Quartz Vacuum Chambers

Description: Sapphire windows are used in Semiconductor process chambers as well as many other high vacuum applications. Process environments using aggressive chemistries such as NF3 and CF4 rapidly erode quartz windows with the quartz surface becoming cloudy. Extended exposure can

• Diameter, Square Side, or Rectangular Length: 300.00000000000006 mm
• Thickness: 0.5 to 12.700000000000001 mm
• Wavelength Range: 200 to 3,500 nm
• Window Shape: Circular, Rectangular, Square

Description: vacuum chambers: Tube type (for load-lock, transfer, and process chambers) Disk type (for narrow space chambers) Quartz type (for thermal processing and LPCVD chambers) RECOMMENDED DEPOSITION CHAMBER COMPONENT MATERIALS CoorsTek uses a broad portfolio

• Filter Medium Material: Ceramic
• Features: Other

Description: (options depending) Chamber Height: 100mm Heated Area: 230 x 217mm Chamber Lid Open/Closing: Manual IR Heating: Array of 8 IR lamps in Quartz glass tubes (2 Heating zones) Power connection: 3Ph-N-PE 230/400V, 50/60Hz Power: 6,5 kW Features SRO-700 Flux-less, with Flux and solder

• Temperature Range: 450 to 700 F
• External: Bench / Cabinet

Description: install (by welding) the viewport into a new or existing vacuum chamber wall. The quartz windows are easily replaced if damaged by dis-assembling the flange set.

• Flange OD: 4.47 to 9.97 inch
• Operating / Bake-out Temperature: -4 to 392 F
• Features: All Ports Same Type
• Port Type: Flange

Description: Nor-Cal Products offers a complete line of viewports for vacuum chambers with NW, ISO and CF flanges. CF flanged viewports are available with fully annealed 7056 glass or fused quartz. Special materials and coatings, such as sapphire and anti-reflective (AR) coating, are

• Flange OD: 2.75 to 10 inch
• Operating / Bake-out Temperature: -4 to 392 F
• Length / Thickness: 0.5 to 0.968 inch
• Features: All Ports Same Type, Door

Description: Add-A-Doors provide a simple, effective method of providing an elastomer sealed access port to an existing chamber fitting or component. These products include a fused silica viewport hinged door and easily bolts to a like CF flange using standard hardware. The door itself is secured with a

• Flange OD: 4.5 to 10 inch
• Operating / Bake-out Temperature: -4 to 392 F
• Viewing Diameter: 1.4 to 5.38 inch
• Length / Thickness: 0.74 to 1.28 inch

Description: As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF

• Materials Processed: Compound Semiconductors / GaAs, Metal, Tungsten / Refractory Metal
• Features: Integral Process Controller, MEMS, Medical, Other, Photovoltaic / Solar, Research / Surface Analysis, Semiconductor Manufacturing
• Type: Laboratory / Benchtop
• Vacuum / Pressure Range: Medium (< 1, >10-3 torr)

Description: consists of four main subsystems: a vacuum chamber, a temperature control system, internal configuration, and a data acquisition system. A test procedure for collecting data and a test method for processing and presenting the collected data are included.

Description: section of rectangular waveguide, and 2) waveguide transmission through a quartz window into a cylindrical vacuum chamber based multimode cavity. Hydrogen recoveries of up to 98% have been obtained. Three primary mechanisms of methane decomposition have been identified: methane

Description: makes the discovery a node on your network enabling real-time, remote support and upgrades. System Pumping Configurations The Phoenix 400 inline system can be delivered with vacuum pumping configurations to fit process or budgetary requirements. Process chambers are typically designed

Description: processing large area glass substrates, they can however also be used as lapping machines. A self aligning swing arm assembly positioned above the polishing surface is mounted to a swivel head work piece pressure plate. Work pieces of varying geometries can be retained by surface tension or

• Maximum Part Diameter / Width: 780 mm
• Features: Automated Loading, Flat Panel Display, Integral Process Controller, MEMS, Magnetic Storage, Optical Coatings, Other, Semiconductor Manufacturing
• Type: Batch System (Single Chamber / Multiple Wafers), Continuous / Web System, Inline System (Semi-continuous)
• Materials Processed: Dielectric / Ceramic, Metal, Oxides, Silicon