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Supplier: Technic, Inc.
Description: In most semiconductor processing systems, bases are required for proper fabrication of the silicon chip. Technic manufactures a full range of pure base chemistry specifically for the semiconductor industry. Our high level of quality guarantees customers consistent and superior results. To inquire
- Applications: Electronics / Semiconductors
- Form: Organic Chemical / Polymer
- Function: pH Modifier - Base
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Supplier: HORIBA Instruments, Inc.
Description: The HE-960TM offers high precision measurement of the conductivity of TMAH (Tetra Methyl Ammonium Hydroxide) solutions, the main component of the photoresist developer that is used in semiconductor and liquid crystal processes. The HE-960TM is also an environmentally-frie ndly product
- Display Type: Digital Display
- Measures Conductivity / Dissolved Solids: Yes
- Mounting / Environment: In-Situ / Field
- Temperature Compensation: Yes
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
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Supplier: HORIBA Instruments, Inc.
Description: Accurately measures the concentration of TMAH (Tetra Methyl Ammonium Hydroxide), which is the main component of the photoresist developer solutions in semiconductor manufacturing. Wide measurement range : 0 - 10 %. Have the chemical resistant carbon sensor. Wide range measurement
- Analog Input Type: DC Voltage
- Depth: 115 mm
- Display Technology: LED
- Display Type: Combination
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Supplier: HORIBA Instruments, Inc.
Description: Accurately measures the concentration of TMAH (Tetra Methyl Ammonium Hydroxide), which is the main component of the photoresist developer solutions in semiconductor manufacturing. Repeatability: within +/- 0.003%. Measurement range : 0 - 3 %. Have the chemical resistant carbon sensor
- Analog Input Type: DC Voltage
- Depth: 115 mm
- Display Technology: LED
- Display Type: Combination
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Supplier: DigiKey
Description: MW ADAPTER HC2 TO 1.85(M)
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Supplier: HORIBA Instruments, Inc.
Description: The CS-139E is a high-precision chemical concentration monitor designed for use with TMAH/H2O2 solutions used in cleaning processes during semiconductor manufacturing. It offers a faster response speed and a more compact size than anything available to date, and monitors the concentrations of
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Supplier: Esprix Technologies
Description: Esprix offers a full range of chemicals for micro and macro (PCB) applications. Products include oxidizing compounds, corrosion inhibitors, chelating compounds, solvents, and surfactants . Solvents: DMSO, NMP, TMAH, MEA, N-aminopropylmorphol ine, Butyldiglycol
- Type: Solvent
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Supplier: Technic, Inc.
Description: A TMAH free solution that offers similar performance to the TechniStrip NF52. High resin dissolution and very good metal compatibility.
- Industry Applications: Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent, Stripper (Paint, Resins)
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Supplier: Technic, Inc.
Description: Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXt, AZ40XT and AZnLOF 2000 series. High metal compatibility from a DMSO and TMAH free solution.
- Industry Applications: Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent, Stripper (Paint, Resins)
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Supplier: Technic, Inc.
Description: A highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications. Developed to address laminated photo-resins and liquid resins, the novel stripping formulation of this TMAH/DMSO chemistry exhibits high dissolution performance compared to standard
- Industry Applications: Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent, Stripper (Paint, Resins)
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Supplier: TCI America
Description: Tetramethylammonium Hydroxide (10% in Methanol) / TMAH For GC analysis, the substance to be analyzed must be in the gaseous form. Because of this, the analysis of many organic compounds requires that injections, columns, and detectors are kept at relatively high temperatures. However, many
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Supplier: ASTM International
Description: reagent. The use of diazomethane is detailed in the Appendix. Methyl esters may be formed through the use of tetramethylammonium hydroxide (TMAH), trimethylphenylammon ium hydroxide (TMPAH), or N,N-dimethylformamid e dimethyl acetal (DMF-DMA). 1.2.2 The two methods for determining
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Supplier: ASTM International
Description: . The use of diazomethane is detailed in the Appendix. Methyl esters may be formed through the use of tetramethylammonium hydroxide (TMAH), trimethylphenylammon ium hydroxide (TMPAH), or N,N-dimethylformamid e dimethyl acetyl (DMF-DMA). 1.2.2 The two methods for determining the amount
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Supplier: ASTM International
Description: . The use of diazomethane is detailed in the Appendix. Methyl esters may be formed through the use of tetramethylammonium hydroxide (TMAH), trimethylphenylammon ium hydroxide (TMPAH), or N,N-dimethylformamid e dimethyl acetal (DMF-DMA). 1.2.2 The two methods for determining the amount
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Supplier: ASTM International
Description: . The use of diazomethane is detailed in the Appendix. Methyl esters may be formed through the use of tetramethylammonium hydroxide (TMAH), trimethylphenylammon ium hydroxide (TMPAH), or N,N-dimethylformamid e dimethyl acetal (DMF-DMA). 1.2.2 The two methods for determining the amount
Featured Products Top
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-Line/Broadband sensitivity, 1:1 aspect ratio capability Adjustable sidewall profile angle Aqueous alkaline development (standard 0.26N TMAH developers) Suitable for metal evaporation physical vapor deposition processes Pattern thermal stability up to 200°C (read more)
Browse Conformal Coatings Datasheets for Kayaku Advanced Materials, Inc. -
resist 10 to 40 μm film thickness in a single coat i-Line/broadband sensitivity, 3:1 achievable aspect ratio No rehydration or latency delay Aqueous alkaline development (standard 0.26N TMAH) Excellent chemical resistance and residue-free removal Material uses Electroplatting RDL Microbumping (read more)
Browse Conformal Coatings Datasheets for Kayaku Advanced Materials, Inc.
Conduct Research Top
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
to the. stamping process [46], was removed by 5 min of wet etching. using TMAH 25% at 701C. To facilitate the stamping. Figure 1. 2-D top. view schematic. of the microdevices. All dimensions. are in mm. Figure 2. log(g) surface plot of (A) device 1, (B) device 2, (C). device 3, (D) device 4, at an applied