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Supplier: Plastronics Socket Company, Inc.
Description: - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 amps
- Features: Open Top Socket
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Supplier: Plastronics Socket Company, Inc.
Description: - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 amps
- Features: Clamshell Socket
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Supplier: Plastronics Socket Company, Inc.
Description: With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 to 2.93 amps
- Features: Open Top Socket
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Supplier: Plastronics Socket Company, Inc.
Description: With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 to 2.93 amps
- Features: Clamshell Socket
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Supplier: Sensata Technologies
Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal contact for package e-pad Solutions for Power
- Contact Plating: Gold Plating
- Contact Resistance: 200 milliohms
- Operating Temperature: 150 C
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: GHz QFN sockets provide 10 GHz bandwidth in a small cost effective ZIF socket for prototype and test applications. The GHz QFN socket is a simple mechanical socket based on an elastomer connector technology. The GHz QFN socket is a solder-less socket that can be directly mounted
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.4000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Aries Electronics, Inc.
Description: (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: Aries Electronics, Inc.
Description: testing and burn-in). Excellent choice for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: Ironwood Electronics, Inc.
Description: {size:8.5in 11.0in; margin:1.0in 1.25in 1.0in 1.25in; mso-header-margin:.5 in; mso-footer-margin:.5 in; mso-paper-source:0;} div.Section1 {page:Section1;} --> These industry leading probing adapters for QFN/MLF allow probing connection to all pins of the chip. A high
- Contact Plating: Gold Plating
- Contacts Pitch: 0.5000 mm
- Mounting: SMT, Through-hole
- Number of Contacts: 32
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Supplier: Sensata Technologies
Description: Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has opening for
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: {size:8.5in 11.0in; margin:1.0in 1.25in 1.0in 1.25in; mso-header-margin:.5 in; mso-footer-margin:.5 in; mso-paper-source:0;} div.Section1 {page:Section1;} --> These industry leading probing adapters for QFN/MLF allow probing connection to all pins of the chip. A high
- Features: Solderless, ZIF Lock
- Product Type: IC Probing / Analysis Adapters
- RoHS Compliant: Yes
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Supplier: JC Cherry, Inc.
Description: Test Socket GU29 Frame / QFN pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For QFN Device How to order for Custom design GQ29-QFNxxxxxxx *P/N will be informed after fixing specifications. *Made to
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware. The
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 0.5000 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ?Highly reliable M-pin Probes as contact parts ?High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max
- Contact Resistance: 100 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
- Operating Temperature: -40 to 150 C
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Supplier: Aries Electronics, Inc.
Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications
- Contact Plating: Gold Plating
- Contact Resistance: 20 milliohms
- Contacts Pitch: 0.3200 mm
- Current Rating: 4 amps
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
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Supplier: Molex Signal Tech Industrial Ltd.
Description: to +125 °C Consistent stable contact resistance 120 m? (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: Powell Electronics, Inc.
Description: 3M Textool Open-Top Sockets for QFN Ap
- Product Type: IC Socket
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact plating Gold over Nickel
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 40
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact plating Gold over Nickel
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 48
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact plating Gold over Nickel
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 48
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact plating Gold over Nickel
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 32
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Integrated Circuits (ICs)>Data Acquisition>Analog to Digital Converters (ADC) Package: 28-QFN Exposed Pad Product Status: Active Type: Header, Male Pins, Shrouded (4 Side) Number of Positions: 5 Positions Per Level: 5 Pitch: 0.200" (5.08mm) Header
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Connectors,Interconn ects Part Status: Obsolete Type: Header, Male Pins, Shrouded (4 Side) Output: 3-State Reset Timeout: 20µs Typical Propagation Delay Operating Temperature: -40°C ~ 85°C Mounting Type: Requires
- Output Options: Inverting, Active Low
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Connectors,Interconn ects Package: 292-LBGA Product Status: Preliminary Type: Header, Male Pins, Shrouded (4 Side) Applications: Telecom Features: RF IC Linear Equalizer General Purpose 0Hz ~ 32GHz - 32-QFN (5x5) Operating Temperature: -40°C ~ 85°C
- IC Package Type: Other
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Connectors,Interconn ects Packaging: Bulk Part Status: Obsolete Connector Style: High Density (HDC, HDI, HPC) Connector Type: Header, Cuttable Number of Positions: 68 Mounting Type: Through Hole Termination: Solder Features: ARM® Cortex®-M3 series Microcontroller
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standards from engineering requirements to high-volume production, ensuring versatility and cost-effectiveness. It’s a great test solution for BGA, LGA, QFN and other variants. (read more)
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contact is designed for testing LGA, QFN, QFP and other variants. Contact our product specialists today to find out more. Ask the Expert (read more)
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DaVinci 112 Test Socket: A Game-Changer in High-Speed Chip Testing
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SD (Secure Digital) Card is a non-volatile memory card format for portable devices such as mobile phones, digital cameras, GPS navigation devices, and tablet computers. The three form factors are original size, mini size, and micro size. Our portfolio contains both the standard type and reverse type with push-push, push-pull and hinge versions.
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Browse IC Sockets and Headers Datasheets for Rego Electronics Inc. -
LGA 4677 Socket
TE Connectivity’s (TE) next-generation server processor LGA 4677 socket provides more connections between main board and CPU. Designed for the needs of new generation processors, these sockets support bandwidth intensive operations and contain a greater number of memory channels – greatly expanding input/output capabilities.
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Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment, as well as custom connectors for industrial applications.
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Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
TE Connectivity 's (TE) PCIe Gen 5 CEM connectors can enable all generations of PCI Express signaling and address the needs of higher speed performance with a roadmap of data rates that can reach up to 32 gigtransfers per second (GT/s) per differential signal pair. We can provide a broad product portfolio, early sample support, quick mass production and high reliable signal integrity per...
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Indicates content that may require registration and/or purchase.
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Development / Ceibo Inc.
Emulates AT89C5131/AT89C5131A Derivatives with 6/12 Clocks/Cycle 31K Code Memory Software Trace Real-Time Emulation Frequency up to 40MHz MS-Windows Debugger for C and Assembler Keil µVision2 Debugger Compatible PLCC, SOIC, QFP and 32- QFN Emulation Headers Serially Linked to PC at…
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Emulation / Development
Emulates AT89C5131/AT89C5131A Derivatives with 6/12 Clocks/Cycle 31K Code Memory Software Trace Real-Time Emulation Frequency up to 40MHz MS-Windows Debugger for C and Assembler Keil µVision2 Debugger Compatible PLCC, SOIC, QFP and 32- QFN Emulation Headers Serially Linked to PC at…
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Headers / Systems
Emulates AT89C5131/AT89C5131A Derivatives with 6/12 Clocks/Cycle 31K Code Memory Software Trace Real-Time Emulation Frequency up to 40MHz MS-Windows Debugger for C and Assembler Keil µVision2 Debugger Compatible PLCC, SOIC, QFP and 32- QFN Emulation Headers Serially Linked to PC at…
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V2DIP1-48
VNC2-48 Development Module
Datasheet
Two three way jumper pin headers are provided to allow for simple configuration of the I/O on data and control bus pins of the 48 pin QFN Vinculum-II.
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Lattice Delivers Low Cost and Convenience to Designers of Consumer Products
The kit is based on a 2.5" x 2" evaluation board that features the ProcessorPM POWR605 device in a lead-free 24-pin QFN package, a Power Manager II POWR6AT6, evaluation circuits … supply bus and processor interface, and an expansion header .
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S.N.A.K.E. : a dynamically reconfigurable Artificial Sensate Skin
(a) MSP430F1610 QFN Package. .... (b) FFC programming header .
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Design of an improved electronics platform for the EyeRing wearable device
* Jumper headers were removed, and buttons were sized down. .... o We chose a Linear Technology power management IC, the LTC3554, This QFN chip has battery charging…
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Power Electronic Packaging
…packages, such as the molded leadless package (MLP) or quad flat no lead ( QFN ) devices (as shown … traditional power packaging, such as the TO220 or TO252 (which have a thick header or tab), are…
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Skyworks AS225-313LF, 6QFN, -40 to 85 °C - Avnet Express
[eSpot_ Header _NA_1] .
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Cypress Semiconductor CY7C66113C-LTXC, 56QFN EP, 0 to 70 °C - Avnet Express
[eSpot_ Header _NA_1] .