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Supplier: Georgia-Pacific Chemicals LLC
Description: Adhesive resins for the manufacture of phenolic particleboard, medium density fiberboard and hardboard. These products can aid in complying with: California Air Resource Board (CARB) Airborne Toxic Control Measure (ATCM) for Composite Panels Phase 2 emission standards and defined
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Celanese Corporation
Description: uses of formaldehyde are to produce amino resins (urea and melamine) and phenolic resins (resoles and novolacs) for wood-bonding applications. Other uses for these resins include adhesives for laminates, molding compounds, textile treatments, coatings resins, foundry resins, and
- Form: Liquid / Solution
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Supplier: Georgia-Pacific Corporation
Description: maintenance and marine paint. Phenolic resins are also used as curing agents or hardeners for epoxy resins in applications such as molding materials, laminates, coatings and adhesives. The phenolic novolac resins used are non-heat reactive materials by themselves, but have
- Aldehydes: All Aldehydes, Formaldehyde
- Type: Base
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Supplier: Georgia-Pacific Corporation
Description: Solutions of formaldehyde are used in the manufacture of synthetic resins due to their high reactivity with phenol, urea, melamine and other similar compounds. GP Chemicals produces formaldehyde (HCHO) solutions at concentrations ranging from 1% to 52%, in both uninhibited and
- Aldehydes: All Aldehydes, Formaldehyde
- Type: Base
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Supplier: Georgia-Pacific Corporation
Description: manufacturer’s process and requirements, LEAF C2 adhesives can be a urea-formaldehyde or melamine-urea-formal dehyde formulation. LEAF C2 resins have been used in a variety of manufacturing processes. They can also be used in combination with specialized scavenger and catalyst systems
- Aldehydes: All Aldehydes, Formaldehyde
- Type: Base
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Supplier: Georgia-Pacific Chemicals LLC
Description: Powder phenol-formaldehyde adhesives specifically designed for the manufacturing of Oriented Strand Board (OSB). The product line includes WOODWELD® 145C30 resin, which has been successfully used as a fast-curing surface resin and intermediate-cure-sp eed core resin. It is not
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Georgia-Pacific Chemicals LLC
Description: Liquid phenol-formaldehyde adhesives specifically designed for the manufacturing of Oriented Strand Board (OSB) which include RESI-STRAN® 320C02 resin. GP Chemicals specializes in custom-formulating adhesives for your specific mill needs, conditions and certifications.
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Georgia-Pacific Chemicals LLC
Description: A variety of scavenger, buffering and catalyst technologies are employed with liquid urea-formaldehyde resins for composite panel production. Some of these products can aid in complying with: California Air Resource Board (CARB) Airborne Toxic Control Measure (ATCM) for Composite
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Georgia-Pacific Corporation
Description: . Plywood Adhesives - GP Chemicals manufactures both neat resins and the RESI-MIX® line of ready-to-use mixed adhesives. Neat GP® liquid phenol-formaldehyde (PF) resins are available for mills that prefer in-plant mixing of their own adhesive system. RESI-MIX®
- Chemical / Polymer System Type: Phenolics / Formaldehyde Resin
- Industry: Building / Construction
- Substrate / Material Compatibility: Wood / Wood Product
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Supplier: Esprix Technologies
Description: (+). Applications Flatting agent. Anti-blocking agent. Light diffusion agent. Slipping agent. Coating agent. Modifier for plastics, rubbers, adhesives, pressure sensitive paper, paints, ink. Additive for toner to control electrification properties.
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Description: 3M™ Scotch-Weld™ Structural Adhesive Primer EC-2174 is a primer for Scotch- Weld film adhesives. It is especially suggested for use with 3M™ Scotch-Weld™ Structural Adhesive Film AF 31.
- Chemistry: Resin Base / Polymer Binder, Formaldehyde Resins (Phenolic, Furan, Melamine)
- Industry: OEM / Industrial, Other
- Type: Coating, Specialty / Other
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Description: 3M™ Scotch-Weld™ Structural Adhesive Primer EC-1660 is a primer for 3M™ Scotch-Weld™ film adhesives for applications where it is desired to obtain improved adhesion or improved resistance to environmental exposure. Scotch-Weld EC-1660 primer can be used with 3M™ Scotch-Weld™ Structrual
- Chemistry: Resin Base / Polymer Binder, Formaldehyde Resins (Phenolic, Furan, Melamine)
- Industry: OEM / Industrial, Other
- Type: Coating, Specialty / Other
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Description: 3M™ Scotch-Weld™ Structural Adhesive Primer EC-1290 is a sprayable primer suggested for use with 3M™ Scotch-Weld™ Structural Adhesive Films AF-6, AF-10 and AF-13. Simplify production scheduling by protecting the cleaned surfaces until the bonding operations can be completed. Improved
- Chemistry: Formaldehyde Resins (Phenolic, Furan, Melamine), Resin Base / Polymer Binder
- Form: Liquid
- Industry: Other, OEM / Industrial
- Substrate / Surface: Aluminum, Metal
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Description: COR-COTE E.N. 7000 is a 100% solids, two component, high build, epoxy novolac coating designed to protect substrates against severe chemical attack. Low viscosity and excellent adhesion characteristics ensure a tight bond to properly prepared concrete and steel surfaces. High build Chemical
- Chemical / Polymer System Type: Epoxy (EP), Phenolics / Formaldehyde Resins
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Industry: OEM / Industrial, Other
- Substrate / Material Compatibility: Concrete / Masonry, Metal
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Supplier: ASTM International
Description: measure certain VOC from exterior plywood meeting Voluntary Product Standard PS 1-09 and structural composite lumber products such as laminated veneer lumber (LVL) meeting Specification D5456. Both of these product types are typically manufactured using phenol-formaldehyde resin based
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Supplier: ASTM International
Description: measure certain VOC from exterior plywood meeting Voluntary Product Standard PS 1-09 and structural composite lumber products such as laminated veneer lumber (LVL) meeting Specification D5456. Both of these product types are typically manufactured using phenol-formaldehyde resin based
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Phenolic Resins: A Century of Progress
Schmidt R, Frazier C (1998) 13 C CP/MAS NMR as a direct probe of the wood- phenol formaldehyde adhesive bondline.
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http://etd.auburn.edu/bitstream/handle/10415/2694/thesis%20auburn.pdf?sequence=2
Characterization of Phenol Formaldehyde Adhesive and Adhesive-Wood Particle Composites Reinforced with Microcrystalline Cellulose .
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Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood
Table 1 Curing peak temperature, peak time, peak height, as well as heat of curing reaction (DH) of OSB core phenol formaldehyde adhesive (PF3110), and in the presence of copper preservative treated, untreated SYP at different resin-to-wood ratios .
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http://www.iosrjournals.org/iosr-jestft/papers/vol8-issue1/Version-3/B08131015.pdf
In this research, tannin functions as the extender for Phenol Formaldehyde adhesive in the manufacture of particleboard from oil palm midrib.
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Rheological properties of adhesives based on modified phenol-formaldehyde oligomers
Introduction of furan oligomer (4–6% of the matrix) into phenol formaldehyde adhesives is known to improve the adhesive properties of the compositions and operation characteristics of the corresponding wood materials [1, 2].
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Study of thermal durability properties of tannin–lignosulfonate adhesives
The structure of lignin, with the presence of aliphatic hydroxyl groups and phenolic groups, has made it a good partial replacement of phenol for phenol formal- dehyde adhesives [3–9].
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State of research and trends in development of wood adhesives
Study on vis- cosity of lignin phenol formaldehyde adhesive .
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Shear strength development of the phenol–formaldehyde adhesive bond during cure
2007) Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive .
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Studies on thermal characterization of lignin
In the present work, lignin substituted phenol formaldehyde adhesives were characterized for their thermal stability.
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Characterisation of the curing of liquefied wood by rheometry, DEA and DSC
2007) Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive .