Polyclad Introduces 370HR Lead-Free Assembly Compatible, CAF Resistant Laminate and Prepreg Systems

Keywords Lead-free, Assembly, Polyclad

Polyclad Laminates, Inc., introduced Polyclad 370HR CAF resistant, lead-free assembly compatible laminate and prepreg systems at the IPC Printed Circuits Expo/APEX 2004 exhibition, back in February in Anaheim, California.

Ideal for high-density designs requiring multiple soldering steps, 370HR materials contain a unique resin technology that has been production-proven to offer more cycles to failure than any other FR-4 material on the market today.

Currently used in the manufacture of computer servers, telecommunications devices and other electronics, Polyclad 370HR systems offer exceptional IST thermal performance and reliability. Possessing 180 C glass transition temperatures ( T _g), 370HR materials provide low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability.

UL listed as PCL-FR-370HR laminate and PCL-FRP-370HR prepreg, Polyclad 370HR materials are compatible with all commonly used FR-4 fabrication process techniques. 370HR s mechanical, chemical and moisture resistance easily meet or exceed the performance of competitive FR-4 materials. The system is laser fluorescing and UV blocking for maximum compatibility with automated optical inspection systems (AOI), optical positioning systems and photoimageable solder mask imaging.

For further details, visit the Web site: www.cooksonelectronics.com.

Park Electrochemical Introduces N4000-12 Enhanced Epoxy Materials System

Keyword Epoxy resins

Park Electrochemical Corporation has introduced their new N4000-12 enhanced epoxy dielectric substrate materials. This new product line is now available globally with manufacturing at Park s Neltec, Inc. business unit in Tempe, Arizona and at its Nelco Products Pte, Ltd business unit...