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Driver Type:

Number of Output Channels:

Output Configuration:

Output Voltage:

Peak Output Current:

Supply Voltage:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Rise Time:

Fall Time:

Propagation Delay:

Power Dissipation:

Switching Frequency:

Operating Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

IC Package Type:

Production Status:

Screening Level:

Packing Method:

Input Threshold:

Integrated Protection?

Dead Time Control?

Internal Regulator?

Help with Gate Drivers specifications:

General Specifications
   Driver Type       
   Your choices are...         
   High-side Gate Driver       High-side gate drivers are used to drive power MOSFETs or IGBTs that are connected to a positive supply and are not ground-referenced (floating). 
   Low-side Gate Driver       Low-side gate drivers are used to drive power MOSFETs or IGBTs that are connected to a negative supply. 
   Dual Gate Driver (Half-bridge)       The driver has both low-side and high-side gates. These drivers are also known as half-bridge gate drivers. 
   Three-phase       These drivers have three independent low-side and high-side referenced output channels. They are used in three-phase applications. 
   Other       Other unlisted, specialized or proprietary driver type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Number of Output Channels       
   Your choices are...         
   1       The device has only one output channel. 
   2       The device has two output channels. 
   4       The device has four output channels. 
   Other       Other unlisted number of channels. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Output Configuration       
   Your choices are...         
   Inverting       The output voltage is inverted. 
   Noninverting       The output voltage is not inverted. 
   Other       Other unlisted or specialized output configurations. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Performance
   Output Voltage       The nominal value of the output voltage. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Peak Output Current       The value of maximum output current that the device can support. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Supply Voltage       This voltage can be Vcc or Vdd. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Rise Time       The time that is takes for the output voltage to rise from 10% to 90% of the maximum. 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Fall Time       The time that is takes for the output voltage to decrease from 90% to 10% of the maximum. 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Propagation Delay       The time interval between the application of an input signal and the appearance of the corresponding output. 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Power Dissipation       The amount of power in the form of heat that the device dissipates. 
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Switching Frequency       The maximum switching frequency that can be sustained without exceeding the specifications. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Operating Temperature:       This is the full-required range of ambient operating temperature. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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Packaging Characteristics
   IC Package Type       
   Your choices are...         
   PBGA       Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. 
   TBGA       Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   UCSP       Ultra chip scale package (UCSP). 
   FLGA       Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.  
   LQFP       Low quad flat package (LQFP). 
   TQFP       Thin quad flat package (TQFP). 
   SOP       Small outline package (SOP). 
   SOIC       Small outline integrated circuit (SOIC). 
   TSOP Type I       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   TSOP Type II       Thin small outline package (TSOP), Type II is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   SSOP       Shrink small outline package (SSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   VSSOP       Very thin shrink small outline package (VSSOP). 
   TVSOP       Thin very small outline package (TVSOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   HSOF       Small outline flat-leaded package with heat sink (HSOF). 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. 
   SIP       Single in-line package (SIP). 
   SDIP       Shrink dual in-line package (SDIP). 
   SZIP       Shrink zigzag in-line package (SZIP). 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. 
   Other       Other unlisted, specialized or proprietary IC packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Production Status       
   Your choices are...         
   Full Production       Devices are currently being manufactured. 
   Discontinued       Devices are no longer available from the manufacturer, but may still be found in the supply chain. 
   In Development       Devices are in development and not yet available. 
   New Product       Devices are new products that have been announced by the manufacturer.  
   Other       Other unlisted or proprietary production status. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Screening Level       
   Your choices are...         
   Commercial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications. 
   Industrial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications. 
   Military       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications. 
   Other       Other unlisted, specialized or proprietary screening levels. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Packing Method       
   Your choices are...         
   Tape Reel       Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP).  Typically, carrier tape is made from a polystyrene (PS) or PS-laminate film with a uniform film thickness between 0.2 mm to 0.4 mm. Carrier tape design is defined largely by component length, width, and thickness. Cover tape is made from a polyethylene teraphthalate (PET) film or film laminate with an adhesive applied to the underside of the film. This adhesive is usually heat and pressure sensitive to ensure a positive, consistent seal between the carrier tape and the cover tape. The reels that contain the composite tape are typically made of polystyrene and have one, two, or three parts. Reel dimensions meet EIA-481-1, EIA-481-2, and EIA-481-3 standards. 
   Tray / Rail       Components are packed in trays (rails) that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks. 
   Bulk       Components are distributed as individual parts. 
   Tube       Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.  To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type. 
   Other       Other unlisted or proprietary packing method. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Features
   Input Threshold       
   Your choices are...         
   TTL       Transistor-transistor logic (TTL). 
   CMOS       Complementary metal oxide semiconductor (CMOS). 
   TTL/CMOS       Transistor-transistor logic (TTL) and complementary metal oxide semiconductor (CMOS). 
   PWM       Pulse width modulation (PWM) 
   TTL/PWM       Transistor-transistor logic (TTL) and pulse width modulation (PWM). 
   Other       Other unlisted input threshold. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Integrated Protection       Types: over-voltage protection (OVP), undervoltage lockout (UVLO), thermal shutdown (TSD), over-current protection (OCP), over-voltage protection current (OVPC), etc. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Dead Time Control       Dead time control allows the elimination of shoot-through currents, making the device more efficient. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Internal Regulator       An internal regulator controls and regulates the level of the output voltage. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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