The SARCON^® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.

SARCON^® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively.

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