Wafer Polishing Slurry

Description: GRISH has corresponding polishing processes and consumables for compound semiconductors, including SiC(silicon carbide), AlN(aluminum nitride), GaN(gallium nitride), GaAs(gallium arsenide), InP(indium phosphide), etc.

• Grit Size: 200 to 500
• Type: Polishing
• Materials / Substrates Finished: Semiconductors / Electronics (Wafers)
• Form: Slurry

Description: GRISH CO(Cerium Oxide) AO(Aluminum Oxide) SC(Silicon Carbide) slurry series are mainly made of processed high-quality abrasives. They provide predominant finishing result on optical material, substrates wafer, optical fiber connectors, crystal compounds, ceramics and hard alloys etc.

• Compound / Abrasive Type: Aluminum Oxide, Cerium Oxide, Silicon Carbide
• Grading System: Micron Graded
• Materials / Substrates Finished: Ophthalmic / Optical Materials, Semiconductors / Electronics (Wafers)
• Type: Polishing

Description: GRISH CMP slurry is mainly based on colloids. The formula made through scientific proportioning can ensure the stability of pH value during the polishing process, thereby ensuring the stability of the polishing rate and saving time. CMP slurries are widely used in mechanical

• Materials / Substrates Finished: Ophthalmic / Optical Materials, Semiconductors / Electronics (Wafers)
• Features: Other
• Type: Polishing
• Form: Slurry

Description: additive to your polishing slurry formulations. Applications Polishing Abrasive: Electronics (Rigid Disk) Metals Composites TFT-LCD Glass Automotive Polishing

• Compound / Abrasive Type: Aluminum Oxide
• Type: Polishing
• Materials / Substrates Finished: Semiconductors / Electronics (Wafers)
• Form: Slurry

Description: Saint-Gobain Ceramic Materials' NanoSoft Alumina slurry is an aqueous slurry of transitional phase alumina particles. The soft alumina particles are a mixture of delta (δ) and theta (Θ) phase particles manufactured under tightly controlled environments to ensure product consistency

• Compound / Abrasive Type: Aluminum Oxide
• Grading System: Micron Graded
• Type: Polishing
• Materials / Substrates Finished: Semiconductors / Electronics (Wafers)

Description: GRISH Polishing Liquid has good flow and excellent penetration. In component processing, it acts as a lubricant, but it is not as greasy as a lubricant, and its stable performance makes the workpiece look new with ease.

• Materials / Substrates Finished: Ophthalmic / Optical Materials, Semiconductors / Electronics (Wafers)
• Type: Polishing
• Form: Slurry

Description: Polishing Compounds confine to chemo mechanical polishing action. These are alumina or silica based with controlled PH values to suit various applications. It contains uniformly suspended abrasive particles in slurry form and is soluble in water for dilution & used for

Description: As machining tasks become more critical in the pursuit of maximum efficiency, economy and the perfection of the finished component, so too does the need for best-in-class specialty fluids and abrasive suspensions. Precision Microchemicals Technical Center operates a fully equipped laboratory to

• Type: CMP / Wafer Planarization, Cleaning / Surface Preparation, Grinding, Lapping, Polishing
• Form: Slurry

Description: Standard grade micron synthetic diamond powder designed for resin bond systems. Designed for reliable and secure performance in polishing applications and lapping of glass, wafers, and polycrystalline diamond.

• Compound / Abrasive Type: Diamond
• Type: Lapping, Polishing

Description: 250 nanometers (0.150 to 0.250 microns). Applications Magnetic media filler: Video tapes, audio tapes, data storage devices Polishing abrasive Structures: Metal matrix composites, ceramic bodies

• Compound / Abrasive Type: Aluminum Oxide
• Grading System: Micron Graded
• Type: Polishing
• Form: Powder

Description: application, or a custom-engineered product can be made if required. Applications: Media Filler: Video and audio tapes, data storage devices, ink jet media Polishing abrasive Thermal management additive Wear resistance additive Metal matrix Structural ceramics

• Compound / Abrasive Type: Aluminum Oxide
• Grading System: Micron Graded
• Type: Polishing
• Form: Powder

Description: work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride, quartz, ceramics,

• Type: CMP / Wafer Planarization
• Compound / Abrasive Type: Ceramic, Silica
• Materials / Substrates Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers)
• Form: Liquid / Dispersion