Reliability, Maintainability and Risk: Practical Methods for Engineers, Seventh Edition

Appendix 3: Microelectronics Failure Rates

The following table gives rates per million hours showing the highest and lowest values likely to be quoted in data bases. The middle column is the geometric mean (Section 4.3). Each group of three columns is labelled for a junction temperature range in degrees Centigrade. The following multipliers apply:

Multiplier

QUALITY

Normal commercial procurement

2

Procured to some agreed specification and

1

Quality management system 100% screening and burn-in

0.4

ENVIRONMENT

Dormant (little stress)

0.1

Benign (e.g. air-conditioned)

0.5

Fixed ground (no adverse vibration, temperature cycling, etc.)

1

Mobile/portable

4

PACKAGING

Ceramic

1

Plastic

1 for quality factor 0.4

2 for quality factors 1 or 2

Note

FARADIP.THREE (see Chapter 4) is updated regularly and values will change slightly. These values are from around a year 2000 version.

Logic

<40

40 62

Bipolar SRAM 64k bits

0.03

0.06

0.13

0.05

0.08

0.13

Bipolar SRAM 256k bits

0.04

0.14

0.50

0.09

0.21

0.50

Bipolar PROM/ROM 256k bits

0.02

0.02

0.03

0.03

0.03

0.03

Bipolar PROM/ROM 16k bits

0.03

0.03

0.04

0.03

0.04

0.06

MOS SRAM 16k bits

0.02

0.02

0.03

0.02

0.03

0.05

MOS SRAM 4m bits

0.08

0.19

0.44

0.20

0.30

0.44

MOS DRAM 64k bits

0.02

0.02

0.02

0.02

0.02

0.03

MOS DRAM 16m bits

0.05

0.11

0.23

0.09

0.14

0.23

MOS EPROM 16k bits

0.03

0.05

0.07

0.04

0.05

0.07

MOS EPROM 8m bits

0.06

0.13

0.30

0.07

0.14

0.30

Logic

62 87

>87

Bipolar SRAM 64k bits

0.13

0.14

0.15

0.13

0.25

0.48

Bipolar SRAM 256k bits

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