1. "The Properties of Tin," The Tin Research Institute, Greenford, England, 1962.

2. J. Spergel, "The Transformation of Tinned Copper Wire," ASTM 65th Annu. Conv. 1962.

3. "Grey Tin Transformation in Soldered Joints Stored at Low Temperatures," ASTM Spec. Tech. Publ. 189, 1956.

4. S. C. Britten, "Spontaneous Growth of Whiskers on Tin Coatings: 20 Years of Observation," Monograph 487, Tin Research Institute, Greenford, England, April 1974.

5. H. H. Manko, "The Effect of Some Metallic Additions on the Tin-Lead System," thesis, New York University, 1959.

6. H. H. Manko, "The Effect of Some Metallic Contaminations on the Tin-Lead Solder System," IBM TTR00, 717, Poughkeepsie, NY, May 2, 1960.

7. A. Bornemann, "Tin Disease in Solder Type Alloys," ASTM Spec. Tech. Publ. 189, 1956.

8. H. H. Manko, Solders and Soldering, 1st ed., McGraw-Hill, New York, 1964, pp. 266 272.

9. H. H. Manko, Soldering Handbook for Circuits and Surface Mounting, Kluwer Academic Publishing, Boston, 1995, 525 pages.

10. W. R. Lewis, "Notes on Soldering," The Tin Research Institute, Greenford, England, 1961. ^[33]

12. H. H. Manko, "Intermetallics and Their Effect on Soldering," Proc. Tech. Prog. NEPCON East, 1988, pp. 265 272.

13. "Development of Highly Reliable Solder Joints for Printed Circuit Boards," Westing-house Def. Space Cent., Aerosp. Div., Baltimore, Final Rep. (Nat. Tech. Inf. Serv.), NTIS-N69-25697, August 1969; B. D. Dunn, "The Properties of Near-Eutectic Tin/ Lead Solder Alloys Tested between Plus 70 and Minus 60 C and the Use of Such Alloys in...