Wireless InSite's engineered electromagnetic surface (EES) capability models passive metasurfaces that are designed to optimize wireless communication coverage by manipulating how signals propagate through an environment. EES are a class of passive metasurfaces that enhance wireless coverage at microwave and millimeter-wave frequencies via printed conductive patterns on substrates such as plastic or glass. When placed on a wall, window, or other structure, the scattering properties of these printed patterns redirect RF wave propagation in specific directions to augment wireless connectivity. This short video clip demonstrates Wireless InSite's EES capability and compares coverage improvement with diffuser and grating EES placements on a glass window or a wall.
WaveFarer Radar Simulation Software supports indoor sensor applications by simulating the reflection, diffraction, and transmission of propagating waves as they interact with walls, windows, furniture, and other materials. Using WaveFarer's included scripts, users can leverage Remcom''s XGtd path viewer to generate ray path animations. This clip demonstrates the capability by showing backscatter in an indoor scenario, visualizing how waves diffract through doorways and penetrate walls.
WaveFarer's diffuse scattering model increases the fidelity of the simulation by revealing how paths interact with rough surfaces, leading to additional clutter in radar returns.
A Targeted Solution That Simulates Raw Radar Returns for Drive Test Scenarios
WaveFarer is a unique software tool created specifically for automotive radar sensor design and placement. It enables Tier 1 suppliers to virtually test and refine results earlier in the design process, improving installed sensor performance.
Improve the design process and reduce development costs:
- High-fidelity radar simulator for drive scenario modeling at frequencies up to and beyond 79 GHz
- Near-field propagation and scattering methods compute raw radar returns from target objects while considering multipath interactions from ground bounce
- Fast and accurate analysis of repeatable drive test scenarios
With the expansion of 5G NR for mobile connectivity, industrial and manufacturing applications such as robotics, IOT, and smart factories with automation come into play. Laying out a 5G network in complex and cluttered environments with several conductive surfaces can be challenging. Wireless InSite predicts the coverage and interference and accounts for the multipath in complex environments such as heavy-industrial factories, warehouses, server farms and more.
Penn State University is located in State College, Pennsylvania, a suburban city that contains several LTE sites. This simulation shows the coverage prediction from its existing LTE sites in the downtown area.
A passenger train located in a station is connected to an access point (AP) mounted on the roof of the station. RF propagation paths computed using the shooting-and-bouncin
Many engineers want to know how to calculate the throughput for a new antenna design, especially for 5G applications. In this short video, Remcom's product marketing manager, Jeff Barney, describes the process of simulating the antenna element in XFdtd, and modeling the channel propagation and calculating the throughput modulation in Wireless InSite, including a specific example of measuring the throughput of Wi-Fi in a house.
Learn how to use XF's features for ESD testing as we walk through the process of analyzing a multi-layer PCB and identifying potential locations of dielectric breakdown.
Using a simplified ESD probe to excite the PCB with ESD waveforms, we demonstrate the following features:
- User-defined ESD waveforms
- Dielectric strength material property
- Dielectric breakdown near field sensor
- Max Component Voltages and Currents dialog
- Dielectric breakdown ratio
This video gives a demonstration of Full Wave Antenna Matching Circuit Optimization using XFdtd's Circuit Element Optimizer (CEO). The antenna matching circuit design flow is discussed, including CEO's analysis of a given PCB layout. Predicted S-parameters and optimal component value results for two different frequency bands are also shown.