PCB Chip Carriers

Description: brighter LEDs. Applications of BT PCB BT PCB was used only in chip packaging at the beginning, but it comes in many types now, such as: High-performance copper-clad laminates Chip carrier boards High-frequency copper-clad laminates Resin

Description: /MLF allow probing connection to all pins of the chip. A high density male to male adapter provides interconnect from the probe board to the target attached SMT feet. The SMT foot is simply soldered to the same pads as for the IC using standard soldering methods. The IC is installed into the

Description: Any Format ISO 9001:2015 Passives Down to 01005 Ball Grid Array (BGAs) and VFBGA Box Build Leadless Chip Carriers / CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and Replacement

• Location: North America, United States Only
• PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
• Supplier Capability: Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly

Description: External, PCB Dipole < 5db WACI* Internal, SMT Chip < 3db *Certified on demand List may vary per domain Our Services

Description: < 5db WEAD External, PCB Dipole < 5db WACI Internal, SMT Chip < 3db List may vary per domain Our Services

Description: < 5db WEAD External, PCB Dipole < 5db WACI Internal, SMT Chip < 3db List may vary per domain Our Services

Description: :2015 Passives Down to 01005 Ball Grid Array (BGAs) and VFBGA Box Build Leadless Chip Carriers / CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and Replacement Printed Circuit Boards: smallest

• Location: North America, United States Only
• Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Through Hole Assembly, Surface Mount Assembly, Other
• Material Acquisition: Vendor Supplied
• Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn

Description: Interface module; 2xRJ-45; PCB terminal blocks, double-row; in mounting carrier

• T_J: -20 to 85 C

Description: Interface module; HD-Sub-D; Female connector; 15-pole; Triple-deck PCB terminal blocks; in mounting carrier; with shield connection

• T_J: -20 to 55 C

Description: Interface module; RJ-45; PCB terminal blocks; Cat. 5; in mounting carrier; with shield connection; with shield clamping saddle

• T_J: -40 to 85 C

Description: Interface module; 2xRJ-45; PCB terminal blocks, double-row; in mounting carrier; with shield connection

• T_J: -20 to 85 C

Description: The Evaluation Board is connected to PCs USB port and operated through a Graphical User Interface (GUI) software. Murata MEMS Evaluation Board supports various types of Murata MEMS sensors. The MEMS sensors are connected to the Evaluation Board by using a chip carrier PCB or an

• Package Type / Mounting: Other
• Sensor Type: Acceleration Sensor

Description: Manufacturer: Vishay Win Source Part Number: 1114791-TSSP4038SS1X B Packaging: Tube/Rail Orientation: Side View Mounting: PCB, Through Hole Sensing Distance: 25m Categories: Sensors, Transducers Status: Active Temperature Range - Operating: -25°C to

• Operating Temperature: -25 to 85 C

Description: The XBee-PRO OEM is an IEEE 802.15.4 compliant RF transceiver module. It operates in the 2.4GHz ISM Band. It has a high-power output and high receiver sensitivity so it can provide long-range line-of-sight communication for up to 1 km. Carrier frequency: 2.4 GHz ISM band with 12 channels. RF

• Interface: Other
• Supply Voltage: 3 V, 3.3 V, Other
• T_J: -40 to 85 C
• Technology: ZigBee^®

Description: an existing Wi-Fi network. The XBee Wi-Fi module shares a common footprint with other XBee modules.This allows different XBee technologies to be drop-in replacements for each other, developers can switch from IEEE 802.11 standard to IEEE 802.15.4 for example. Carrier Frequency: 2.4GHz ISM

• Interface: SPI, UART, Other
• Supply Voltage: 3.3 V, Other
• T_J: -30 to 85 C

Description: A range of PLCC surface mount sockets with phosphor bronze contacts. The contacts are set on a 0.1in. grid to match JEDEC patterns. Polarising feature ensures correct insertion of chip carriers. Suitable extraction tool (stock no. 480-3005) Low profile design, only 4.5mm high. Window

• Contact Plating: Copper Plating, Other
• Contacts Pitch: 1.27 mm
• Current Rating: 1 amps
• Mounting: SMT, Solder

Description: The BU-67401L is a dual MIL-STD-1553 dual transceiver that operates from a +3.3V power supply voltage. It operates in conjunction with "Harris" type encoder/decoders and comes in an ultra low profile and small footprint in a 48-pad Leadless Plastic Chip Carrier package (LPCC). The LPCC

• Features: RoHS Compliant
• IC Package Type: Other
• Supply Voltage: 3.3 V