Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: ASML Optics
Description: The TWINSCAN XT:1000H 248-nm Step-and-Scan system is a new dual-stage KrF lithography tool with the highest NA and productivity in the industry, designed for 200-mm and 300-mm wafer production. Combining the imaging power of the variable 0.93-NA Carl Zeiss Starlith 4X reduction lens with
-
Supplier: Ushio America, Inc.
Description: . Large depth of field This equipment also accommodates thick photoresist films and deformed tapes. Auto zoom function This equipment is able to handle tape expansion and contraction and achieves a high level of overlay accuracy. APPLICATIONS COF T-BGA FPC Touch panels Two-metal COF TAB and
-
Supplier: SPIE
Description: As the leading global lithography event, the technical program will focus on works in optical lithography, metrology, and EUV. Leaders come to solve challenges in lithography, patterning technologies, and unique materials, while sharing the latest advancements in the
- Frequency: Annually
- Industry: Electronics and Semiconductor, Metals and Metal Fabrication
- Type: Conference, Exhibition
-
-
Supplier: SPIE - Education
Description: and to trouble shoot fabrication problems. This course will also introduce new materials (such as high-K/metal gate or HKMG, III-V materials), new device and interconnect structures (such as FinFET/ Trigate, nanowires, Cu/air-gap interconnects) and new integrations (such as 3D IC,
- Modality: On-site / In Plant
- Technology / Subject: Photonics / Optics, Specialty / Other
- Type: Course
-
Supplier: Accuris
Description: GRAPHIC TECHNOLOGY - PROCESS CONTROL FOR THE PRODUCTION OF HALF-TONE COLOUR SEPARATIONS, PROOF AND PRODUCTION PRINTS - PART 9: METAL DECORATION PRINTING PROCESSES USING OFFSET LITHOGRAPHY
-
Supplier: Accuris
Description: GRAPHIC TECHNOLOGY - PROCESS CONTROL FOR THE PRODUCTION OF HALF-TONE COLOUR SEPARATIONS, PROOF AND PRODUCTION PRINTS PART 9: METAL DECORATION PRINTING PROCESSES USING OFFSET LITHOGRAPHY
-
Supplier: Technetics Group
Description: The HELICOFLEX® seal is a high performance, flexible metal seal that has exceptional compression and elastic recovery properties. This seal is composed of a close wound helical spring surrounded by one or more metal jackets. The spring is designed to have a specific compression
- Application / Industry: Chemical & Processing, Piping and Valves, Oil & Gas, Nuclear, Semiconductor, Specialized
- Cryogenic Application: Yes
- Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Silver, Titanium, Specialized or Other
- Material Features: Plated / Coated
-
Supplier: Lasersintering.com
Description: LaserSintering.com has provided customers with rapid prototyping & manufacturing services and solutions for over five years, and is the world's first site for instant online quoting for plastics and metals. With our state-of-the-art technology and equipment, we provide you with instant
- CAD & Related Services: 3D Printing, Bills of Material (BOM), Finite Element Analysis (FEA), Part Design, Solid Modeling, Stereolithography
- File Types: IGES, SolidWorks
- Hardcopy Services: Lithography, Reproductions / Copies
- Industry Served: Aerospace, Agricultural, Automotive, Biotechnology, Building and Construction, Chemical Processing, Computer, Consumer, Education, Electronics, Energy, Environment, Food and Beverage, General Industrial, Government, Marine, Medical, Metals and Mining, Military, Pharmaceutical, Rail,
-
Supplier: Technetics Group
Description: Increase the overall sealing performance for your installations with TEXEAL®, the new patented texturing process, applied?to HELICOFLEX®, already the?resilient metal?seal standard for high-performance sealing. HELICOFLEX® TEXEAL® can help
- Application / Industry: Nuclear, Specialized
- Material: Nickel / Nickel-Based Alloy
- Pressure: 52576 to 117800 psi
- Seal Type: O-Ring
-
Supplier: Richardson RFPD
Description: The CHP6013 is a L-band monolithic 6-bit phase shifter. The circuit is manufactured with a standard 0.7µm MESFET process : via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in surface mount ceramic-metal package.
- Frequency Range: 1200 to 1400 MHz
- Insertion Loss: 8.5 dB
- Package Type: Surface Mount Technology (SMT), Other
-
Supplier: Richardson RFPD
Description: The CHX2193-FAA is a 6.25-8.25GHz frequency doubler designed for a wide range of applications, from military to commercial communication systems. It is proposed in leadless surface mount hermetic metal ceramic 6x6mm² package. The circuit is manufactured with a pHEMT process
- Input Frequency Range: 6250 to 8250 MHz
- Input Power: 14 dBm
- Multiplying Factor: 2X
- Package Type: Other
-
Supplier: Richardson RFPD
Description: Mimix Broadband's three stage 17.0-26.0 GHz GaAs MMIC power amplifier has a small signal gain of 19.0 dB with a +23.0 dBm saturated output power. This MMIC uses Mimix Broadband's GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and
- Frequency Range: 17000 to 26000 MHz
- Maximum Gain: 19 dB
- Output Power( P1dB): 23 dBm
- Package Type: Other
-
Supplier: Richardson RFPD
Description: M/A-COM Tech’s three stage 35.0-45.0 GHz GaAs MMIC buffer amplifier has a small signal gain of 23.0 dB with a noise figure of 2.7 dB across the band. This MMIC uses M/A-COM Tech’s GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high
- Amplifier Type: Buffer Amplifier
- Frequency Range: 35000 to 45000 MHz
- Maximum Gain: 23 dB
- Noise Figure: 2.7 dB
-
Supplier: ASTM International
Description: immersion procedures are covered in Test Methods D1308, D1647, and D2248. 1.3 This test method is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset
-
Supplier: ASML Optics
Description: upon a heritage of extreme precision optical systems manufacturing, including some of the world's challenging lithography and metrology systems, and both space-based and terrestrial optical systems. With more than 80 years of experience, ASML Optics is able to bring to its customers a history
- Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Europe Only, East Asia / Pacific Only
- Substrate Materials: Glass, Metal
- Wavelength Range: UV, Visible, IR
-
Supplier: PI (Physik Instrumente) L.P.
Description: highly stiff design with zero wear. Closed-loop control with highly temperature stable metal foil strain gauges allows fast and linear motion. The unit is driven with Mars-rover tested high performance PICMA® piezo actuators guarded by all-ceramic insulation for longer lifetime
- Adjustment Type: Kinematic
- Diameter, Square Side, Rectangular Length, or Elliptical Major Axis: 25 mm
- Mount Type: Mirror Mount
- Mounted Object Shape: Circular
-
Supplier: ASTM International
Description: procedures are covered in Test Methods D1308, D1647, and D2248. 1.3 This practice is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset lithography
-
Supplier: ASTM International
Description: procedures are covered in Test Methods D1308, D1647, and D2248. 1.3 This practice is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset lithography,
-
Supplier: ASTM International
Description: immersion procedures are covered in Test Methods D 1308, D 1647, and D 2248. 1.3 This test method is applicable to prints on any flat substrate including paper, paperboard, metallic foil, metal plate, and plastic films, and produced by any printing process including letterpress, offset
-
Supplier: Laser 2000 GmbH
Description: , metal, or plastic Laser ablation / Pulsed laser deposition (ICP-MS) Dermatology, e. g. treatment of psoriasis and vitiligo with XeCl-lasers at 308 nm Immersion Lithography Writing masks Direct wafer processing
- Lasing Medium: ArF, KrF
- Pulse Energy: 6 to 10 mJ
- Pulse Length: 5 to 10 ns
- Repetition Rate: 200 to 1000 Hz
-
Supplier: Edgetech Instruments Inc.
Description: plus an RS-232 serial interface. The RS-232 offers reporting functions only. Each probe is configured with a smart sensor tip. The sensor tip is protected by a sintered metal filter cartridge. Both the filter and the sensor tip are replaceable. The probe may be directly inserted into process
- Digital Outputs: Serial Interface
- Display: Digital Readouts
- Electrical Outputs: Analog Voltage
- Operating Temperature: -40 to 257 F
Find Suppliers by Category Top
Featured Products Top
-
& solar plants Semiconductor: chamber, exhaust and other applications in PVD/CVD/etch and lithography processes Valves: body/bonnet sealing, seat sealing HELICOFLEX® TEXEAL® TEXTURISED METAL SEAL Increase the (read more)
Browse Metal Ring Seals Datasheets for Technetics Group -
How does putting a seal in a non-standard groove impact sealing performance? We break it all down in this informative video. Learn more about the HELICOFLEX® Resilient Metal (read more)
Browse Metal Ring Seals Datasheets for Technetics Group -
testing and isolation chambers Engine air intake and exhaust testing Modified atmosphere packaging Semiconductor manufacturing furnace and lithography Medical packaging Dryer efficiency Biologics and cell culture Fluidized beds Food storage and packaging Air make-up for clean rooms and data centers Checking polymer and metal oxide probes (read more)
Browse Humidity Transmitters Datasheets for Edgetech Instruments Inc. -
systems Critical purged atmospheres Glove box environmental chambers Pharmaceutical testing and isolation chambers Engine air intake and exhaust testing Modified atmosphere packaging Semiconductor manufacturing furnace and lithography (read more)
Browse Humidity Transmitters Datasheets for Edgetech Instruments Inc. -
Tip is protected by a sintered metal filter cartridge. Both the filter and the sensor tip are replaceable. The probe may be directly inserted into process measurement points or may be coupled with a variety of application-oriented sampling accessories for very flexible installation opportunities (read more)
Browse Humidity Transmitters Datasheets for Edgetech Instruments Inc.
Conduct Research Top
-
Canmaker Achieves Cost-Effective Compliance
JL Clark, headquartered in Rockford, Illinois, is no ordinary packager. The company, celebrating its 100 year anniversary in 2004, is recognized around the world for its award winning metal lithography and exact graphic reproduction.
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
immersion plans The major lithography vendors will decide by year-end whether to commit to building immersion 193-nm scanners, representatives of ASML, Canon, and Nikon said here at the second International Sematech Immersion Lithography Workshop. Amkor's outlook improves amid growing demand
More Information Top
-
Nanofabrication
Triple patterning in 10 nm node metal lithography .
-
Carbon nanotube processing and chemistry for electronic interconnect applications
Furthermore, the same masks can be used for both CNT film lithography and metal lithography , further reducing cost.
-
Introduction to Microfabrication 2nd Edition
Second metal lithography and .
-
Multiple Layer Techniques In Optical Lithography: Applications To Fine Line Mos Production
Anti Reflective Coating (ARC, Brewer Science, Inc.) was incorporated into the metal lithography process for a 1.2 micron gate CMOS prototype production line.
-
Proximity effect correction on the multilevel interconnect metal for high-energy electron-beam lithography
The results demonstrate that the correction method has a potential for the 220-nm multi-level interconnect metal lithography .
-
Development of terahertz quantum-cascade lasers
After the grating- metal lithography , ridges were defined by reactive-ion etching in a BCl 3 :N 2 plasma with PECVD silicon-nitride used as an etch-mask.
-
Alkali metal ion monitoring and reduction in dielectric oxides
(directional) plasmas that result in metal lithography with vertical sidewalls.
-
Productivity enhancement by replacing photoresist etchback by chemical-mechanical polishing for interlayer dielectric planarization
planarization, which enhances the process window for contact and metal lithography .
-
Integration of a W-plug in an Al-based metallization scheme for 0.25-&mgr;m IC technology
Metal lithography , etch and in-situ resist strip 4.
-
Novel Approach of Semiconductor Manufacturing Process on Copper Dual Damascene Processes Integration
A dual damascene process is challenge on via and metal lithography and trench process espe- cially for physical and electrical device.