Development and preparation of Microvias for Low Cost, High Density Interconnects was facilitated by the efforts of a number of dedicated people at McGraw-Hill and North Market Street Graphics. We would like to thank them all, with special mention to Stephanie Landis of North Market Street Graphics and Thomas Kowalczyk and Jessica Hornick of McGraw-Hill for their unswerving support and advocacy. Our special thanks to Steve Chapman, executive editor of electronics and optical engineering, who made our dream of this book come true by effectively sponsoring the project and solving many problems that arose during the book s preparation. It has been a great pleasure and fruitful experience to work with them in transferring our messy manuscripts into a very attractive printed book.

The material in this book has clearly been derived from many sources, including individuals, companies, and organizations, and we have attempted to acknowledge, in the appropriate parts of the book, the assistance that we have been given. It would be quite impossible for us to express our thanks to everyone concerned (please read the names in the references at the end of each chapter of the book) for their contribution in producing this book, but we would like to extend due gratitude.

Also, we want to thank several professional societies and publishers for permitting us to reproduce some of their illustrations and information in this book: the American Society of Mechanical Engineers (ASME) (e.g., Proceedings of International Intersociety Electronic Packaging Conference and Journal of Electronic Packaging