Circuit World
30/4 [2004] 9
Emerald Group Publishing Limited
[ISSN 0305-6120]

Sylvia Ehrler studied Metallurgy and Materials Engineering at the Technical University/Mining Academy in Freiberg/Saxony. She received her PhD in the field of III-V-semiconductors. Ms Ehrler worked for two years as manager of the III-V-synthesis-group for Freiberger Compound Materials GmbH. She then moved to Hewlett-Packard GmbH in Boeblingen where she worked as an R&D-engineer for the Printed Circuit Shop. In 1998 the HP site was acquired by Flextronics as its Multek Europe campus where Ms Ehrler continues as R&D Engineer. Her main working fields are finish metallization and PCB base materials.

Dr Martin Goosey is a Technology Fellow with Rohm and Haas Electronic Materials in Coventry, UK. Martin has over 25 years experience in the electronics industry and has spent much of that time working on new electronic materials and advanced interconnect research and development. Martin has worked at Plessey s Caswell research laboratories and also at the Morton Chemical Research Centre in Woodstock, Illinois. He is a Fellow of the Royal Society of Chemistry, a Fellow of the Institute of Circuit Technology and a member of key organisations representing the Printed Circuit Board Industry.

Fang Kehong is an engineer, and obtained a Master of Science degree in Chemistry from the Normal University of South China in 1993. Since graduating he has worked for the Guangdong Shengyi Sci. Tech Company Ltd. Since joining the company he has worked on production process management and in research on new copper clad laminates.