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Supplier: FKN Systek, Inc.
Description: The S100 is an economical PCB singulating saw for moderate production volumes and laboratory use. The diamond saw blade, along with the linear bearing positioning table to guide the PCB to be cut, allows for quick and clean singulation of PCB panels in low volume
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Supplier: FKN Systek, Inc.
Description: The N100 Nibbler separates routed PCBs carefully and economically with a pneumatic operated blade. The panels are singulated without dust or scrap. The tab of the PCB panel is fed into the cutting tool and removed by stepping on the foot switch. Cut tabs are accumulated inside the
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Supplier: FKN Systek, Inc.
Description: The S200 is a semi-automatic depaneling saw for medium volume singulation of a variety of different PCB sizes. The operator places the PCB to be singulated onto a tooling plate which is moved into the machine.
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Supplier: FKN Systek, Inc.
Description: The 300X8 is a multiple blade saw which can handle up to 8 cuts for depaneling boards such as ballast for the lighting industry and other PCBs with overhanging components. Panels to be singulated are loaded onto a tooling plate and the top safety cover is closed. Pushing the start button will
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Reliability Performance of Stretch Solder Interconnections
The functional wafer is a standard VLSI wafer containing the integrated circuits that will eventually be attached to the printed circuit board ( PCB ) after singulation .
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Laser dicing of chip scale and silicon wafer scale packages
Singulation of PCB based chip scale packages as well as the dicing of silicon based flip chip or wafer scale packaging is becoming critical.
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http://www.mouser.com/pdfdocs/Ampseal16catalog.pdf
To singulate populated PCBs Tyco Electronics offers a singulation press, a manually loaded router, in-line depanelling machines with router, saw or laser.
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Rapid Tooling for High Reliability Transfer Molded Devices
After singulation , devices can be directly attached to PCBs or to test sockets without further processing.
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Exploration of the design space of wafer level packaging through numerical simulation
Wafer Level Packaging (WLP) refers to the technology that integrated circuits are packaged at wafer level and after singulation such chips are then connected directly to the PCB through individual solder balls using standard SMT process [1,2,3,4].
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