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Electrical and Electronic Resins - LOCTITE ABLESTIK CE 3126 (Known as Hysol ECCOBOND CE3126) -- 8799539101697Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol ECCOBOND CE3126 ) Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical. This product is typically used for very fine pitch flip chip interconnections where electrical conductivity is desired in only one direction.
- Form: Specialty / Other
- Industry: Electronics
- Viscosity: 16300 cps
Educational and Training Software - General Requirements for Anisotropically Conductive Adhesives Films -- 3408
Description: This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigidShow More
Standards and Technical Documents - General Requirements for Anisotropically Conductive Adhesives Films -- 3408
Description: DESCRIPTION This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flipShow More
Supplier: 3M Electronics Design & Manufacturing
Description: Anisotropic Conductive Film (ACF) Adhesive 5363 is a heat-bondable, electrically condutive adhesive film. Used to bond a flexible printed circuit to another flexible printed circuit or a printed circuit board.
- Thickness: 40 µm
- Peel Strength / Adhesion: 3.92 lbs/in
- Features: Electrically Conductive
Supplier: Hot Disk AB
Description: or adhesive layers (Thin Film module), high-conducting sheets or slabs (Slab module), and anisotropic samples or layered structures (Anisotropic module) – important applications in e.g. the electronics, automotive, aerospace, nuclear and chemical industries. The test & analysis software
- Thermal Analyzer Type: Thermal Conductivity Analyzer
- Local Interface: Digital Front Panel
- Display Options: Digital Readout
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Thermal Press International, Inc.
What Variables are Necessary for Good Heatsealing?
utilizes precise temperature, pressure and motion control. This consistently and repeatedly produces high quality sealed bonds. A HSC consists of electrically conductive traces printed on a thin film of polyester (or other material). A thermosetting anisotropic or mono-isotropic adhesive, in which electrically conductive particles are dispersed, is used to bond the connector onto the substrate. Bonding Parameters. Applying a combination of temperature and pressure activates a thermosetting... (read more)
Browse Plastic Welding and Assembly Equipment Datasheets for Thermal Press International, Inc.
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Achieving Interconnection with Pulse-Heated Bonding (.pdf)
The process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils is referred to as heat sealing. The essential characteristics of this process are heating and cooling of the adhesive under pressure. Anisotropic conductive
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Computational Contact Mechanics
Another achievement of the developed theory is the possibility to construct various constitutive relations for contact pairs shown as the generalization of Coulomb friction into a coupled anisotropic adhesion and friction law for surface-to-surface and curve-to-curve contact pairs.
Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications
The self-aligning anisotropic adhesive is created using the influence of magnetic fields and demonstrated as suit- able for RF and microwave application.
Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications
Vrana, M., De Baets, J., Van Calster, A., Wojclechowski, D., Ostmann, A. and Reichl, H. (1996), “An anisotropic adhesive flip-chip technology for LCD drivers”, SID International Symposium.
Engineering of Micro‐ and Nanostructured Surfaces with Anisotropic Geometries and Properties
The ability to form inclined NWs is particularly advantageous for fabrication of smart materials, including anisotropic adhesives and wetting surfaces.
Electrical Conductive Adhesives with Nanotechnologies
Sancaktar et al. investigated the effects of the type of magnetic and con- ductive nickel fillers, resin viscosity, and the magnitude of the aligning magnetic field on the electrical properties of the resulting anisotropic ad- hesive joints .
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
The anisotropic film not only makes the electrical contact but also acts as an underfill; (c) anisotropic adhesive conductive particle detail.
Handbook of Adhesion Technology
It is possible to take advantage of this aspect to make a kind of anisotropic adhesive .
Materials for Advanced Packaging
An anisotropic adhesive is an adhesive that has small conductive particles embedded in its nonconducting organic matrix.
Area Array Packaging Handbook: Manufacturing and Assembly > ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE-MOUNT AND FLIP CHIP PROCESSES: AN ALTERNATIVE TO SOLD...
Polymers and Anisotropic Adhesives .
Anisotropic dry adhesive via cap defects
Anisotropic adhesives have been fabricated and tested and can demonstrate normal adhesion force up to ∼250 kPa with a shear displacement of 15 μm away from the defect and as small as ∼5 kPa when sheared the same amount towards the defect.
Recent advances in the fabrication and adhesion testing of biomimetic dry adhesives
1) adhesion through van der Waals interactions; (2) anisotropic adhesion ; (3) a high pull-off to preload ratio; (4) low detachment force when required; (5) self-cleaning; (6) anti-self-matting/self-adhesion; (7) a low to no adhesion state in the absence …
Properties validation of an anisotropic dry adhesion designed for legged climbing robots
Different attempts have been made to replicate the anisotropic adhesive properties in synthetic dry adhesion manufacturing .