Abrisa Technologies offers Precision XY Saw Cutting services utilizing processes originally developed for semiconductor wafer dicing. The camera assisted  array saw cutting method is ideal when parts are       rectangular and volumes high as well as when parts are small or when parts require XY dimensional tolerances such as 0.025mm with consistent perpendicularity of edges to faces. The process is key when small optical components must be fit/press fit or hermetically sealed and in need of low cosmetic, chip free defects and a near “100%” coated clear aperture for imaging, sensing, laser beam steering, indicators, and sighting.

Edges generated by the saw cutting/dicing process have a ground finish, making them well suited for epoxy bonding. Other features as steps, grooves, channels, or mini mounting “flanges” can also be  generated using the saw cutting process. Popular  materials processed include coated and uncoated glass, glass wafers, filter glass, rods, acrylic and optically bonded structures of 0.2mm to multi mm’s in thickness.

Capabilities:

• Vinylized Diced Patties/Wafer Dicing
• Precision Thin Linear Grooves • Fine Ground Edges & Tight Tolerances
• Low Cosmetic & Chip Defects
• Camera Assisted Array Cutting
• Glass, Acrylic & Bonded Structures
• Edge Printing, Graphics  & Laser Marking 

Ideal for:

• High Volume, Small Part Fabrication
• Filters, Mirrors, Windows, Beam Splitters, Sights • Precision Fit Rectangular Components
• “100%” Clear Aperture Parts
• Wafer or Filter Glass Master Formats 

Abrisa Technologies offers saw cutting on coated & uncoated materials including:  

• Corning® Eagle® XG, SCHOTT D263®-T eco & BOROFLOAT® 33
• Soda Lime Float, Glass Wafers, Filter Glass, Non-Glare Glass
• Coated Stock Sheet Glass Mirrors, Beam Splitters, Display Glass
• Abrisa Technologies Custom Coated Materials or Customer Furnished Material
• Acrylic, Bonded/Laminated Sandwich Assemblies & More 

Camera Assisted Array Cutting: Our saw cutting process is camera assisted and can perform XY array cutting with position registration to within 0.001” (0.25 mm) relative to a corner, edge, fiducial, notch, flat, or other precision locating feature. Camera assist is critical when both part singulation and concurrent channel/groove or step location is key or when coatings, patterns, or other surface treatments are clocked or optically located.