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Description: nozzles Thermocouple protection tubes and sheath Boron doping wafers in silicon semiconductor processing Sputtering targets Break rings for horizontal casters Wintrustek Advanced Materials is a leading ceramic materials supplier. We provide high
- Material Type: Boron Nitride
- Shape / Form: Tube / Sheath - Immersion (Closed End)
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Supplier: JTEKT North America, Inc.
Description: For the semiconductor and LCD production equipment, various performance is needed in high-temperature, corrosion resistance, magnetism resistance and low dust generation characteristics according to each process as well as cleanliness. JTEKT supplies special specification bearings for each
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Description: Aluminum Nitride (AlN) is a suitable material to utilize when high thermal conductivity and electrical insulation are required, making it perfect for use in thermal management and electrical applications. Furthermore, AlN is a popular alternative to Beryllium Oxide (BeO) in the semiconductor
- Material Type: Aluminum Nitride
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Description: Boron Nitride is a high-temperature ceramic that has a structure similar to graphite. Our portfolio of hot-pressed solid materials includes pure Hexagonal Boron Nitride as well as composites suitable for applications requiring excellent thermal properties combined with electrical isolation
- Material Type: Aluminum Nitride, Boron Nitride
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Description: Boron Nitride is a high-temperature ceramic that has a structure similar to graphite. Our portfolio of hot-pressed solid materials includes pure Hexagonal Boron Nitride as well as composites suitable for applications requiring excellent thermal properties combined with electrical isolation
- Density: 1.5 to 1.6 g/cc
- Material Type: Aluminum Nitride, Boron Nitride
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stress than the rest of the wafer. When temperatures in the furnace exceed about 1000°C, these stresses often become significant and portions of the single crystal wafer move relative to each other along crystallographic plates in response to that stress. This phenomenon, called "slip", effectively destroys the value of the semiconductor devices located in the area of the wafer where slip has occurred. (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
semiconductor industry, including our LeakDefender™ Brand Thermocouples that enable real-time gas monitoring to minimize wafer loss and maximize thermocouple life. (read more)
Browse Thermocouple Temperature Probes Datasheets for Conax Technologies -
wafer carrier, is called pocket wafer in English. It is widely used in CVD and vacuum sputtering of semiconductors. We can provide customers with customized wafer carriers of silicon and silicon carbide materials to meet customers' different application needs. It can provide bearing plates (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
semiconductor industry, including Conax LeakDefender™ Brand Thermocouples that enable real-time gas monitoring to minimize wafer loss and maximize thermocouple life. (read more)
Browse Thermocouple Temperature Probes Datasheets for Conax Technologies -
generate a eutectic melt with the ceramic, resulting in metal bonded ceramic substrates; and lastly, circuit substrates are produced. They are primarily used in high-temperature gaskets, chilling plate, and packaging of power semiconductor modules. DPC Ceramic (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Semiconductor: actuators, beamlines, connectors, feed-throughs, leak detectors, sensors, wafer handlers Aerospace: reservoirs, toggle switches, cold plate assemblies, fuel drains, engine kiss seals Oil & Gas: actuators, connectors, couplings, feed-throughs, gas (read more)
Browse Metal Bellows Datasheets for Technetics Group -
. Semiconductor & Electronics – Substrates, insulators, and wafer carriers with high dielectric strength and chemical inertness (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
ETEL launches TELICA, its new multi-axes platform primarily dedicated to semiconductor back-end applications. Its dual gantry architecture provides motion along 3 degrees of freedom, X, Y and Z, for a total number of 8 controlled (read more)
Browse Multi-axis Positioning Systems Datasheets for ETEL S.A. -
Peltier Inside, a Peltier module has P-type and N-type semiconductor pellets. These pellets connect electrically in series and thermally in parallel, sandwiched between two ceramic plates. When current flows, electrons move from the P-type to the N (read more)
Browse Human Machine Interfaces Datasheets for ODG (Origin Data Global) -
Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. You can benefit from Sonkit with: (read more)
Browse Metal Ring Seals Datasheets for Sonkit (Shanghai) Industry Technology Co., Ltd.
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Hot Pressing Aluminum Nitride Used For Semiconductor Fabrication Equipments
Hot pressing Aluminum Nitride (AlN) ceramics are used as wafer heating plates and wafer holding electrostatic chucks in semiconductor fabrication equipments.
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Effect of heat source area on the thermal resistance of the wick columns vapor chambers
Lim and Rhi [11] experimentally studied the nanofluidic heat pipe hot chuck plate in semiconductor wafer baking process.
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Fluid-solid interaction in electrostatically actuated carbon nanotubes
[13] T. K. Lim and S. H. Rhi, Experimental study on nanofludic heat pipe hot chuck plate in semiconductor wafer baking process, Journal of Mechanical Science and Technology, 24 (2010) 1501-1509.
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Precision laser annealing of silicon devices for enhanced electro-optic performance
Thermal annealing is typically done with equipment that heats the entire semiconductor wafer by using a lamp, hot plate or furnace.
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Printed inorganic transistors
After the solvent evaporated, more semiconductor was deposited or the wafer was heated on a hot plate .
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Inorganic semiconductors for printed transistors
After the solvent evaporated, more semiconductor was deposited or the wafer was heated on a hot plate .
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Chemistry and Lithography
…of production to chemical amplification resists.80 To achieve the stringent temperature uniformity specifications necessary for the tight CD control specifications for advanced semiconductor lithography, careful con- sideration of the vacuum hot plate design including uniform wafer -to-hot-plate contact…
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Manufacture Engineering, Quality and Production System II
In other words, after the wafer is located within the processing heat pipe hot chuck plate (HPHCP), the yield strength of a semiconductor could be influenced directly by control speed and homogeneity of wafer temperature [1].
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Extreme ultraviolet interference lithography as applied to photoresist studies
It will be required to rigorously separate all hardware that is in direct contact with the wafer such as exposure stages, spin coaters, hot plates , develop equipment, etc. between units … used for research with the semicon- ductor industry and units that…
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Boron Minerals and Chemicals
Boron nitride in hot - pressed solid form is used in many applications, including … aluminum vacuum evaporations as a diffusion source in silicon wafer production, in insulators for … in jigs used in semiconductor manufacturing, in heat radiating plates , in setters for aluminum…
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Microelectronics Manufacturing Education
…definelaboratory facilitiesas follows: 1) Basic Educational Facility - 3 to 6 furnace tubes, resist spinner,bake oven or hot plate , contactprinters, wet etch Hood … Stain, SUPREM11,HP 4145 Semiconductor parameter Analyzer and Prober … LPCVD Poly and Nitride, Wafer CoatDevelop System,Steppers,PlasmaEtch…