Ports 9. 2x
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Supplier: Yang Ming International Corporation
Description: Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s 2. Up to 192GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM / 48GB Unbuffered DIMM 3. 1 (x16) PCI-E 2.0 for Double-Width GPU 4. Integrated IPMI 2.0 with KVM and Dedicated LAN 5. Dual Intel® 82574L Gigabit Ethernet
- Form Factor: Rack Mounted
- I/O Ports: Serial, USB
- Network: Gigabit Ethernet
- Operating Systems Supported: Microsoft® Windows®, Linux®
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Supplier: Yang Ming International Corporation
Description: ) Chipset 4. Intel® Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s 5. 1x 9cm PWM Cooling fan, 1x 12cm PWM Exhaust fan 6. 7x I/O expansion slots 7. 2x Front USB 2.0 ports 8. Power switch and 4 LED indicators 9. Locking Bezel and Locking Side Panel
- Processor: Intel®
- RAM: 12 GB
- Type: Desktop / Tower
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Supplier: Advantech
Description: to 2x PCIe Gen3 x16 slots (half length, low profile) (per Node) Support 1PCIe Gen3 x8 OCP mezzanine (per Node) Optional redundant M.2 storage devices & one 2.5" SSD/HDD slot (per Node) Support up to 12x 3.5" SAS/SATA storage on the system Hot swappable and redundant AC PSU options Carrier
- Form Factor: Rack Mounted
- Server Type: Network Server
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Supplier: Littelfuse, Inc.
Description: polarities. VDRM is measured at IDRM. VS is measured at 100 V/µs. Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for
- Thyristor Type: Silicon Controlled Rectifier (SCR), Sidac
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Supplier: Microchip Technology, Inc.
Description: subject to Microchip's Program Terms and Conditions and requires a myMicrochip account. Additional Features Single-chip, PCIe 3.1 @ 2.5GT/s MII / RGMII Network Controller PCIe Low Power Sub State LPSS L1.1 (snooze) & L1.2 (off) Requires only a single 25MHz
- Product Type: Bus Interface / Adapter
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Supplier: Microchip Technology, Inc.
Description: LANCheck online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account. Additional Features Single-chip, PCIe 3.1 @ 2.5GT/s to 10/100/1000 Ethernet controller PCIe Low Power Sub State LPSS L1.1 (snooze) & L1.2
- Host Bus: Other
- Operating Temperature: -40 to 85 C
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PDF - EMC Data Domain DD670
http://ark.intel.com/products/37104/Intel-Xeon-Processor-E5540-(8M-Cache-2_53-GHz-5_86- GTs -Intel-QPI)Auto 12 Logo 3VA, 0711, 94V0 , Curtiss-Wright, P/N 98131 Rev A02$1.0699 .
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Bill of Materials - EMC Data Domain DD670
PCI Express Switch - 32-Lane, 12 -Port, Gen 2, 5GT/s http://ark.intel.com/products/37104/Intel-Xeon-Processor-E5540-(8M-Cache-2_53-GHz-5_86- GTs -Intel-QPI) Logo 3VA, 0711, 94V0 , Curtiss-Wright, P/N 98131 Rev A02 .
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