TABLE OF CONTENTS The documented processes shall assure the component is compatible with manufacturing processes as supplied (without any quality or reliability impact) throughout:
Component shipping, handling, and storage
Equipment manufacturing, assembly, shipping, handling, storage, test, repair and rework by equipment manufacturer.
The documented processes shall identify the key manufacturing, assembly, shipping, handling, storage, test, repair and rework processes by equipment manufacturer; and the Plan shall describe how their impact on components is identified, documented and controlled.
Note: Of particular concern is the method of storing plastic-encapsulated microcircuits to assure that moisture ingress does not cause popcorning during assembly. Characterization by component manufacturers of component moisture sensitivity rating in accordance with JESD22-A112 and J-STD-020A will assist in controlling this feature.
Note: Also of concern is protection of components from electrostatic discharge (ESD) damage. Use of the relevant sections of EN 100015, MIL-HDBK-263, IEC 61340-5-1, and IEC 61340-5-2 will aid in controlling ESD damage.
