TABLE OF CONTENTS Cliff Roseen
Rogers Corporation, Rogers, Connecticut, USA
Circuit World
30/4 [2004] 40 43
Emerald Group Publishing Limited
[ISSN 0305-6120]
[DOI: 10.1108/03056120410539902]
This paper was presented at the EIPC Winter Conference held in Cannes, France, 12-13 February 2004 and is produced here by kind permission of the EIPC. Copies of the conference proceedings are available from the EIPC, contact Sonja Derhaag at E-mail: sderhaag@eipc.org for more details.
Cliff Roseen
A novel method for sequentially-building multi-layer circuits using LCP laminates, cap-layers and bond plys
Keywords
Printed circuits, Laminates, Assembly
Abstract
Development efforts at Rogers are continuing on R/flex liquid crystalline polymer (LCP) materials for printed circuit production. As an extension of our EIPC Spring 2003 paper, work has been completed on a novel method for sequentially building multi-layer circuit boards using our laminates, bond plys and cap layers manufactured from various melt-point LCP dielectric films. This paper discusses the theory and practice of sequentially built multilayers in all-LCP and mixed dielectric constructions, reviews the pertinent processing steps and guidelines necessary for production and subsequent assembly thereafter, and considers some of the application areas that may benefit from this novel fabrication strategy.
The first adoptions of liquid crystalline polymer (LCP) technology have been in the areas of single- and double-sided flexible circuits as well as discreet inner or outer-layers in mixed dielectric multilayer circuits (in combination with common rigid materials such as FR4). Taking up where polyimide film leaves off, LCP can provide flexible designs with high frequency capability and...
