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Supplier: Rigaku Corporation
Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 to 300 mm
- Measurement Capability: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-V310 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Fischer Technology, Inc.
Description: conditions deliver reliable results. The instrument is suitable for use in clean rooms, and a comprehensive equipment catalog allows simple integration into existing wafer fabs. Features: Fully automated wafer handling and test process enables efficient staff deployment
- Mounting / Loading Options: Benchtop / Floor
- Type: Thickness Gage
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Supplier: Filmetrics, Inc.
Description: Boost the Capabilities and Extend the Life of Your NanoSpec™ 180/210 System Your NanoSpec™ has been a workhorse for your fab, but many years of use may have caused maintenance costs to balloon. The F40-NSR converts your NanoSpec™ 180/210 into a modern-day measurement
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Monitor / Instrument
- Measurement Capability: Optical Constants (n, k)
- Non-contact: Yes
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Supplier: SPIE - Education
Description: DFM process so that his/her design can be fabricated by the target manufacturing partner/vendor on specific equipment. We will review such DFM for wafer fab via optical lithography (tape-out process), single point diamond turning (SPDT), or holographic optics recording specification.
- Modality: On-site / In Plant
- Technology / Subject: Instruments / Sensors, Photonics / Optics
- Type: Course
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are widely used in wafer inspection stages, lithography scanners, metrology tools, and dicing equipment. Technical Highlights Uniform Air Permeation— Controlled porosity of 35–45% with pore sizes from 10μm to 100μm ensures consistent gas flow distribution across the (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
processing stages Fixation of fragile materials during inspection and metrology Handling of non-wafer workpieces in advanced (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
provide a rigid guiding baseline across high-end automated infrastructure layout configurations: Semiconductor Fabrication Machinery: Wafer handling end-effectors, metrology stages, and automated track platforms requiring high repeatability. Flat Panel (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Fountyl Technologies Pte. Ltd.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
market collapse, says report China to blame for spot declines? Semicon West to move into one venue in 2005 Wafer metrology moving into era of convergence Auction set for 250 fab tools from PHS MEMS Novellus raises Q2 forecast amid chip-equipment demand Ethernet startup announces $15 million Series B
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
-DSL Asyst wins multiple orders from new TSMC fab Veeco metrology orders total $4.7 million SEZ sells first Spin-Processor 4200 Aetrium consolidates operations, plans layoffs Transmeta set to introduce Crusoe processor MEMC negotiates to buy majority of wafer venture in Korea Intel plans 47% increase
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
provided an editor 's selection of other significant stories of the week. Singapore tips sub-surface wafer metrology Researchers from Nanyang Technological University in Singapore are developing a metrology system that claims to detect "sub-surface " defects in raw or reclaimed silicon wafers. Rave tips
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
into SOC business, says Taiwanese executive IMS to provide tools for Advantest logic testers Samsung orders RDRAM testers from Schlumberger Motorola tips its RF IC strategy, revealing GaAs FET and SiGe amp Zygo metrology tool increases precision of wafer planarity measurement Intel invests
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Association (SIA). China's fab explosion raises question of chip glut China's chipmakers plan to ramp up seven new 200mm-wafer fabs next year and have another three fab shells waiting in the wings, leading analysts to ask if the expansion will add to global overcapacity or be sopped up by China's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (June 22) Heard on the Beat (June 22) Commentary & analysis of week's chip news UMC says fab closure report is 'speculation' United Microelectronics Corp is keeping quiet about rumors that it will temporarily shut down one of its 8-inch wafer fabrication facilities due to low
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Metrology control for an advanced 200 mm sub-micron wafer fab
This paper will discuss the initial set-up methodolog)’ during start-up and the control procedures for routine maintenance of metrology instruments in our advanced sub- micron wafer fab .
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Overlay metrology productivity and stability enhancements using an offline recipe database manager (RDM)
To summarize, a KLA-Tencor Recipe Database Manager (RDM) system was used in conjunction with multiple KLA-Tencor 5XXX XP Overlay Metrology Systems to significantly improve manufacturing productivity and recipe stability in Texas Instruments ' DMOS 5 wafer fab facility.
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Some surface and interface characterization and metrology requirements in the wafer processing industry
The Theta 300 is more of a lab instrument , but it can be used in a metrology mode, whereas the RVX 1000 and VeraFlex are intended as wafer fab dedicated metrology tools.
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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Fifth Edition > The Semiconductor Industry
Strategies to control the cost have included detailed analysis of equipment cost of ownership, new fab layouts (such as cluster tools), robotic automation, wafer isolation technology (WIT), computer integrated manufacturing (CIM), sophisticated statistical process control, advanced metrology instruments , just-in-time inventory …
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Helium ion microscopy and its application to nanotechnology and nanometrology
It is anticipated that one of the major applica- tions of the HeIM will be in imaging and metrology of semiconductor structures in the wafer fab . It is speculated that replacement of electron beam in- struments with helium ion instruments is possible .
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The potentials of helium ion microscopy for semiconductor process metrology
It is anticipated that one of the major applications of the HIM will be in imaging and metrology of semiconductor structures in the wafer fab . It is speculated that replacement of electron beam instruments with helium ion instruments is possible sometime in …
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Improvement of SRAM-based failure analysis using calibrated Iddq testing
done with direct instruments such as particle detectors. But as many as half of all contaminants can only be seen electrically, and there is significant pressure to reduce metrology costs in the wafer fab .
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Knights Technology Receives Major Volume Purchase Agreement From ST Microelectronics
YieldManager is a customized, instrument -independent software solution that enables fab engineers to collect, analyze and graphically display essential process, inspection, and test data to help identify the sources of semiconductor yield loss. The YieldManager system is the only independent software tool designed to interface with equipment from multiple suppliers to collect data from the entire process flow-design, wafer process, inspection, metrology , parametric, and electrical test.
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Focused ion beam in-situ cross sectioning and metrology in lithography
… tight tolerances on critical dimensions for sub O.25um structures, which requires considerable innovation in metrology technology. This instrument has gone from a manual, low throughput machine to a fully automated, 20-30 wafer /hr, inline tool used in every modern Fab .