-
Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Viscosity: 20,000 to 30,000 cP
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
- Substrate Compatibility: Ceramic / Glass
- Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Epoxy (EP), Gel, Other, Thermal / Heat Conductive, Unfilled
-
Supplier: Henkel Corporation - Industrial
Description: Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable
- Viscosity: 20,000 cP
- Features: Epoxy (EP)
- Cure / Technology: Single Component System
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Operating / Use Temperature: -76 to 302 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 11,811,023.62204722 V/m
- Applications: Electrical / Electronic
-
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 1.7 W/m-K
- Dielectric Strength: 381.0000000000008 kV/in
-
Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: 1 inch
- Viscosity: 1,000 cP
- Use Temperature: -67 to 392 F
- Dielectric Strength: 500.00000000000006 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 360 g Cartridge.
- Kinematic Viscosity (@ 40°C): 542,000 cSt
- Thermal Conductivity: 0.67 W/m-K
- Density / Specific Gravity (@15.6°C, 60°F): 2 specific gravity
- Type: Grease / Gel
-
Supplier: Henkel Corporation - Industrial
Description: repair. LOCTITE STYCAST 1265J Parts AB epoxy encapsulant is designed to have excellent adhesion to a wide variety of substrates. Please refer to the TDS for alternate cure schedules. Good toughness Long pot life Low exotherm Soft gel Non-conductive
- Use Temperature: 40 to 149 F
- Viscosity: 600 cP
- Type: Electrical Insulation / Dielectric
- Chemical System: Epoxy (EP)
Find Suppliers by Category Top
Featured Products Top
-
can be added to produce tougher, more rigid gels. CHT’s silicone gels are available in a variety of hardnesses, penetrations and viscosities. Low viscosity gels will easily flow around complex components and thixo-gels can be applied where non-slumping or sagging is required. Silicone (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials. • Gap filler materials are supplied in a fully cured state and (read more)
Browse Conductive Compounds Datasheets for Fujipoly® America Corp. -
In modern automotive design, lighting systems are not only crucial for safety but also serve as a key aesthetic element. With the widespread adoption of LED technology in vehicle lighting, thermal management has become a critical challenge. This is where thermal conductive silicone gel plays a (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
AE Series Silicone-Free Thermal Gel is designed for CPUs, GPUs, AI servers, data centers, power supplies, and automotive electronics where silicone oil migration and siloxane outgassing cannot be tolerated. Its silicone-free formulation helps reduce contamination risks (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
— NonBuren Tack Gel — NonBuren Tack Gel is a self-adhesive seismic fixation material designed to prevent equipment from overturning during earthquakes. It allows equipment to be fixed directly to the floor without drilling or the use of anchor bolts. Because the (read more)
Browse Shock and Vibration Testing Shakers Datasheets for Links-Japan, LLC -
Anchor-Free Seismic Fixation Suitable for Cleanroom Environment — NonBuren Tack Gel — NonBuren Tack Gel is a self-adhesive seismic fixation material designed to prevent equipment from overturning during earthquakes. It allows equipment to be fixed directly to the (read more)
Browse Datasheets for Links-Japan, LLC -
A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
Highly Comfortable, Non-Flammable, Isolation and High Heat Conducting Gel materials. Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities. ?The basic Gap Filler Pad series (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100?. The mixed components cure into a flexible gel that is highly (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp.
More Information Top
Indicates content that may require registration and/or purchase.
-
Over the breakdown resistance of some liquid insulating materials by stresses of long up to short duration
Process of the high - voltage line in the gel ~ indeder of newcomers Technical university to Dresden.
-
The Hallwilersee project as example of a generous maritime reorganization
The in the run diescs of summer durchgef ~ ihrte Absteckung of the lines in the gel ~ inde have the good Durchffihrbarkeit of the general project besttitigt.
-
"High‐Tech"‐Anwendungen of supramolekularen nanostrukturierten gel materials - from the regenerative medicine to electronic components
…tissue culture, the molecular gels as nanostrukturierte skeletons to the Nachzüchtung of nerve cells were in vivo successful, and has caused the great interest in the nanoelectronics the prospect of the use of selbstorganisierten fibers as one-dimensional conductor in gel materials.
-
Intelligently, bewitches. Textile sensing technology
Mostly, one glues thereto dry gel-electrodes that to produce the contact with the skin with a conductive gel in a manner sponge.
-
Electroviscoelastic materials as active dampers
The electroviscoelastic materials (EVEMs) are composed of a non - conducting gel or polymer with fine conducting powders suspended in it.
-
Conducting cryogel scaffold as a potential biomaterial for cell stimulation and proliferation
All the PPy incorporated gels as well as the non conducting polymer gels degraded to around 12 % of their original weight within 1 month of duration.
-
Metallisation of gel surfaces under ambient conditions.
A room temperature method to coat a non - conducting gel phase with a metal is described, which uses galvanic displacement.
-
Molecular Gels
…see also small-angle neutron scattering structural analysis 275–322 under shear, wormlike micelles 693–5, 696 nodes, junction zones, small-angle scattering 302–3 noise reduction, circular dichroism spectroscopy 434 noise temperature, soft glassy rheology (SGR) 189 non - conducting gels , electronic applications 805–8 non…
-
Theory of DNA electrophoresis (∼ 1999 –2002 ½)
…that Slater et al. used to reject the OMRC hypothesis (and most of the models used to study low field mobility) was developed for uniform and 1-D field lines (even in the presence of non - conducting gel fibers) and is restricted…
-
Determination of idarubicin in human urine by capillary zone electrophoresis with amperometric detection
Non - conductive gel was applied at both ends of the pipette to seal the lead and copper wire.