-
Supplier: CoorsTek
Description: CoorsTek photomask substrates are made from high-purity synthetic quartz glass to deliver superior UV and visible light transmittance, thermal stability, electrical insulation, low birefringence, and durable chemical stability. Advanced, scalable polishing technology makes these
- Applications: Chemical / Materials Processing
- Features: Dielectric / Electrical Insulation, Other
- Shape / Form: Wafer Carrier / Holder
-
Supplier: CoorsTek
Description: CoorsTek provides high-performance, critical-duty ceramic components for Flat Panel Display (FPD) manufacturing from a range of specialized, high-purity engineered ceramics. Large-scale synthetic quartz LCD photomask substrates Etch processing components CVD deposition processing
- Density: 3.72 to 5.91 g/cc
- Thermal Conductivity: 5 to 31 W/m-K
- Coeff. of Thermal Expansion (CTE): 8 to 10 µm/m-C
- MOR / Flexural Strength: 43,511.0518071591 to 94,273.945582178 psi
-
Supplier: IRD Glass
Description: IRD Glass is a World Class Supplier of precision glass, optical and ceramic components. For over twenty five years, IRD Glass has served the aerospace, defense, sensor, machine vision, laser, technical glass, optical, process control and medical industries (to name just a few). Their clients
- Size Capabilities: 0.3149608 to 20 inch
- Materials Processed: Aluminosilicate, Borosilicate, Dichroic, Fluoride Glass, Glass Ceramic, Quartz, Silicate / Fused Silica, Soda Lime
- Secondary Operations: Anti-Reflective Coating, Chemical Treating, Etching / Blasting, Glass to Ceramic Bonding, Glass to Metal Bonding, Heat Treating, Hermetic Sealing, Lapping / Polishing, Screen Coating, Silvering / Metallizing
- Services: Design Assistance, Glass Cutting / Profiling, Glass Part Fabrication, Inspection / Testing, Material Selection
-
-
Supplier: Abrisa Technologies
Description: Abrisa Technologies provides precision custom machined optical components from prototype to high volume and OEM production. We can apply a variety of precision processes, individually or in combination, to any glass substrate. 90% of Glass Fabrication requirements are unique, consequently when you
- Materials Processed: Aluminosilicate, Borosilicate, Dichroic, Germanium / Semiconductor, Glass Ceramic, Quartz, Silicate / Fused Silica, Soda Lime
- Secondary Operations: Anti-Glare Coating, Anti-Reflective Coating, Chemical Treating, Etching / Blasting, Glass to Ceramic Bonding, Glass to Metal Bonding, Heat Treating, Lapping / Polishing, Safety Coating, Screen Coating, Silvering / Metallizing
- Applications: Architectural, Lighting, Optical / Semiconductor, Packaging (Ampules / Containers), Photomask Fabrication, Vehicular / Marine (OEM Autoglass)
- Services: Design Assistance, Glass Cutting / Profiling, Glass Part Fabrication, Inspection / Testing
Find Suppliers by Category Top
Conduct Research Top
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
in the development and optimization of Oasis database technology for photomask layout exchange and interchange. Focus targets video distribution with UWB chip set Focus Enhancements Inc., a video production and conversion technology developer, said it has received first silicon for its 880-Mbps
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
startup Oasis Tooling is expected to announce next week that Aprio Technologies is the first commercial licensee of Oasis test cases and tools to assist in the development and optimization of Oasis database technology for photomask layout exchange and interchange. Focus targets video distribution
More Information Top
Indicates content that may require registration and/or purchase.
-
Plasma-assisted quartz-to-quartz direct bonding for the fabrication of a multilayered quartz template for nanoimprint lithography
The multilayered quartz template is fabricated by bonding a square piece of a standard quartz wafer, which is about 625 μm in thickness, to a wet-etched 6.35 mm thick quartz photomask plate.
-
Characterizing photolithographic linewidth sensitivity to process temperature variations for advanced resists using a thermal array
The sys- tem is demonstrated for the optimization of the post-apply and post-exposure thermal-processing conditions for chemi- cally amplified photoresists used in the fabrication of quartz photomasks .
-
Application of laser scatterometry to characterize phase-shifting masks
etched quartz photomasks were measured for surface scatter and were found unsuitable .
-
Study of the molecular contaminants deposition on Cr, MoSi and SiO2 surfaces representative of photomasks layers
We investigated the deposition of the molecular contaminants on Cr, MoSi and quartz photomask surfaces by means of representative Cr, MoSi and SiO2 layers deposited on wafers using TD-GCMS for the organics and LPE-IC for the SO2 analysis.
-
New application of variable‐pressure/environmental microscopy to semiconductor inspection and metrology
The samples utilized in the study were current state-of- the-art 150 mm binary and phase shifting chromium on quartz photomasks .
-
http://dspace.mit.edu/bitstream/handle/1721.1/38853/40520264-MIT.pdf?sequence=2
Materials Chrome-on- quartz photomasks (thickness, 0.09 inch) were fabricated by Advance Reproductions Co. (North Andover, MA).
-
Investigation of quartz defect printability at the 65-nm node
Greater resolution capability is realized with the improved contrast over standard binary chrome on quartz photomasks .
-
Quartz etch challenges for 45nm phase-shift masks
CPL quartz photomask applications have garnered more attention over the last couple of years as a viable option for RET methods to improve lithography performance at the wafer.
-
ICP quartz etch uniformity improvement for phase-shift mask fabrication
The Quartz etch improvement program is established to technically understand and ascertain the limits, hardware implications and process conditions associated with the etching of Quartz Photomasks .
-
Plasma etching of quartz for the fabrication of alternating aperture phase-shift photomasks: etch rate uniformity study utilizing a next-generation ICP source
Characterization of the Gen III source in this article includes measurements of plasma parameters and quartz photomask etch results.