QFN Header

Description: the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and

• Current Rating: 0.05 amps
• Contact Resistance: 50 milliohms
• Operating Temperature: -55 to 150 C
• Number of Contacts: 84

Description: the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and

• Current Rating: 0.05 amps
• Contact Resistance: 50 milliohms
• Operating Temperature: -55 to 150 C
• Number of Contacts: 84

Description: socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version. The H-Pin

• Current Rating: 0.05 to 2.93 amps
• Contact Resistance: 50 milliohms
• Operating Temperature: -55 to 180 C
• Number of Contacts: 200

Description: socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version. The H-Pin

• Current Rating: 0.05 to 2.93 amps
• Contact Resistance: 50 milliohms
• Operating Temperature: -55 to 180 C
• Number of Contacts: 200

Description: GHz QFN sockets provide 10 GHz bandwidth in a small cost effective ZIF socket for prototype and test applications. The GHz QFN socket is a simple mechanical socket based on an elastomer connector technology. The GHz QFN socket is a solder-less socket that can be directly mounted

• Number of Contacts: 44 to 84
• Contacts Pitch: 0.4 to 0.8 mm
• Contact Plating: Gold Plating
• Product Type: IC Socket

Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal contact for package e-pad Solutions for Power

• Contact Resistance: 200 milliohms
• Operating Temperature: 150 C
• Contact Plating: Gold Plating
• Product Type: IC Socket

Description: comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include QFN. Search-friendly keywords include connector, interconnect, header, socket, terminal block, QFN, Electronic Connector,

Description: Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers to spring pins Two finger knob - easy to operate even at high force Lid assembly can be easily removed Lid has opening

• Product Type: IC Socket

Description: Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations confirm application Positive locking lid High mechanical

• Product Type: IC Socket

Description: Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin

• Contact Resistance: 349.99999999999994 milliohms
• Operating Temperature: 125 C
• Contact Plating: Gold Plating
• Product Type: IC Socket

Description: BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 27MHz, QFN. Search-friendly keywords include connector, interconnect, header, socket, terminal block, 27MHz, QFN, Electronic Connector, Specialized Backplane Connectors.

Description: OTP PROGRAMMING SOCKET, QFN-56, PMIC; Accessory Type:OTP Programming Socket; For Use With:NXP PF Series Programmer; Features:56QFN Socket, Configures PF Family of PMIC Devices, 8pin Connector Header for Programmer; Product Range:- RoHS Compliant: Yes

Description: innovative, protected, validated and released product with capacity and quality control available to meet existing and emerging customer needs MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and

• Current Rating: 4 amps
• Operating Temperature: -55 to 200 C
• Contacts Pitch: 10.16 mm
• Socket Type: BGA, LGA, QFN, Test / Prototyping Socket

Description: Test Socket GU29 Frame / QFN pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ●High reliability ●Cost competitive ●Temperature: -40 to +150℃ For QFN Device How to order for Custom design GQ29-QFNxxxxxxx *P/N will be informed after fixing specifications. *Made to

• Product Type: IC Socket
• Socket Type: Test / Prototyping Socket

Description: for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag Particles

• Operating Temperature: -67 to 392 C
• Contacts Pitch: 2.54 mm
• Socket Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket
• Features: Clamshell Socket, Other

Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ●Highly reliable M-pin Probes as contact parts ●High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max

• Voltage Rating: 100 volts
• Current Rating: 1 amps
• Contact Resistance: 100 milliohms
• Operating Temperature: -40 to 150 C

Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications GENERAL SPECIFICATIONS INSERTION LOSS: less than -1dB

• Current Rating: 4 amps
• Contact Resistance: 20 milliohms
• Operating Temperature: -40 to 65.55555555555556 C
• Contacts Pitch: 0.32 mm

Description: bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low configuration to protect spring probes during use Benefits Tested to 500K Short contact path for excellent DC performance RF

• Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
• Product Type: IC Socket

Description: 3M Textool Open-Top Sockets for QFN Ap

• Product Type: IC Socket

Description: Manufacturer: AMIS Category: Integrated Circuits (ICs)>Data Acquisition>Analog to Digital Converters (ADC) Package: 28-QFN Exposed Pad Product Status: Active Type: Header, Male Pins, Shrouded (4 Side) Number of Positions: 5 Positions Per Level: 5 Pitch: 0.200" (5.08mm) Header

Description: Manufacturer: AMIS Category: Connectors,Interconnects Package: 23-PowerQFN Product Status: Active Type: Header, Male Pins, Shrouded (4 Side) Package Cooled: Intel LGA1156 & LGA1155 Cooler Attachment Method: Bolt On and PC Pin Shape: Round Length: 0.50' (152.4mm) Width: 0.530" (13.46mm)

Description: Manufacturer: AMIS Category: RF and Wireless - RFID Transponders, Tags Part Status: Obsolete Capacitance: 0.22μF Tolerance: ±20% Voltage - Rated: 1.3VDC Type: Header, Male Pins, Shrouded (4 Side) ESR (Equivalent Series Resistance): 5mOhm Operating Temperature: -40°C ~ 85°C Lifetime @ Temp.:

Description: voltage regulators, thermistors, connectors, sockets, headers, and jumpers. Also covers SMT component types (QFPs, PLCCs, rectangular chips, MELFs, SOICs, molded tantalum capacitors, SOTs, DPAKs), leadless components, QFNs, DFNs, LGAs, CCGAs and BGAs. Introduces resistor, capacitor and

Description: Power (DRP) and Role Swap Support Small Form Factor 4x4 mm 28-QFN Integrated Analog Reduces Bill of Materials and Design Footprint VCONN FETs with Rp/Rd Switching Dead Battery Rd termination Current Sense for Vbus Overcurrent conditions Voltage Sense for Vbus Overvoltage conditions Type-C/ PD

Description: Header (IPv4)/TCP/UDP/ICMP checksum generation and checking Supports IPv6 TCP/UDP/ICMP checksum generation and checking Automatic 32-bit CRC generation and checking Simple SRAM-like host interface easily connects to most common embedded MCUs. Supports multiple data frames for transmit and

• Number of Ports: 1
• Operating Temperature: -40 to 85 C
• Features: Other