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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Features: Machined Pins, Open Top Socket
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Supplier: JC Cherry, Inc.
Description: Adapter Sockets PGA Socket 1.0mm pitch/1.27mm pitch Socket for PGA devices. The contact part has highly reliable structure of plural contact fingers. We also welcome custom request.
- Operating Temperature: -55 to 150 C
- Package Type: PGA
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Adapter Sockets PGA plug 1.0mm pitch/1.27mm pitch Plug for PGA devices. The contact part has highly reliable structure of plural contact fingers. We also welcome custom request.
- Operating Temperature: -55 to 150 C
- Package Type: PGA
- Product Type: IC Socket
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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins
- Contact Plating: Other
- Contacts Pitch: 2.54 mm
- Features: Machined Pins
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Supplier: Aries Electronics, Inc.
Description: : 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard PGA socket
- Output (Bottom) Side Package: PGA
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: PLCC
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Supplier: Aries Electronics, Inc.
Description: CONTACT CURRENT RATING: 1 amp OPERATING TEMPERATURES: -85°F to 257°F [-65°C to 125°C] Au plating, -85°F to 392°F [-65°C to 200°C] NiB (Spinodal) ACCEPTS LEADS: 0.014-0.026 [0.36-0.66] dia., 0.120-0.290 [3.05-7.37] long MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.032 ±0.002 [0.81 ±0.05] dia.
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: Advanced Interconnections Corp.
Description: Our Peel-A-Way® Pin Grid Array (PGA) Sockets are designed for low profile applications and feature our patented removable terminal carrier and high reliability screw-machined terminals. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Features: Machined Pins, Open Top Socket
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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Features: Machined Pins, Open Top Socket
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Supplier: Aries Electronics, Inc.
Description: PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Will plug into standard
- Output (Bottom) Side Package: PGA
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: Other
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount PQFP packages to an Amp interstitial PGA footprint Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process
- Output (Bottom) Side Package: PGA
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: Other
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Supplier: TE Connectivity
Description: ] IC Socket Type : mPGA PCB Contact Termination Area Plating Material : Gold Dimensions Socket Overall Height : 4 MM [.157 INCH ] Housing Features
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Supplier: TE Connectivity
Description: : Tin-Lead Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Style : Stamped & Formed Contact Underplating Material : Nickel IC Socket Type : PGA PCB
- Current Rating: 3 amps
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Supplier: VAST STOCK CO., LIMITED
Description: Relay Sockets & Hardware LIGHT SENSOR TERMINAL BLOCK
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Supplier: VAST STOCK CO., LIMITED
Description: Relay Sockets & Hardware MODULE FOR MULT
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Supplier: Ironwood Electronics, Inc.
Description: PGA Sockets are available in all of the package codes listed in Appendix B – PGA Package Code Patterns, including the IPGAs. Three pin options are available, as well as ZIF sockets for 10 x 10 to 25 x 25 arrays. The pin options are illustrated below. To determine the
- Mounting: SMT
- Number of Contacts: 120
- Package Type: PGA, Other
- Product Type: IC Headers
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Supplier: VAST STOCK CO., LIMITED
Description: Relay Sockets & Hardware 360deg Light Sensor Detects Light
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Supplier: VAST STOCK CO., LIMITED
Description: Relay Sockets & Fixings Line-of-sight Light Sensor Detects Light
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Supplier: Ironwood Electronics, Inc.
Description: These adapters connect a PGA package to a PLCC interface. Two interface options for the bottom PLCC interface are available: a surface mounted J-Lead or a pluggable foot for use with production sockets. These converters can be combined with a PGA male to male socket to
- Product Type: Package Adapters / Converters
- RoHS Compliant: Yes
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Supplier: Heilind Electronics, Inc.
Description: Connectors Sockets - Processor (PLCC, PGA,BGA, etc.)
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Supplier: Ironwood Electronics, Inc.
Description: Our PLCC to PGA socket probing adapters plug into PLCC sockets and provide access to all signals at gold plated, 0.025" square test points. A pluggable PGA pattern on the adapter accepts a PGA device being tested.
- Product Type: IC Probing / Analysis Adapters
- RoHS Compliant: Yes
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Supplier: Ironwood Electronics, Inc.
Description: These adapters allow PLCC devices to be mounted on PGA through hole patterns. The PLCC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. They also provide a reduced height compared to our converters with ZIF sockets.
- Product Type: Package Adapters / Converters
- RoHS Compliant: Yes
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets 84 PIN PGA GOLD
- Package Type: PGA
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets 101 PIN PGA GOLD
- Package Type: PGA
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets 225 PIN PGA GOLD
- Package Type: PGA
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets 400 PIN PGA GOLD
- Package Type: PGA
- Product Type: IC Socket
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Supplier: Mill-Max Mfg. Corp.
Description: Through Hole Solder Tail PGA Socket PGA Socket, 159 pins
- Contact Plating: Other
- Mounting: Through-hole
- Number of Contacts: 159
- Package Type: PGA
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Supplier: Lingto Electronic Limited
Description: PGA
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Supplier: Mill-Max Mfg. Corp.
Description: Through Hole Solder Tail PGA Socket PGA Socket, 441 pins
- Contact Plating: Other
- Mounting: Through-hole
- Number of Contacts: 441
- Package Type: PGA
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Supplier: Rego Electronics Inc.
Description: Product Series - 1U & 2U Coolers, TDP : 35 Watts to 55 Watts Features & Benefits - A full range of products, customized technology, high quality, high reliability, lower noise level, long term supply Target Market - Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk
- Device: Active Heat Sink
- Heat Sink Fin Style: Straight Fin
- Mounting: Socket Mount
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Supplier: Global American, Inc.
Description: 2808220 - Mini-ITX Motherboard with Socket G1 (rPGA989) for Intel Core i7 /Core i5 series mobile processors
- Chipset Type: Intel® Chipset
- LAN / Networking: 2
- Max Speed: 0.8000 to 1.07 GHz
- Memory Capacity: 8 GB
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Supplier: Aaeon Systems Inc.
Description: Gaming Digital Signage Industrial Automation Networking Transportation Features Socket G2 (rPGA988B) 2nd Generation for Intel Core i7/ i5/Celeron QC/ DC Processor Intel QM
- Chipset Type: Intel® Chipset
- Memory Capacity: 0.2560 GB
- On Board Features: Serial Interface (RS232, RS422, RS485)?, On-board Ethernet Controller?
- Processor / CPU Type: Other
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Supplier: DigiKey
Description: Pos PGA Socket Gold Through Hole
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Supplier: DigiKey
Description: Pos PGA Socket Gold Through Hole
- Connector Type: Board Mount Connector
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Supplier: ODG (Origin Data Global)
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I
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Supplier: DigiKey
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I
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Featured Products Top
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.68 ?/W Intel CPU Information - A 37.5 X 37.5 rPGA Package -- rPGA988B(Socket G2) Supporting Intel® Core™ i5 and i7 Mobile Processor Series Supporting Intel® Celeron® Mobile Processor Series (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
We offer a full range of cooler solutions for various Intel® mobile CPU families which supports socket 478/479, Intel® Core™ Mobile Processor rPGA 988 & BGA packages & Intel® Atom™ Processor ( Bay Trail, Braswell, Apollo Lake, Elkhart Lake ) Coolers. Our products (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
The HDMI modulator is very important, allowing the distribution of HD video and audio over coaxial cable networks. HDMI modulators are a cheap, simple, and complete solution for a wide variety of applications for both residential and commercial, and institutional applications. This article reviews HDMI modulators, some basic features, and their applications.
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Browse Drive Sockets and Adapters Datasheets for ODG (Origin Data Global) -
At Smiths Interconnect, we are constantly striving to exceed the evolving demands of the semiconductor industry. The Davinci 112 test socket, and expansion of the DaVinci Series, is designed to tackle some of the most complex challenges in testing Application Specific Integrated Circuits (ASICs (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
SD (Secure Digital) Card is a non-volatile memory card format for portable devices such as mobile phones, digital cameras, GPS navigation devices, and tablet computers. The three form factors are original size, mini size, and micro size. Rego offers a complete line of sockets for these cards (read more)
Browse IC Sockets and Headers Datasheets for Rego Electronics Inc. -
socket provides increased performance and reduced overall power consumption that leads to cost savings. The PCIe generation 5 specification doubles the bandwidth from previous generations, providing faster speeds and more efficiency. Ease of (read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
TE Connectivity 's (TE) PCIe Gen 5 CEM connectors can enable all generations of PCI Express signaling and address the needs of higher speed performance with a roadmap of data rates that can reach up to 32 gigtransfers per second (GT/s) per differential signal pair. We can provide a broad product portfolio, early sample support, quick mass production and high reliable signal integrity per...
(read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
OEM to handle these tasks, companies focus their resources on other business areas requiring more attention. Using advanced equipment and OEM tools like socket sets speeds up the production process, ensuring that components get delivered on time. This (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation
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Spring Probe PGA Technology Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications
Spring probes have a very high mating cycle life, often higher than traditional pin & socket contact systems, and this is needed to keep very expensive MRI systems operating to their full capacity and patient throughput to a maximum. Smiths Interconnect, the leader in spring probe technology, has
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Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications
Spring probes offer high density and have a very high mating cycle life, often higher than traditional pin & socket contact systems, and this is needed to keep very expensive MRI systems operating to their full capacity and patient throughput to a maximum.
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The Contact Clip, the Heart of the Mill-Max Receptacle
such as cables, modules or other pins and wires. Assembled into sockets i.e. DIP, SIP, PGA, etc. or used discretely, receptacles make devices and modules pluggable for repair and replacement.
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IC Component Sockets
… 1.3 S ingle-Beam Contact Design 4.1.4 Multiple-Finger Contact Design 4.1.5 Low-Force Contact Design 4.1.6 ZIF Contact Design 4.1.7 Insertion and Extraction Tools 4.2 PGA Sockets 4.2.1 PGA …
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High frequency modeling and characterization of pin and land grid array sockets
The characterization results show that the LGA and PGA sockets have comparable performance to SGHz, but the PGA socket provides better frequency response from 8 to 15 GHz bandwidth for single ended and differential insertion and r e m losses, referenced 50 …
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http://dspace.mit.edu/bitstream/handle/1721.1/67760/766761082-MIT.pdf?sequence=2
Figure 6: PGA socket (socket 479)..................................................................................................
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http://dspace.mit.edu/bitstream/handle/1721.1/59175/659780941-MIT.pdf?sequence=2
Figure 3: PGA Socket .............................................................................................................
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Appendix to the report from the low-residue soldering task force: Phase 2 results
The only exception was current leakage forthe PGA socket for both LR and RMA boards and forthe IO-mil pads and gull wing for RMA.
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http://qspace.library.queensu.ca/jspui/bitstream/1974/6350/3/Moore_Thomas_A_201104_MASc.pdf
Figure 5.1 – Oscilloscope and AWG configuration.......................................................................79 Figure 5.2 – 69 PGA socket assembly and connectors...................................................................80 .
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3D mobile CPU system assembly by Z-axis stack connector solutions
As the latest PGA socket height is roughly 3mm, the solution seems Z height competitive.
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Array Module Connector Test Program at Unisys
The 252 PGA socket was exposed to these conditionsfor a full 5000 hours without any failures.
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495-PIN AND 615-PIN MICRO-PGA ZIF Socket Design Specification
The 615-pin Micro-PGA and 495-pin Micro- PGA sockets must be low cost, low risk, robust, reliable, manufacturable in high volumes, and multi-sourceable.