Through-hole 0.5mm BGA Socket

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  • IC Component Sockets
    For example, for the stamped contact design, BGA sockets are mounted to the board using a through - hole method. This can create a significant bottleneck for escape routing on the PCB, making it unusable for a 0.5 - mm pitch application [28].
  • Package Size Reduction & Solder Joint Reliability for High Density Semiconductor Packaging
    Solder ball pitches in wide use have included 1.27 mm, 1.0 mm, 0.8 mm, 0.65 mm, and 0.5 mm coupled with corresponding solder ball diameters and pad diameters. While BGA packaging has enabled a significant increase in interconnect density over predecessor perimeter leaded packages (like DIPs, QFP … … most efficient usage of motherboard real estate due to the interaction of various motherboard features, including plated through holes and circuit traces with … … these kinds of optimization are not possible due to the requirement for custom sockets and tooling as …
  • New material technology for high density interconnections
    The electronicindustry is continuingits evolution away from through hole and pin grid array (PGA) intemptedcircuit packages to surfacemounted components. … and SOCs, are being replaced by higher density packages such asball grid arrays ( BGA )and chip scale … Sockets have long lead times and are expensive. Today’spackaging pitches of 1.26 mm peripheral arrays are rapidly being replaced by 1. Omm and even 0.5 mm area arrays.
  • Integrated Circuit Packaging, Assembly and Interconnections
    While allowing for a higher I/O count, at the board level (Level 2.0) the PGA needed to be through - hole solder attached or socketed to the PWB. This lead to the development of Ball Grid Array ( BGA ) packages (Fig- ure 3-8(a)) with … The solder balls are on a smaller pitch, Figure 3-8(b), ranging from 1 mm (40 mil) down to 0.5 mm (20 mil), totally confined within the body of the package.
  • 1921125-5 TE Connectivity / AMP Brand | Socket Connectors
    BGA Socket 0.5 mm Through Hole .
  • ZCP1999ISTFA049
    Since the pitch between individual signal pins was so small for this packaged (approximately 0.5 mm ) it was not practical to manually place the probe tip and ground connections on the contact leads of the package. A standard socket for the device was used to provide a wider pitch array of the pins. A wirebond BGA device mounted on a printed circuit board was tested to determine if the fault … The TDR analysis was accomplished nondestructively since through hole vias in the board were available to make contact to failing signal pin.
  • http://www.nxp.com/documents/data_sheet/TDA8601.pdf
    … for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm . [10] Image sensor packages … They are mounted in sockets or delivered pre-mounted on flex foil. Through - hole mount BGA , HTSSON..T [5], LBGA, LFBGA, SQFP, SSOP..T [5], TFBGA, VFBGA, XSON not suitable .
  • http://www.nxp.com/documents/data_sheet/TDA8920B.pdf
    … for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm . [10] Image sensor packages … They are mounted in sockets or delivered pre-mounted on flex foil. Through - hole mount BGA , HTSSON..T [5], LBGA, LFBGA, SQFP, SSOP..T [5], TFBGA, VFBGA, XSON not suitable .
  • http://www.twi-global.com/EasysiteWeb/getresource.axd?AssetID=323990&type=full&servicetype=Attachment
    Ingots (80 x 20 x 5 mm ) of SAC305, SAC305Ni (Sn, 3.0%Ag, 0.5 %Cu, 0.1%Ni), SAC305P (Sn, 3.0%Ag, 0.5%Cu, 0.01%P) and SAC305Ce (Sn, 3.0%Ag, 0.5%Cu, 0.05%Ce) were fabricated. … touching up (passive components rework, QFP/gull wing rework, ECO wiring, solder pad repair); rework of ball grid array ( BGA ) chip scale packages (heat … … for rework of BGA sockets using solder paste; X-ray inspection of rework; through - hole hand-soldering rework; through …