Gts 12 94v0

Description: The ExpressLane™ PEX 8614 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 12 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The PEX 8614 architecture supports packet cut-thru with the industry's lowest

• Pin Count: 12 #
• Package Type: PBGA
• Interface: PCI Express
• Device Type: Packet Switching Fabric Chip

Description: The ExpressLane™ PEX 8613 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, with support for 3 ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 12-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide

• Pin Count: 3 #
• Package Type: PBGA
• Interface: PCI Express
• Device Type: Packet Switching Fabric Chip

Description: The ExpressLane™ PEX 8612 device offers 12 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 3 ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 12-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection

• Pin Count: 3 #
• Package Type: FCBGA
• Interface: PCI Express
• Device Type: Packet Switching Fabric Chip

Description: The ExpressLane™ PEX 8632 device offers 32 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 12 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 32-lane switch enables users to add scalable, high bandwidth, non-blocking

• Pin Count: 12 #
• Package Type: FCBGA
• Interface: PCI Express
• Device Type: Packet Switching Fabric Chip

Description: GT 6C 3#0,3#12 PIN RECP

Description: GT 8C 6#12, 2#0 PIN RECP

• Gender: Female / Jack

Description: Manufacturer: Texas Instruments Win Source Part Number: 1271075-TMS320C6413GTS500 Series: TMS320C6410/12/13/18 Packaging: Tray Type: Fixed Point Operating Temperature Range: 0°C ~ 90°C (TC) Voltage - I/O: 3.30V Package: 288-BBGA, FCBGA Mounting: SMD Interface: Host Interface, I2C, McASP,

• Clock Speed: 500 MHz
• Operating Temperature: 0 to 90 C
• Interface Type: I²C
• Features: Other

Description: SWITCH TOGGLE DPDT 12A 250V

• Maximum Current Rating: 12 amps
• Maximum AC Voltage Rating: 250 volts
• Operating Temperature: 32 to 185 F
• Pole & Throw Specifications: DPDT

Description: Manufacturer: Texas Instruments Win Source Part Number: 797323-TMS320C6418GTS600 Series: TMS320C6410/12/13/18 Packaging: Tray Type: Fixed Point Operating Temperature Range: 0°C ~ 90°C (TC) Voltage - I/O: 3.30V Package: 288-BBGA, FCBGA Mounting: SMD Interface: Host Interface, I2C, McASP, McBSP

• Clock Speed: 600 MHz
• Operating Temperature: 0 to 90 C
• Data Bus: 32-Bit
• Interface Type: I²C

Description: PCI Interface IC PCIe Gen2 5.0GT/s 48-Lane 12 Port

• T_J: -40 to 85 C
• Features: Other, RoHS Compliant

Description: Single Board Computers aTCA-9700/D2680v2/M16Gx4 /IntelR XeonR Processor E5-2658 v2 (25M, 2.40 GHz, 8.0 GT/s IntelR QPI) FC-LGA12A, Tray/DDR3-1866 VLP RDIMM 16GB x4

Description: VMwareVSAN High-Speed I/O x8 PCIe Gen 3 8 GT/s (supporting 8 GT/s, 5 GT/s, 2.5 GT/s) PCIe-compliant link training and manual PHY configuration 16x SAS-3 PHYs for high-speed targets (SAS 12 Gbps, 6 Gbps, 3 Gbps, or SATA 6 Gbps, 3 Gbps, 1.5 Gbps) 2x SAS-2 PHYs for

• Number of Channels: 16
• Features: Other
• RAID Level Supported: RAID 1, RAID 5, RAID 50, RAID 0

Description: QorIQ, 64b Power Arch, 8x 1.2GHz threads, 1.6GT/s DDR3/3L, 4x10GE, crypto enabled, 0-105C, Rev 1.1

• Package Type: BGA
• Features: Other

Description: 12th/13th/14th Gen Intel® Core™ Processor LGA1700 12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipset Dual channel DDR4 3200MHz, max. 64GB with two SODIMMs Super Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbE Quad independent 4K

Description: PCIe 3.0, x8 Crypto/ Compression Intel C625 & C626 Server Adapter Controller supports PCI Express Base Specification 3.0 (8 GTs) PCI Express x8 lanes Intel® QuickAssist Technology for Crypto and Compression: Compression/Decompression(Deflate) RSA Decrypt IPSec/SSL, up to 40Gbps Wireless:

• Features: Other

Description: Microprocessors - MPU QorIQ,64b Power Arch,8x 1.2GHz threads,1.6GT/s DDR3/3L,4x10GE,crypto disabled,0C-105C,Rev1.1,LoPwr

Description: PCIe 3.0, x16 Crypto/ Compression Intel C627 Server Adapter Controller supports PCI Express Base Specification 3.0 (8 GTs) PCI Express x16 lanes Intel® QuickAssist Technology for Crypto and Compression Compression/Decompression (Deflate) RSA Decrypt IPSec/SSL, up to 100Gbps Wireless: KASUMI,

• Features: Other

Description: Enterprise Linux, SUSE Enterprise Linux, Ubuntu, CentOS, XenServer, Fedora, Debian, and Solaris Certification for Microsoft WHQL, VMware IOVP, and VMwareVSAN High-Speed I/O x8 PCIe Gen 3 8 GT/s (supporting 8 GT/s, 5 GT/s, 2.5 GT/s) PCIe-compliant link training and manual

• Features: Other

Description: Enterprise Linux, Ubuntu, CentOS, XenServer, Fedora, Debian, and Solaris Certification for Microsoft WHQL, VMware IOVP, and VMwareVSAN High-Speed I/O x8 PCIe Gen 3 8 GT/s (supporting 8 GT/s, 5 GT/s, 2.5 GT/s) PCIe-compliant link training and manual PHY configuration 8x

• Features: Other

Description: GT/s, 5 GT/s, 2.5 GT/s) PCIe-compliant link training and manual PHY configuration 16x SAS-3 PHYs for high-speed targets (SAS 12 Gbps, 6 Gbps, 3 Gbps, or SATA 6 Gbps, 3 Gbps, 1.5 Gbps) 2x SAS-2 PHYs for boot devices (SAS 6 Gbps, 3 Gbps, or SATA 6 Gbps, 3 Gbps, 1.5 Gbps)

• Features: Other

Description: Win Source Part Number: 1021419-TS25PL06G Category: Discrete Semiconductor Products>Diodes - Bridge Rectifiers Package: Tube Standard Package: 1,200 Technology: Standard Diode Type: Single Phase Current - Average Rectified (Io): 25 A Voltage - Forward (Vf) (Max) @ If: 950 mV @ 12.5 A Current

• V_F: 0.95 volts
• I_R: 0.01 mA
• T_j: -55 to 150 C
• Features: Other

Description: Intel® Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s Intel® 5520 (Tylersburg) Chipset Up to 192GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM 12X3.5 Hot Swap SATA drive bay Intel® 82576 Dual-Port Gigabit Ethernet Controller 6x SATA2 (3 Gbps) Ports via ICH10R Controller 1 (x16)

• Supported RAM: 96,000 MB
• Operating Temperature: 10 to 35 C
• Network Protocol: 10Base-T Ethernet, Fast Ethernet, Gigabit Ethernet
• Processor Type: Intel® Pentium® III Xeon^TM

Description: Key Features (per Node) 1. Intel® Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s 2. Up to 96GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM / 12GB Unbuffered DIMM 3. 1 (x8) + 2 (x4) PCI-E 2.0 (w/ riser) 4. Intel® 82576 Dual-Port Gigabit Ethernet + 82599 Dual-Port 10-Gigabit Ethernet

• Server Type: Network Server

Description: Key Features 1. Intel® Core™ i7 / i7 Extreme Edition, and Intel® Xeon® 5600/5500/3600/3500 series processors (QPI up to 6.4 GT/s) 2. Intel® X58 Express Chipset 3. Up to 24GB DDR3 1600/1333/1066/800 ECC / non-ECC Un-Buffered DIMM 4. Intel® Dual 82574L Gigabit Ethernet Controller 5. 6x SATA

Description: Key Features 1. Intel® Core™ i7 / i7 Extreme Edition, and Intel® Xeon® 5600/5500/3600/3500 series processors (QPI up to 6.4 GT/s) 2. Intel® X58 Express Chipset 3. Up to 24GB DDR3 1333/1066/800 ECC / non-ECC Un-Buffered DIMM 4. Intel® Dual 82574L Gigabit Ethernet Controller 5. 6x SATA

Description: Extra High-Density 4U Storage Chassis Intel® Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s Intel® 5520 (Tylersburg) Chipset Up to 192GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM / 48GB Unbuffered DIMM Intel® 82576 Dual-Port Gigabit Ethernet 1 (x16) PCI-E 2.0, 2 (x8) PCI-E 2.0, 1

• Supported RAM: 192,000 MB
• Number of PCI Slots: 2
• Network Protocol: 10Base-T Ethernet, Fast Ethernet, Gigabit Ethernet
• Processor Type: Intel® Pentium® III Xeon^TM

Description: Optimized 3U high-performance server w/ Dual Intel® Xeon® E5-2600 Processors 1. Intel® Xeon® processor E5-2600 family; QPI up to 8GT/s 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM sockets 3. 4x PCI-E 3.0 (x8) slots (2x Full-height Full-length, 2x Full-height Half-length) Via Riser card

• Network Protocol: Gigabit Ethernet
• Processor Type: Intel® Pentium® III Xeon^TM
• Operating System: Linux®, Microsoft® Windows®
• Server Type: Network Server

Description: 8.73E-12 cm²/bit • SEFI evaluated from LET 2.6 MeV.cm²/mg & SEFI cross-section @ 60.88 MeV.cm²/mg = 4.17E-4 cm²/device • TID: 100 krad(Si) High Performances, Compact, and Fault Tolerant • 4GB and 8GB densities; • 72 bits bus width - (Can typically be used as 64 bits data + 8 bits ECC,

• Operating Temperature: -55 to 125 C
• Memory Category: DRAM

Description: (VS and VDRM) and holding current (IH) requirements are available upon request. Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias. Device is designed to meet balance requirements of GTS 8700 and GR 974.

• I_H: 150,000 mA
• Standards and Certifications: RoHS Compliant
• Thyristor Type: Sidac, Silicon Controlled Rectifier (SCR)

Description: (VS and VDRM) and holding current (IH) requirements are available upon request. Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias. Device is designed to meet balance requirements of GTS 8700 and GR 974.

• I_H: 150,000 mA
• Standards and Certifications: RoHS Compliant
• Thyristor Type: Sidac, Silicon Controlled Rectifier (SCR)

Description: (VS and VDRM) and holding current (IH) requirements are available upon request. Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias. Device is designed to meet balance requirements of GTS 8700 and GR 974.

• I_H: 150,000 mA
• Standards and Certifications: RoHS Compliant
• Thyristor Type: Sidac, Silicon Controlled Rectifier (SCR)