MacDermid Alpha Electronics Solutions will share its advanced metallization expertise at IMPACT Conference 2026 and Tech X Total Solutions during TPCA Show in Taipei, Taiwan.

The company will present four technical papers at IMPACT and two additional presentations at Tech X Total Solutions, addressing manufacturing challenges associated with increasingly complex PCB and IC substrate designs.

Technical topics include next-generation periodic pulse reverse (PPR) copper plating, copper thickness uniformity, advanced via-filling technologies, immersion tin and final finishes, and through-glass via metallization.

These developments are increasingly relevant as artificial intelligence, high-performance computing, and advanced packaging technologies drive demand for finer features, higher interconnect densities, and greater manufacturing precision.

Supporting these technical developments, MacDermid Alpha offers a portfolio of metallization solutions, including:

• PC 710, designed to support copper thickness uniformity and throwing power in advanced HDI applications.

• MacuSpec™ VF-TH 500 and AVF 700, via-filling technologies developed for demanding PCB and substrate manufacturing requirements.

• Shadow® Plus, a graphite-based direct metallization process offering an alternative to traditional electroless copper processes.

MacDermid Alpha's technical specialists will be available at Booth L513 during TPCA Show 2026, October 20–22, to discuss application-specific manufacturing challenges and advanced metallization solutions.