Overview

Microelectromechanical systems (MEMS) devices add at least one special requirement to the package that is not usually required for non-mechanical devices. MEMS chips typically have moving parts, or these devices cause materials to move, and the package must be designed to accommodate these mechanical actions. Micro-optoelectromechanical systems (MOEMS) add a further requirement to mechanical activity; optical or photonic transmission is required to and from the chip. Photons must have access to the MOEMS device by means of a free path (free space) or by way of photon conduit such as an optical fiber. Most MEMS and MOEMS devices may also have specific requirements and limitations on the makeup of the atmospheric constituents within the package, especially moisture content. Although MOEMS devices might appear to present the greatest challenge to packaging, those devices that require access to actual materials have even greater needs and will require new concepts in microplumbing and in package routing of materials. This chapter will begin by examining the special challenges while suggesting strategies and concepts. Evaluation methods will be described and discussed where appropriate.