-
Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
-
Supplier: Henkel Corporation - Industrial
Description: Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable
- Cure Type / Technology: Single Component System
- Viscosity: Up to 20000 cP
-
Supplier: Fujipoly® America Corp.
Description: SARCON® NR-c is a highly conformable, thermally conductive, non-flammable acrylate resin (non-silicone) sheet with thermally conductive fillers. Available in sheets and die-cut forms for formal interface uses wherever gap filler pads are traditionally used. No silicone
- Applied Thickness / Gap Fill: 0.0197 inch
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
-
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK E 3040, Epoxy, Assembly LOCTITE® ABLESTIK E 3040 adhesive is designed for use in automated assembly operations. One component, requires no mixing Fast gel time Low viscosity Fluorescent tracer
- Cure Type / Technology: Single Component System
- Viscosity: 3000 cP
-
Supplier: Fujipoly® America Corp.
Description: Sarcon ® XR-e is highly conformable/thermall y conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface
- Applied Thickness / Gap Fill: 0.0394 to 0.0787 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Applications: Electrical / Electronic
- Chemistry / Constituents: Specialty / Other
- Dielectric Strength: 1.18E7 V/m
- Function: Heat Transfer Fluid
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 381 kV/in
-
Supplier: Master Bond, Inc.
Description: Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
- Dielectric Strength: 400 to 450 kV/in
- Dissimilar Substrates: Yes
-
Supplier: Fujipoly® America Corp.
Description: Sarcon® PG25A Series is a highly conformable and high thermal conducting gel material in a versatile sheet form that easily fits and adheres to most all shapes and sizes of components, including protrusions and recessed areas.
- Applied Thickness / Gap Fill: 0.0394 to 0.1969 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 6.25 to 7.21
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty5-s series is a non-silicon thermally conductive material without volatilization of lowmolecular siloxane, and low total volatile gas. With a thermal conductivity of 9.0 W/m*K, the highdeformation can perfectly fill small air gaps to eliminate tolerances. It can also
- Applications: Aerospace, Automotive / Transportation, Electrical / Electronic, Machine / Gears, Marine, MIL-SPEC / Military, Process Equipment, Specialty
- Chemistry / Constituents: Specialty / Other
- Density / Specific Gravity (@15.6°C, 60°F): 3.3 specific gravity
- Dielectric Strength: 1.20E7 V/m
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty3-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 7.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It can also
- Applications: Aerospace, Automotive / Transportation, Electrical / Electronic, Machine / Gears, Marine, MIL-SPEC / Military, Process Equipment, Specialty
- Chemistry / Constituents: Specialty / Other
- Density / Specific Gravity (@15.6°C, 60°F): 3.4 specific gravity
- Dielectric Strength: 1.20E7 V/m
-
Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: Over 1 inch
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): Over 2.7
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 360 g Cartridge.
- Kinematic Viscosity (@ 40°C): 542000 cSt
- Type: Grease / Gel
-
Supplier: Henkel Corporation - Industrial
Description: form a perfect repair. LOCTITE STYCAST 1265J Parts AB epoxy encapsulant is designed to have excellent adhesion to a wide variety of substrates. Please refer to the TDS for alternate cure schedules. Good toughness Long pot life Low exotherm Soft gel Non-conductive
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Use Temperature: 40 to 149 F
Find Suppliers by Category Top
Featured Products Top
-
can be added to produce tougher, more rigid gels. CHT’s silicone gels are available in a variety of hardnesses, penetrations and viscosities. Low viscosity gels will easily flow around complex components and thixo-gels can be applied where non-slumping or sagging is required. Silicone (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials. • Gap filler materials are supplied in a fully cured state and (read more)
Browse Conductive Compounds Datasheets for Fujipoly® America Corp. -
In modern automotive design, lighting systems are not only crucial for safety but also serve as a key aesthetic element. With the widespread adoption of LED technology in vehicle lighting, thermal management has become a critical challenge. This is where thermal conductive silicone gel plays a (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
In high-performance electronics, the thermal interface has to do more than move heat. It also has to stay clean, stay stable, and avoid contamination risks. The AE Series silicone-free thermal gel is designed for exactly that kind of job (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
— NonBuren Tack Gel — NonBuren Tack Gel is a self-adhesive seismic fixation material designed to prevent equipment from overturning during earthquakes. It allows equipment to be fixed directly to the floor without drilling or the use of anchor bolts. Because the (read more)
Browse Shock and Vibration Testing Shakers Datasheets for Links-Japan, LLC -
Anchor-Free Seismic Fixation Suitable for Cleanroom Environment — NonBuren Tack Gel — NonBuren Tack Gel is a self-adhesive seismic fixation material designed to prevent equipment from overturning during earthquakes. It allows equipment to be fixed directly to the (read more)
Browse Datasheets for Links-Japan, LLC -
A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
Highly Comfortable, Non-Flammable, Isolation and High Heat Conducting Gel materials. Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities. ?The basic Gap Filler Pad series (read more)
Browse Elastomers and Rubber Compounds Datasheets for Fujipoly® America Corp. -
with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100?. The mixed components cure into a flexible gel that is highly (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp.
More Information Top
Indicates content that may require registration and/or purchase.
-
Over the breakdown resistance of some liquid insulating materials by stresses of long up to short duration
Process of the high - voltage line in the gel ~ indeder of newcomers Technical university to Dresden.
-
The Hallwilersee project as example of a generous maritime reorganization
The in the run diescs of summer durchgef ~ ihrte Absteckung of the lines in the gel ~ inde have the good Durchffihrbarkeit of the general project besttitigt.
-
"High‐Tech"‐Anwendungen of supramolekularen nanostrukturierten gel materials - from the regenerative medicine to electronic components
…tissue culture, the molecular gels as nanostrukturierte skeletons to the Nachzüchtung of nerve cells were in vivo successful, and has caused the great interest in the nanoelectronics the prospect of the use of selbstorganisierten fibers as one-dimensional conductor in gel materials.
-
Intelligently, bewitches. Textile sensing technology
Mostly, one glues thereto dry gel-electrodes that to produce the contact with the skin with a conductive gel in a manner sponge.
-
Electroviscoelastic materials as active dampers
The electroviscoelastic materials (EVEMs) are composed of a non - conducting gel or polymer with fine conducting powders suspended in it.
-
Conducting cryogel scaffold as a potential biomaterial for cell stimulation and proliferation
All the PPy incorporated gels as well as the non conducting polymer gels degraded to around 12 % of their original weight within 1 month of duration.
-
Metallisation of gel surfaces under ambient conditions.
A room temperature method to coat a non - conducting gel phase with a metal is described, which uses galvanic displacement.
-
Molecular Gels
…see also small-angle neutron scattering structural analysis 275–322 under shear, wormlike micelles 693–5, 696 nodes, junction zones, small-angle scattering 302–3 noise reduction, circular dichroism spectroscopy 434 noise temperature, soft glassy rheology (SGR) 189 non - conducting gels , electronic applications 805–8 non…
-
Theory of DNA electrophoresis (∼ 1999 –2002 ½)
…that Slater et al. used to reject the OMRC hypothesis (and most of the models used to study low field mobility) was developed for uniform and 1-D field lines (even in the presence of non - conducting gel fibers) and is restricted…
-
Determination of idarubicin in human urine by capillary zone electrophoresis with amperometric detection
Non - conductive gel was applied at both ends of the pipette to seal the lead and copper wire.