CAMM2 (Compression Attached Memory Module) is the next generation of memory interconnect from Amphenol, a JEDEC standard that comes in several stack heights and pin sizes. CAMM2 uses Amphenol cLGA^® direct-attach compression technology for high-performance and low stack height for today's thin laptops and electronic devices.

• Amphenol cLGA® contact technology is field-proven for over 20 years
• Shunted contact and/or ground shielding in selective configuration technology provides superior SI performance
• Direct attach compression allows field replacement without soldering
• Contacts are self-centering for reliability
• Contact tips are contained in the housing to avoid damage