MEMS/MOEMS Packaging: Concepts, Designs, Materials, and Processes

3.9: NHP Beyond MEMS

3.9 NHP Beyond MEMS

MEMS packaging technology will become the model and prototype for nanotechnology needs. While addressing the special needs of MEMS, the packaging concepts, materials, and processes that emerge are extremely versatile compared to electronic packaging. MEMS is so versatile that packaging solutions are also versatile and applicable to other areas. MEMS packaging will therefore pave the way for nanoelectronics packaging, and other areas that will include nanomechanical devices. Nanoelectronics has already developed laboratory versions of transistors, triodes, new classes of lasers, and optoelectronic devices. While we may not know how they will be packaged, all will need electrical conductors and insulators. But hermeticity requirements may be lower than for some of the MEMS and MOEMS devices. NHP developed for some of the MEMS devices could turn out to be the ideal technology for nanoelectronics, since much will be based on organic devices not all that different from today's polymers. Chapter 6 will cover nanotechnology in more detail.

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