Technical Articles
Kayaku Advanced Materials, Inc. has published these technical articles:
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines the use of UniLOR® N 5.0 for lift-off processes requiring a large undercut profile. It describes a bilayer resist approach for creating controlled...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines lift-off resist processing for metal deposition using high-temperature sputtering conditions. It addresses the challenges associated with maintaining resist...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note provides processing guidance for SU-8 3002, a negative-tone epoxy photoresist formulation used in microfabrication. It outlines key process parameters that influence...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines the use of dry-film photoresist technology for fabricating microfluidic structures. It discusses key processing considerations associated with SU-8 3000CF,...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines the use of SU-8 3000CF dry-film photoresist in applications requiring resistance to corrosive processing environments. It discusses the material and process...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines the processing of SU-8 TF 6000 thin-film photoresist on gold (Au) substrates. It focuses on process considerations associated with coating and patterning the...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines a lithographic process for fabricating T-gate structures used in high-frequency high-electron-mobility transistors (HEMTs). The process focuses on achieving...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines the use of a thick negative-tone temporary photoresist in electroplating processes for advanced semiconductor packaging. It focuses on process considerations...
(Industrial Coatings and Sealants)
From this Article:
This technical application note evaluates the compatibility of a positive-tone temporary photoresist with electroplating processes used in microfabrication. It examines resist performance during...
(Electrical, Optical, and Specialty Materials)
From this Article:
Advanced semiconductor packaging requires dielectric materials that balance electrical performance, mechanical reliability, thermal stability, and manufacturability. This article examines the...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines bi-layer lift-off processing for the fabrication of thick metal and oxide features. The process uses a two-layer resist structure to create a controlled...
(Electrical, Optical, and Specialty Materials)
From this Article:
This technical application note examines the thermal stability of a lift-off photoresist for metallization processes involving elevated temperatures. It evaluates resist behavior under...