9.1 Introduction

In previous chapters, we have treated the subject of soldering in a general way, without going into the details of soldering any specific combination. In this chapter, we deal with the most common surfaces soldered that are unique for one reason or another, and describe in general terms the problems they cause and how to get around these problems with the proper selection of fluxes, solders, and techniques. We shall try to give an example in each case. The chapter is intended only as a guide and not as a substitute for the proper selection and design of the soldered assembly, outlined in detail in other chapters. Most of the theory, which has been covered before, will be touched on only lightly.

Printed circuit soldering and surface mounting are typical examples of the use of solder technology in production. They have become the core for a separate book ^[1] and will not be covered here. Hybrid soldering, on the other hand, is covered.

The application of special soldering techniques includes high- and low-temperature soldering, soldering to thin films, using expanding solders, and low thermal electromotive forces. Material covered in this chapter involves some repetition of material covered in other sections of the book because of the necessity of presenting material from a different viewpoint.

Soldering to Specific Surfaces