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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Number of Contacts: 4 to 2,209
- Contacts Pitch: 2.54 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: TE Connectivity
Description: Material : Copper Alloy Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] IC Socket Type : mPGA PCB Contact Termination Area Plating Material : Gold Dimensions Socket Overall
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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Number of Contacts: 4 to 2,000
- Contacts Pitch: 2.54 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Advanced Interconnections Corp.
Description: Our Peel-A-Way® Pin Grid Array (PGA) Sockets are designed for low profile applications and feature our patented removable terminal carrier and high reliability screw-machined terminals. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs
- Number of Contacts: 4 to 2,000
- Contacts Pitch: 2.54 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: JC Cherry, Inc.
Description: Adapter Sockets PGA Socket 1.0mm pitch/1.27mm pitch Socket for PGA devices. The contact part has highly reliable structure of plural contact fingers. We also welcome custom request.
- Operating Temperature: -55 to 150 C
- Product Type: IC Socket
- Socket Type: PGA
- Features: Package Adapters / Converters
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Supplier: Ironwood Electronics, Inc.
Description: PGA Sockets are available in all of the package codes listed in Appendix B – PGA Package Code Patterns, including the IPGAs. Three pin options are available, as well as ZIF sockets for 10 x 10 to 25 x 25 arrays. The pin options are illustrated below. To determine the
- Number of Contacts: 100
- Product Type: IC Headers
- Features: Other
- Socket Type: PGA
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Supplier: Newark, An Avnet Company
Description: STANDARD WIRE WRAP PGA SOCKET / BULK
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Supplier: Newark, An Avnet Company
Description: STANDRD SOLDER TAIL PGA SOCKET / BULK
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Supplier: Newark, An Avnet Company
Description: STANDRD SOLDER TAIL PGA SOCKET / TUBE
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Supplier: Newark, An Avnet Company
Description: PGA SOCKET; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount PQFP packages to an Amp interstitial PGA footprint Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable
- Operating Temperature: 105 C
- Number of Contacts: 132
- Contact Plating: Nickel Plating
- Features: Other
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Supplier: VAST STOCK CO., LIMITED
Description: Relay Sockets & Hardware MODULE FOR MULT
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Supplier: Heilind Electronics, Inc.
Description: Connectors Sockets - Processor (PLCC, PGA,BGA, etc.)
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount PLCC packages to a PGA footprint Pin polarization option also available For Panelized Form or for mounting of consigned chips, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces PADS: hot-air solder leveled
- Operating Temperature: 105 C
- Number of Contacts: 28 to 85
- Contacts Pitch: 2.54 mm
- Contact Plating: Nickel Plating
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount VQFP packages to a 13x13 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical
- Operating Temperature: 105 C
- Number of Contacts: 144
- Contacts Pitch: 2.54 mm
- Contact Plating: Nickel Plating
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Supplier: Rego Electronics Inc.
Description: Product Series - 1U & 2U Coolers, TDP : 35 Watts to 55 Watts Features & Benefits - A full range of products, customized technology, high quality, high reliability, lower noise level, long term supply Target Market - Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk
- Device: Active Heat Sink
- Mounting: Socket Mount
- Heat sink Fin Style:: Straight Fin
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Supplier: Mill-Max Mfg. Corp.
Description: Through Hole Solder Tail PGA Socket PGA Socket, 145 pins
- Number of Contacts: 145
- Product Type: IC Socket
- Features: Other
- Socket Type: PGA
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Supplier: Powell Electronics, Inc.
Description: IC & Component Sockets 84 PIN PGA GOLD
- Product Type: IC Socket
- Socket Type: PGA
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount QFP packages to a 15x15 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical
- Operating Temperature: 105 C
- Number of Contacts: 160
- Contacts Pitch: 2.54 mm
- Contact Plating: Nickel Plating
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Supplier: Global American, Inc.
Description: 2808220 - Mini-ITX Motherboard with Socket G1 (rPGA989) for Intel Core i7 /Core i5 series mobile processors
- Max Speed: 0.8 to 1.066 GHz
- Memory Capacity: 8 GB
- PCI Slots: 1
- LAN / Networking: 2
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Supplier: RS Components, Ltd.
Description: E-TEC PGA-121-E001-11Z-95 IC Socket
- Number of Contacts: 121
- Contacts Pitch: 2.54 mm
- Product Type: IC Socket
- Contact Plating: Nickel Plating
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Supplier: Aaeon Systems Inc.
Description: diverse demands.†Chang adds. In addition, this 2nd generation Intel® Core i7/i5/Celeron® QC/DC-based processor has been chosen for the 2012 Taiwan Excellence Award. Applications POS KIOSK Gaming Digital Signage Industrial Automation Networking Transportation Features Socket G2 (rPGA988B)
- Memory Capacity: 0.256 GB
- Chipset: Intel® Chipset
- On Board Features: On-board Ethernet Controller, Serial Interface (RS232, RS422, RS485)
- Features: Other
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Supplier: Global American, Inc.
Description: i7-4700MQ Processor (6M Cache, up to 3.40 GHz); 47W NOTE: The 4th Generation Intel Core Series Mobile Processors in the Socket G3 (rPGA947) package are not on the Intel Embedded Road Map and may go E.O.L. without prior notice. Please ask your sales representative for details.
- Max Speed: 1.066 to 1.6 GHz
- Memory Capacity: 16 GB
- LAN / Networking: 2
- SATA: 4
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Supplier: JC Cherry, Inc.
Description: High Current High Speed Interface Manual/Handler/Burn in ●Test socket for CCD and CMOS sensor. ●Customizable for various package such as BGA, LGA, PGA. ●Using our high reliable spring probes, stamping pins and socket pins. ●We manufacture test sockets for high current,
- Voltage Rating: 100 volts
- Current Rating: 0.5 amps
- Contact Resistance: 200 milliohms
- Operating Temperature: -40 to 150 C
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Supplier: Lingto Electronic Limited
Description: CONN SOCKET PGA 370POS
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Supplier: DigiKey
Description: Pos PGA Socket Gold Through Hole
- Features: Board Mount Connector
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Supplier: RS Components, Ltd.
Description: 100 way QFP to PGA 1piece socket,0.5mm
- Contacts Pitch: 0.5 to 2.54 mm
- Contact Plating: Nickel Plating
- Features: Other
- Product Type: Package Adapters / Converters
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Supplier: DigiKey
Description: IC Socket Adapter QFP To PGA Through Hole
- Features: Board Mount Connector
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Supplier: ODG (Origin Data Global)
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I
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Supplier: DigiKey
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I
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Supplier: Acme Chip Technology Co., Limited
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I
- Development Tool: Break Out Board
- Category: Development Board
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Supplier: Computer Network Accessories, Inc.
Description: Extend the life of your CPU. AMD Socket A (462) Duron/Athlon 1.3GHz+,XP 1900+, MP 2000+, Intel FC-PGA(2)370 PIII/Celeron all speed, ball bearing, 3 pin connector CPU fan.
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1349344-232-1270-02-0602 Category: Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets Series: Textool™ Type: PGA, ZIF (ZIP) Features: Closed Frame Termination: Solder Package: Bulk Housing Material: Polysulfone (PSU) , Glass Filled
- Current Rating: 1 amps
- Contact Resistance: 25 milliohms
- Operating Temperature: -55 to 125 C
- Number of Contacts: 32
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Supplier: Computer Network Accessories, Inc.
Description: Extend the life of your CPU. For AMD Socket A (462) Duron/Athlon 950MHz, Intel FC-PGA(2)370 PIII/Celeron 1.1GHz, Ball Bearing, 3 pin connector. Fan Size: 50mm x 50mm x 15mm; Heatsink Material: Aluminum; Air Flow: 15 CFM; Cooler Dimension: 52mm x 50mm x 55mm; Support CPU Speeds up to:
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.68 ?/W Intel CPU Information - A 37.5 X 37.5 rPGA Package -- rPGA988B(Socket G2) Supporting Intel® Core™ i5 and i7 Mobile Processor Series Supporting Intel® Celeron® Mobile Processor Series (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
We offer a full range of cooler solutions for various Intel® mobile CPU families which supports socket 478/479, Intel® Core™ Mobile Processor rPGA 988 & BGA packages & Intel® Atom™ Processor ( Bay Trail, Braswell, Apollo Lake, Elkhart Lake ) Coolers. Our products (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
Specify reliability and durability for projects in Energy, Oil & Gas. From demanding field applications to mass produced consumer products.
(read more)
Browse IC Sockets and Headers Datasheets for Harwin Plc -
The HDMI modulator is very important, allowing the distribution of HD video and audio over coaxial cable networks. HDMI modulators are a cheap, simple, and complete solution for a wide variety of applications for both residential and commercial, and institutional applications. This article reviews HDMI modulators, some basic features, and their applications.
(read more)
Browse Drive Sockets and Adapters Datasheets for ODG (Origin Data Global) -
Lowell Corporation has been supplying the highest quality tools and equipment since 1869. The new Single End Triple Square Impact Socket can be used with any impact wrench to install or tighten utility pole hardware. You can easily change from the 3/4” (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation -
TE Connectivity 's (TE) PCIe Gen 5 CEM connectors can enable all generations of PCI Express signaling and address the needs of higher speed performance with a roadmap of data rates that can reach up to 32 gigtransfers per second (GT/s) per differential signal pair. We can provide a broad product portfolio, early sample support, quick mass production and high reliable signal integrity per...
(read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
OEM to handle these tasks, companies focus their resources on other business areas requiring more attention. Using advanced equipment and OEM tools like socket sets speeds up the production process, ensuring that components get delivered on time. This (read more)
Browse Drive Sockets and Adapters Datasheets for Lowell Corporation -
socket provides increased performance and reduced overall power consumption that leads to cost savings. The PCIe generation 5 specification doubles the bandwidth from previous generations, providing faster speeds and more efficiency. Ease of (read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd.
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Spring Probe PGA Technology Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications
Spring probes have a very high mating cycle life, often higher than traditional pin & socket contact systems, and this is needed to keep very expensive MRI systems operating to their full capacity and patient throughput to a maximum. Smiths Interconnect, the leader in spring probe technology, has
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Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications
Spring probes offer high density and have a very high mating cycle life, often higher than traditional pin & socket contact systems, and this is needed to keep very expensive MRI systems operating to their full capacity and patient throughput to a maximum.
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The Contact Clip, the Heart of the Mill-Max Receptacle
such as cables, modules or other pins and wires. Assembled into sockets i.e. DIP, SIP, PGA, etc. or used discretely, receptacles make devices and modules pluggable for repair and replacement.
More Information Top
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IC Component Sockets
… 1.3 S ingle-Beam Contact Design 4.1.4 Multiple-Finger Contact Design 4.1.5 Low-Force Contact Design 4.1.6 ZIF Contact Design 4.1.7 Insertion and Extraction Tools 4.2 PGA Sockets 4.2.1 PGA …
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High frequency modeling and characterization of pin and land grid array sockets
The characterization results show that the LGA and PGA sockets have comparable performance to SGHz, but the PGA socket provides better frequency response from 8 to 15 GHz bandwidth for single ended and differential insertion and r e m losses, referenced 50 …
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http://dspace.mit.edu/bitstream/handle/1721.1/67760/766761082-MIT.pdf?sequence=2
Figure 6: PGA socket (socket 479)..................................................................................................
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http://dspace.mit.edu/bitstream/handle/1721.1/59175/659780941-MIT.pdf?sequence=2
Figure 3: PGA Socket .............................................................................................................
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Appendix to the report from the low-residue soldering task force: Phase 2 results
The only exception was current leakage forthe PGA socket for both LR and RMA boards and forthe IO-mil pads and gull wing for RMA.
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http://qspace.library.queensu.ca/jspui/bitstream/1974/6350/3/Moore_Thomas_A_201104_MASc.pdf
Figure 5.1 – Oscilloscope and AWG configuration.......................................................................79 Figure 5.2 – 69 PGA socket assembly and connectors...................................................................80 .
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3D mobile CPU system assembly by Z-axis stack connector solutions
As the latest PGA socket height is roughly 3mm, the solution seems Z height competitive.
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Array Module Connector Test Program at Unisys
The 252 PGA socket was exposed to these conditionsfor a full 5000 hours without any failures.
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495-PIN AND 615-PIN MICRO-PGA ZIF Socket Design Specification
The 615-pin Micro-PGA and 495-pin Micro- PGA sockets must be low cost, low risk, robust, reliable, manufacturable in high volumes, and multi-sourceable.