Formulated by dissolving PMMA polymer in safe solvents such as anisole, it functions as a high?resolution positive e?beam resist, offering exceptional pattern fidelity, easy processing, and excellent film quality.

Beyond e?beam lithography, PMMA is also used as a protective coating for wafer thinning, a bonding adhesive, and a sacrificial layer, making it a reliable and flexible material for diverse microfabrication workflows.

Copolymer resists are formulated from PMMA blended with ~8.5% methacrylic acid, making them ideal for bi?layer lift?off processes where precise, independent control of CDs and layer profiles is required. Standard formulations use ethyl lactate and are available in a broad range of film thicknesses to support diverse microfabrication workflows. Both PMMA and copolymer resists are offered in package sizes from 500 mL to 20 L, ensuring flexible options for R&D through high?volume production.

Key Features:

• Positive tone
• E-beam and X-ray imageable
• Resist developers and strippers
• Excellent adhesion to most substrates
• Wide range of film thicknesses

Material Uses:

• T-gate fabrication
• Wafer thinning support layers
• Microlens fabrication
• Microfluidics
• LIGA processing
• Nanostructure and nanoscale feature definition