Engineering Materials for Biomedical Applications

Engineering Materials for Biomedical Applications

Teoh Swee Hin

National University of Singapore, Singapore

Biomaterials Engineering and Processing Series-Vol. 1

World Scientific
NEW JERSEY LONDON SINGAPORE BEIJING SHANGHAI HONG KONG TAIPEI CHENNAI

Published by

World Scientific Publishing Co. Pte. Ltd.

5 Toh Tuck Link, Singapore 596224

USA office: 27 Warren Street, Suite 401-402, Hackensack, NJ 07601

UK office: 57 Shelton Street, Covent Garden, London WC2H 9HE

British Library Cataloguing-in-Publication Data

A catalogue record for this book is available from the British Library.

2004 by World Scientific Publishing Co. Pte. Ltd.

All rights reserved. This book, or parts thereof, may not be reproduced in any form or by any means, electronic or mechanical, including photocopying, recording or any information storage and retrieval system now known or to be invented, without written permission from the Publisher.

For photocopying of material in this volume, please pay a copying fee through the Copyright Clearance Center, Inc., 222 Rosewood Drive, Danvers, MA 01923, USA. In this case permission to photocopy is not required from the publisher.

ISBN: 9812560610

Acknowledgements

This book would not have come about without the dedication and active participation of all the authors who over time have become friends and collaborators. They are: Adrian, U.J.Yap, B.Ben-Nissan, D.J.Blackwood, T.Hanawa, Z.M.Huang, E.Khor, J.Li, Peter, V.S.Lee, G.Pezzotti, S.Ramakrishna, K.H.W.Seah, M.Sumita, and M.Wang. I thank them for their patience and for bearing with me.

To all my students in my Biomaterials Engineering and Advanced Biomaterials class, Mechanical Engineering Department, National University of...

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