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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover a polyimide plastic in the form of molded rod and bar.
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Supplier: Accuris
Description: Polyimide, Molded Rod, Bar, and Tube, Plaque, and Formed Parts
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Supplier: SAE International
Description: This specification covers a polyimide plastic in the form of isostatically molded rod, bar, and tube, unidirectionally molded plaque, and direct formed parts.
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover a polyimide plastic in the form of molded rod and bar.
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Supplier: SAE International
Description: This specification covers a polyimide plastic in the form of isostatically molded rod, bar, and tube, unidirectionally molded plaque, and direct formed parts.
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Supplier: Accuris
Description: PLASTIC ROD AND BAR, POLYIMIDE Unfilled, Molded
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Supplier: Accuris
Description: (R) Polyimide, Molded Rod, Bar, and Tube, Plaque, and Formed Parts
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Supplier: Accuris
Description: PLASTIC ROD AND BAR, POLYIMIDE UNFILLED, MOLDED
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Supplier: Total Plastics, Inc.
Description: Polyimide stock shapes provide a superior combination of high temperature, bearing and wear resistance, and mechanical properties, making it an ideal choice for performance in the most demanding resistance applications. Polyimide is characterized by its long term thermal stability,
- Chemical System: Polyamide / Nylon, Thermoplastic
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Supplier: RS Components, Ltd.
Description: RS PRO Tecasint 2011 rod, 13x250mm
- Overall Width / O.D.: 0.5118113 inch
- Overall Length: 9.842525 inch
- Chemical System: Polyimide (PI), Thermoplastic
- Form / Shape: Rod / Round Stock
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Supplier: Duvelco Limited
Description: Ducoya® G201 ESD is a high-purity polyimide for semiconductor applications where an electrostatic dissipative capability is required. This material is intended for use in the latest semiconductor manufacturing operations, especially where movement could generate static electricity that must
- Features: Anti-static
- Form / Shape: Hollow / Tubular Stock, Plate, Rod / Round Stock
- Chemical System: Polyimide (PI), Thermoplastic
- Industry: Semiconductors / ICs
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Supplier: Duvelco Limited
Description: G022: Polyimide with 40% graphite encapsulated into the polymer, providing unparalleled dimensional stability for design flexibility.
- Filler: Carbon / Graphite
- Form / Shape: Hollow / Tubular Stock, Plate, Rod / Round Stock
- Chemical System: Polyimide (PI), Thermoplastic
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Supplier: Duvelco Limited
Description: Ducoya® G202 C is a high-purity-filled polyimide for semiconductor applications requiring electrically conductive material. This material is intended for use in the latest semiconductor manufacturing operations, especially where process conditions could generate static electricity. Connecting
- Material Type: Electrically Conductive
- Form / Shape: Hollow / Tubular Stock, Plate, Rod / Round Stock
- Chemical System: Polyimide (PI), Thermoplastic
- Industry: Semiconductors / ICs
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Supplier: Duvelco Limited
Description: Ducoya® G001 UP is an ultra-pure polyimide for semiconductors. The material is intended for use in the latest semiconductor manufacturing operations where feature sizes can be found in the low nanometer range.
- Form / Shape: Hollow / Tubular Stock, Plate, Rod / Round Stock
- Features: Other
- Chemical System: Polyimide (PI), Thermoplastic
- Industry: Semiconductors / ICs
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Supplier: Interstate Plastics, Inc.
Description: Dupont™ VESPEL® polyimide is an extremely high temperature, creep resistant material that is often used in high heat environments where thermoplastic materials would lose their mechanical properties.
- Overall Width / O.D.: 0.25 to 0.625 inch
- Industry: General Industrial
- Chemical System: Polyimide (PI), Thermoplastic
- Form / Shape: Rod / Round Stock
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Supplier: ASTM International
Description: 1.1 This priovisional specification covers rod, bar, tube, or slab molded from unfilled or filled polyimide resin, parts machined therefrom, and parts direct-formed from the powder.
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Supplier: Ensinger, Inc.
Description: mechanical properties, good wear resistance and is also resistant to high-energy radiation. TECASINT 5111 natural is produced as polyimide sheet, polyimide rod and tube. Facts Chemical designation: PI (Polyimide) Color: brown Density: 1,33 g/cm3 Main Features very good
- Tensile Strength (Break): 20,305.1575100076 psi
- Tensile Modulus: 522.132621685909 to 551.139989557349 ksi
- Elongation: 5.3 to 9 %
- Use Temperature: 572 F
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Supplier: Ensinger, Inc.
Description: industry, cryogenics and also in mechanical engineering or in nuclear and vacuum technology. Furthermore, PI plastic is also resistant to high-energy radiation. TECASINT 5501 ESD light-brown is produced in the shape of polyimide sheets. Facts Chemical designation: PI (Polyimide) Color:
- Tensile Strength (Break): 13,488.4260602193 psi
- Tensile Modulus: 1,000.75419156466 to 1,015.2578755003799 ksi
- Elongation: 1.5 to 2.7 %
- Use Temperature: 572 F
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Supplier: MCA - Advanced Materials Division
Description: Duratron® D7015G PI Polyimide is a bearing grade PI that exhibits superior temperature and wear resistance qualities, while offering a low coefficient of friction. Not only does Duratron® D7015G PI maintain its performance abilities with or without lubrication, but with 15% graphite added to
- Tensile Strength (Break): 11,000 psi
- Tensile Modulus: 650 ksi
- Use Temperature: 580 F
- Features: Other
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Supplier: Ensinger, Inc.
Description: Chemical designation: PI (Polyimide) Color: anthracite Density: 1,53 g/cm3 Main Features very high thermal and oxidative resistance very good slide and wear properties high thermal and mechanical capacity very low water absorption high creep resistance good chemical resistance resistance
- Tensile Strength (Break): 7,977.02616464583 psi
- Tensile Modulus: 884.724720078902 to 957.2431397575 ksi
- Elongation: 1 to 1.8 %
- Use Temperature: 561.2 F
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Supplier: Ensinger, Inc.
Description: lubricating. Facts Chemical designation: PI (Polyimide) Color: anthracite Density: 1,49 g/cm3 Main Features very high thermal and oxidative resistance very low water absorption very good slide and wear properties high thermal and mechanical capacity good chemical resistance high creep
- Tensile Strength (Break): 13,488.4260602193 psi
- Tensile Modulus: 609.1547253002269 to 716.917096942625 ksi
- Elongation: 3 to 3.4 %
- Water Absorption: 0.16 to 0.53 %
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Supplier: MCA - Advanced Materials Division
Description: Duratron® D7000 PI Polyimide shapes possess superior electrical and thermal insulation properties, and outstanding mechanical performance qualities for applications that demand higher temperature resistance. In addition to these characteristics, Duratron® D7000 PI offers great chemical
- Tensile Strength (Break): 16,000 psi
- Tensile Modulus: 583 ksi
- Use Temperature: 580 F
- Features: Other, Thermally Insulating
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Supplier: TriStar Plastics Corp.
Description: High-temperature resistance Chemical resistance FDA compliance
- Form / Shape: Film / Sheet, Flat / Bar Stock, Rod / Round Stock
- Industry: General Industrial
- Chemical System: Polyimide (PI), Thermoset / Crosslinked
- Features: Specialty / Other
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Supplier: Port Plastics, Inc.
Description: Duratron® 7000 PI is an exceptional value for applications where thermal requirements exclude Duratron PAI and do not require the extraordinary thermal resistance of Duratron PBI. Duratron PI is available in several grades for structural and wear applications and in the broadest range of shapes –
- Form / Shape: Film / Sheet, Hollow / Tubular Stock
- Features: Other
- Chemical System: Polyimide (PI), Thermoplastic
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Measurement of thermophysical properties of polyimide and a black paint for future development of cryogenic radiometers
We have measured the thermal conductivity of polyimide rod at temperatures from 2.4 K to 8 K, and the specific heats of polyimide rod and a black paint at 2.4 K and 4.4 K.
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Subminiature Infrared Detector Translation Stage
Upon assembly of the first prototype unit the use of individual ball bearings between stages was replaced with Vespel polyimide rods .
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Salicylic acid‐derived poly(anhydride‐esters) inhibit bone resorption and formation in vivo
The bone-plate was machined from 0.5-in.-diameter polyimide rod stock (Small Parts Inc., Mi- ami Lakes, FL) and was nominally 22-mm long ϫ 5.5-mm wide.
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Solid phase forming of plastics by high frequency impact
… the more difficultly processable mate- rials, our initial efforts utilized commonly used com- mercial resins with two exceptions:an experimental re- sin supplied by Du Pont KS ARAMID Resin powder and Du Pont’s commercially available “Vespel” polyimide rod stock used in our …
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Federal Register > Friday, September 27, 2002 > [67 FR 61169] Government-Owned Inventions, Available for Licensing
NASA Case No. LEW-17299-1: Polyimide Rod -Coil Block Copolymers As Membrane Materials For Ion Conduction; .
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Rod/Coil Block Copolyimides for Ion-Conducting Membranes - Nasa Tech Briefs :: NASA Tech Briefs
… a variety of straight or branched polyimide segments; x and y are zero or greater; and is 1 or greater. "/>Rod/coil block copolyimides are so named because each molecule of such a polymer comprises short polyimide rod segments alternating with flexible …
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Journal of Biological Engineering | Full text | Strategies for ocular siRNA delivery: Potential and limitations of non-viral nanocarriers
In contrast, the Iluvien (Alimera Sciences) drug delivery system consists of a very small cylindrical polyimide rod loaded with fluocinolone acetonide (FAc) capable of being injected through a 25-gauge needle and releasing low levels of drug for up to 3 years …
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http://www.nasa.gov/centers/glenn/pdf/168206main_CenterResume.pdf
• Polyimide Rod -Coil Block Copolymers as Membrane Materials for Ion Construction (2005 .
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Manufacturing Methods and Technology for Tactical Miniature Crystal Oscillator
Four polyimide rods which press fitinto tubes on the hybrid package are used for providing lateral supportto the electron- ics assembly.
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The transition jump system for the AGS
When purchased they were mounted as stacks of 12 on an insulating non-reinforced polyimide rod .
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